ATE513664T1 - Vorrichtung und verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften - Google Patents

Vorrichtung und verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften

Info

Publication number
ATE513664T1
ATE513664T1 AT06819340T AT06819340T ATE513664T1 AT E513664 T1 ATE513664 T1 AT E513664T1 AT 06819340 T AT06819340 T AT 06819340T AT 06819340 T AT06819340 T AT 06819340T AT E513664 T1 ATE513664 T1 AT E513664T1
Authority
AT
Austria
Prior art keywords
adhesion forces
shaped substrates
separating disk
substrates
industry
Prior art date
Application number
AT06819340T
Other languages
English (en)
Inventor
Wolfgang Coenen
Nils Hendrik Coenen
Original Assignee
Wolfgang Coenen
Nils Hendrik Coenen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE200510053410 external-priority patent/DE102005053410B4/de
Application filed by Wolfgang Coenen, Nils Hendrik Coenen filed Critical Wolfgang Coenen
Application granted granted Critical
Publication of ATE513664T1 publication Critical patent/ATE513664T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT06819340T 2005-11-09 2006-11-08 Vorrichtung und verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften ATE513664T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200510053410 DE102005053410B4 (de) 2005-11-09 2005-11-09 Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
DE200610021647 DE102006021647A1 (de) 2005-11-09 2006-05-09 Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
PCT/EP2006/068253 WO2007054525A1 (de) 2005-11-09 2006-11-08 Verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften

Publications (1)

Publication Number Publication Date
ATE513664T1 true ATE513664T1 (de) 2011-07-15

Family

ID=37709714

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06819340T ATE513664T1 (de) 2005-11-09 2006-11-08 Vorrichtung und verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften

Country Status (6)

Country Link
US (1) US8043890B2 (de)
EP (1) EP1951490B1 (de)
JP (1) JP2009515349A (de)
AT (1) ATE513664T1 (de)
DE (2) DE102006021647A1 (de)
WO (1) WO2007054525A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080146003A1 (en) * 2006-12-19 2008-06-19 Rec Scanwafer As Method and device for separating silicon wafers
GB2465591B (en) * 2008-11-21 2011-12-07 Coreflow Ltd Method and device for separating sliced wafers
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
KR101586984B1 (ko) 2009-02-22 2016-01-20 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 머신을 위한 준비 유닛
WO2011044871A1 (de) 2009-10-13 2011-04-21 Huebel Egon Verfahren und vorrichtung zur substratablösung
US8936994B2 (en) 2011-04-28 2015-01-20 Mapper Lithography Ip B.V. Method of processing a substrate in a lithography system
JP2013004627A (ja) * 2011-06-14 2013-01-07 Shinryo Corp ウエハの分離装置
US20140150244A1 (en) * 2012-11-30 2014-06-05 General Electric Company Adhesive-free carrier assemblies for glass substrates
TWI498990B (zh) * 2012-12-19 2015-09-01 Genesis Photonics Inc 劈裂裝置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596267A (en) 1979-01-12 1980-07-22 Citizen Watch Co Ltd Parts working method
JPS59145034U (ja) * 1983-03-17 1984-09-28 第一精機株式会社 ウエハ−取扱装置
JPS61125767A (ja) 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd ワイヤソ−のウエハ取出方法
JPS63251165A (ja) * 1987-04-01 1988-10-18 Nec Corp 半導体ウエ−ハの保持方法
WO1994001279A1 (en) * 1992-07-08 1994-01-20 Mann George E Adhesion testing
JPH0717628A (ja) * 1993-06-30 1995-01-20 Sumitomo Sitix Corp 薄板搬送方法とその装置
DE4446489C1 (de) * 1994-12-23 1996-05-15 Fraunhofer Ges Forschung Verfahren zum Manipulieren von Mikrobauteilen und Vorrichtung zur Durchführung des Verfahrens
CH691169A5 (fr) 1996-04-16 2001-05-15 Hct Shaping Systems Sa Dispositif pour la mise en élément de stockage de tranches obtenues par découpage d'un bloc.
JPH11156708A (ja) * 1997-11-27 1999-06-15 Speedfam Co Ltd バッキングパッド貼付形成装置
JP3832994B2 (ja) * 1998-06-23 2006-10-11 株式会社日平トヤマ ウエハ分離搬送装置
DE19900671C2 (de) 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung
TW468181B (en) * 1999-02-03 2001-12-11 Origin Electric Manufacturing method and apparatus for optical disc
FR2796491B1 (fr) * 1999-07-12 2001-08-31 Commissariat Energie Atomique Procede de decollement de deux elements et dispositif pour sa mise en oeuvre
DE19950068B4 (de) 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
JP2005019591A (ja) * 2003-06-25 2005-01-20 Central Glass Co Ltd 吸着パッドよりガラス基板を剥離する方法
DE10359732A1 (de) 2003-12-19 2005-07-14 Leica Microsystems Semiconductor Gmbh Substratträger zur Aufnahme und Lagerfixierung eines flächigen Körpers
EP1730737B1 (de) * 2004-03-22 2013-01-16 Singulus Technologies AG Verfahren und vorrichtung zum trennen scheibenförmiger substrate

Also Published As

Publication number Publication date
DE102006021647A1 (de) 2007-11-15
WO2007054525A1 (de) 2007-05-18
US8043890B2 (en) 2011-10-25
JP2009515349A (ja) 2009-04-09
EP1951490A1 (de) 2008-08-06
DE202006020827U1 (de) 2010-08-26
US20080286947A1 (en) 2008-11-20
EP1951490B1 (de) 2011-06-22

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