ATE511701T1 - Verfahren zur herstellung einer schottky varicap diode - Google Patents
Verfahren zur herstellung einer schottky varicap diodeInfo
- Publication number
- ATE511701T1 ATE511701T1 AT01909742T AT01909742T ATE511701T1 AT E511701 T1 ATE511701 T1 AT E511701T1 AT 01909742 T AT01909742 T AT 01909742T AT 01909742 T AT01909742 T AT 01909742T AT E511701 T1 ATE511701 T1 AT E511701T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- varicap
- providing
- predetermined
- schottky
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/62—Capacitors having potential barriers
- H10D1/64—Variable-capacitance diodes, e.g. varactors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/01—Manufacture or treatment
- H10D1/045—Manufacture or treatment of capacitors having potential barriers, e.g. varactors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
- H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
- H10D84/617—Combinations of vertical BJTs and only diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/416—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials of highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6316—Formation by nitridation, e.g. nitridation of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6349—Deposition of epitaxial materials
Landscapes
- Electrodes Of Semiconductors (AREA)
- Bipolar Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP00200770 | 2000-03-03 | ||
| PCT/EP2001/001552 WO2001065594A2 (en) | 2000-03-03 | 2001-02-13 | A method of producing a schottky varicap diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE511701T1 true ATE511701T1 (de) | 2011-06-15 |
Family
ID=8171149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01909742T ATE511701T1 (de) | 2000-03-03 | 2001-02-13 | Verfahren zur herstellung einer schottky varicap diode |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6387769B2 (de) |
| EP (1) | EP1214737B1 (de) |
| JP (1) | JP2003526204A (de) |
| KR (1) | KR100699607B1 (de) |
| CN (1) | CN1288726C (de) |
| AT (1) | ATE511701T1 (de) |
| TW (1) | TW507273B (de) |
| WO (1) | WO2001065594A2 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6835977B2 (en) * | 2002-03-05 | 2004-12-28 | United Microelectronics Corp. | Variable capactor structure |
| US7405445B2 (en) * | 2004-06-18 | 2008-07-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method for ESD protection |
| US7135346B2 (en) * | 2004-07-29 | 2006-11-14 | International Business Machines Corporation | Structure for monitoring semiconductor polysilicon gate profile |
| DE102004048607A1 (de) * | 2004-10-06 | 2006-04-13 | Robert Bosch Gmbh | Halbleiterbauelement |
| DE102004060624B4 (de) * | 2004-12-16 | 2010-12-02 | Siltronic Ag | Halbleiterscheibe mit epitaktisch abgeschiedener Schicht und Verfahren zur Herstellung der Halbleiterscheibe |
| US7518215B2 (en) * | 2005-01-06 | 2009-04-14 | International Business Machines Corporation | One mask hyperabrupt junction varactor using a compensated cathode contact |
| US7345866B1 (en) * | 2005-05-13 | 2008-03-18 | Hrl Laboratories, Llc | Continuously tunable RF MEMS capacitor with ultra-wide tuning range |
| US7141989B1 (en) * | 2006-04-10 | 2006-11-28 | Freescale Semiconductor, Inc. | Methods and apparatus for a MEMS varactor |
| US7875950B2 (en) * | 2007-03-08 | 2011-01-25 | Semiconductor Components Industries, Llc | Schottky diode structure with multi-portioned guard ring and method of manufacture |
| RU2447541C1 (ru) * | 2010-12-03 | 2012-04-10 | Федеральное государственное унитарное предприятие "Научно-исследовательский институт микроприборов-К" | Мдп-варикап |
| RU2569906C1 (ru) * | 2014-08-26 | 2015-12-10 | Акционерное общество "Научно-исследовательский институт микроприборов-К" (АО "НИИМП-К") | Многоэлементный мдп варикап |
| RU2614663C1 (ru) * | 2015-12-29 | 2017-03-28 | Общество с ограниченной ответственностью "Лаборатория Микроприборов" | Варикап и способ его изготовления |
| RU180722U1 (ru) * | 2017-11-20 | 2018-06-21 | Акционерное общество "Научно-исследовательский институт полупроводниковых приборов" (АО "НИИПП") | Конструкция варикапа с расширенным контактом |
| FR3098015A1 (fr) * | 2019-06-28 | 2021-01-01 | Stmicroelectronics (Crolles 2) Sas | Procédé de réalisation d’une diode |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4226648A (en) * | 1979-03-16 | 1980-10-07 | Bell Telephone Laboratories, Incorporated | Method of making a hyperabrupt varactor diode utilizing molecular beam epitaxy |
| JP2809826B2 (ja) * | 1990-06-29 | 1998-10-15 | 三菱電機株式会社 | 半導体装置の製造方法 |
| US5109256A (en) * | 1990-08-17 | 1992-04-28 | National Semiconductor Corporation | Schottky barrier diodes and Schottky barrier diode-clamped transistors and method of fabrication |
| US5583348A (en) * | 1991-12-03 | 1996-12-10 | Motorola, Inc. | Method for making a schottky diode that is compatible with high performance transistor structures |
| DE69617628T2 (de) * | 1995-09-18 | 2002-08-14 | Koninklijke Philips Electronics N.V., Eindhoven | Varicapdiode und verfahren zur herstellung |
| JP3355334B2 (ja) * | 1996-02-07 | 2002-12-09 | 株式会社アドバンテスト | 可変容量ダイオードの製造方法 |
| US6228734B1 (en) * | 1999-01-12 | 2001-05-08 | Semiconductor Components Industries Llc | Method of manufacturing a capacitance semi-conductor device |
-
2001
- 2001-02-13 CN CNB018011896A patent/CN1288726C/zh not_active Expired - Lifetime
- 2001-02-13 KR KR1020017013984A patent/KR100699607B1/ko not_active Expired - Lifetime
- 2001-02-13 AT AT01909742T patent/ATE511701T1/de not_active IP Right Cessation
- 2001-02-13 EP EP01909742A patent/EP1214737B1/de not_active Expired - Lifetime
- 2001-02-13 WO PCT/EP2001/001552 patent/WO2001065594A2/en not_active Ceased
- 2001-02-13 JP JP2001564386A patent/JP2003526204A/ja not_active Withdrawn
- 2001-03-01 US US09/797,086 patent/US6387769B2/en not_active Expired - Lifetime
- 2001-05-16 TW TW090111709A patent/TW507273B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003526204A (ja) | 2003-09-02 |
| CN1288726C (zh) | 2006-12-06 |
| US20010031538A1 (en) | 2001-10-18 |
| EP1214737A2 (de) | 2002-06-19 |
| TW507273B (en) | 2002-10-21 |
| US6387769B2 (en) | 2002-05-14 |
| KR20020011400A (ko) | 2002-02-08 |
| CN1372698A (zh) | 2002-10-02 |
| EP1214737B1 (de) | 2011-06-01 |
| WO2001065594A2 (en) | 2001-09-07 |
| KR100699607B1 (ko) | 2007-03-23 |
| WO2001065594A3 (en) | 2002-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |