ATE511701T1 - Verfahren zur herstellung einer schottky varicap diode - Google Patents

Verfahren zur herstellung einer schottky varicap diode

Info

Publication number
ATE511701T1
ATE511701T1 AT01909742T AT01909742T ATE511701T1 AT E511701 T1 ATE511701 T1 AT E511701T1 AT 01909742 T AT01909742 T AT 01909742T AT 01909742 T AT01909742 T AT 01909742T AT E511701 T1 ATE511701 T1 AT E511701T1
Authority
AT
Austria
Prior art keywords
layer
varicap
providing
predetermined
schottky
Prior art date
Application number
AT01909742T
Other languages
English (en)
Inventor
Ronald Dekker
Henricus Maas
Anco Heringa
Holger Schligtenhorst
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE511701T1 publication Critical patent/ATE511701T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/62Capacitors having potential barriers
    • H10D1/64Variable-capacitance diodes, e.g. varactors 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/01Manufacture or treatment
    • H10D1/045Manufacture or treatment of capacitors having potential barriers, e.g. varactors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0112Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/611Combinations of BJTs and one or more of diodes, resistors or capacitors
    • H10D84/613Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
    • H10D84/617Combinations of vertical BJTs and only diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416Nitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/416Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials of highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302Non-deposition formation processes
    • H10P14/6316Formation by nitridation, e.g. nitridation of the substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326Deposition processes
    • H10P14/6349Deposition of epitaxial materials

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
AT01909742T 2000-03-03 2001-02-13 Verfahren zur herstellung einer schottky varicap diode ATE511701T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00200770 2000-03-03
PCT/EP2001/001552 WO2001065594A2 (en) 2000-03-03 2001-02-13 A method of producing a schottky varicap diode

Publications (1)

Publication Number Publication Date
ATE511701T1 true ATE511701T1 (de) 2011-06-15

Family

ID=8171149

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01909742T ATE511701T1 (de) 2000-03-03 2001-02-13 Verfahren zur herstellung einer schottky varicap diode

Country Status (8)

Country Link
US (1) US6387769B2 (de)
EP (1) EP1214737B1 (de)
JP (1) JP2003526204A (de)
KR (1) KR100699607B1 (de)
CN (1) CN1288726C (de)
AT (1) ATE511701T1 (de)
TW (1) TW507273B (de)
WO (1) WO2001065594A2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6835977B2 (en) * 2002-03-05 2004-12-28 United Microelectronics Corp. Variable capactor structure
US7405445B2 (en) * 2004-06-18 2008-07-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure and method for ESD protection
US7135346B2 (en) * 2004-07-29 2006-11-14 International Business Machines Corporation Structure for monitoring semiconductor polysilicon gate profile
DE102004048607A1 (de) * 2004-10-06 2006-04-13 Robert Bosch Gmbh Halbleiterbauelement
DE102004060624B4 (de) * 2004-12-16 2010-12-02 Siltronic Ag Halbleiterscheibe mit epitaktisch abgeschiedener Schicht und Verfahren zur Herstellung der Halbleiterscheibe
US7518215B2 (en) * 2005-01-06 2009-04-14 International Business Machines Corporation One mask hyperabrupt junction varactor using a compensated cathode contact
US7345866B1 (en) * 2005-05-13 2008-03-18 Hrl Laboratories, Llc Continuously tunable RF MEMS capacitor with ultra-wide tuning range
US7141989B1 (en) * 2006-04-10 2006-11-28 Freescale Semiconductor, Inc. Methods and apparatus for a MEMS varactor
US7875950B2 (en) * 2007-03-08 2011-01-25 Semiconductor Components Industries, Llc Schottky diode structure with multi-portioned guard ring and method of manufacture
RU2447541C1 (ru) * 2010-12-03 2012-04-10 Федеральное государственное унитарное предприятие "Научно-исследовательский институт микроприборов-К" Мдп-варикап
RU2569906C1 (ru) * 2014-08-26 2015-12-10 Акционерное общество "Научно-исследовательский институт микроприборов-К" (АО "НИИМП-К") Многоэлементный мдп варикап
RU2614663C1 (ru) * 2015-12-29 2017-03-28 Общество с ограниченной ответственностью "Лаборатория Микроприборов" Варикап и способ его изготовления
RU180722U1 (ru) * 2017-11-20 2018-06-21 Акционерное общество "Научно-исследовательский институт полупроводниковых приборов" (АО "НИИПП") Конструкция варикапа с расширенным контактом
FR3098015A1 (fr) * 2019-06-28 2021-01-01 Stmicroelectronics (Crolles 2) Sas Procédé de réalisation d’une diode

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4226648A (en) * 1979-03-16 1980-10-07 Bell Telephone Laboratories, Incorporated Method of making a hyperabrupt varactor diode utilizing molecular beam epitaxy
JP2809826B2 (ja) * 1990-06-29 1998-10-15 三菱電機株式会社 半導体装置の製造方法
US5109256A (en) * 1990-08-17 1992-04-28 National Semiconductor Corporation Schottky barrier diodes and Schottky barrier diode-clamped transistors and method of fabrication
US5583348A (en) * 1991-12-03 1996-12-10 Motorola, Inc. Method for making a schottky diode that is compatible with high performance transistor structures
DE69617628T2 (de) * 1995-09-18 2002-08-14 Koninklijke Philips Electronics N.V., Eindhoven Varicapdiode und verfahren zur herstellung
JP3355334B2 (ja) * 1996-02-07 2002-12-09 株式会社アドバンテスト 可変容量ダイオードの製造方法
US6228734B1 (en) * 1999-01-12 2001-05-08 Semiconductor Components Industries Llc Method of manufacturing a capacitance semi-conductor device

Also Published As

Publication number Publication date
JP2003526204A (ja) 2003-09-02
CN1288726C (zh) 2006-12-06
US20010031538A1 (en) 2001-10-18
EP1214737A2 (de) 2002-06-19
TW507273B (en) 2002-10-21
US6387769B2 (en) 2002-05-14
KR20020011400A (ko) 2002-02-08
CN1372698A (zh) 2002-10-02
EP1214737B1 (de) 2011-06-01
WO2001065594A2 (en) 2001-09-07
KR100699607B1 (ko) 2007-03-23
WO2001065594A3 (en) 2002-03-14

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