ATE518412T1 - System und verfahren zur herstellung von flexiblen kupferkaschierten folienlaminat - Google Patents

System und verfahren zur herstellung von flexiblen kupferkaschierten folienlaminat

Info

Publication number
ATE518412T1
ATE518412T1 AT05024159T AT05024159T ATE518412T1 AT E518412 T1 ATE518412 T1 AT E518412T1 AT 05024159 T AT05024159 T AT 05024159T AT 05024159 T AT05024159 T AT 05024159T AT E518412 T1 ATE518412 T1 AT E518412T1
Authority
AT
Austria
Prior art keywords
film
copper
plating
antirust
flexible copper
Prior art date
Application number
AT05024159T
Other languages
English (en)
Inventor
Hong Kee Lee
Seong-Ho Son
Seok Bon Koo
Original Assignee
Korean Inst Of Ind Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korean Inst Of Ind Technology filed Critical Korean Inst Of Ind Technology
Application granted granted Critical
Publication of ATE518412T1 publication Critical patent/ATE518412T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
AT05024159T 2005-08-03 2005-11-05 System und verfahren zur herstellung von flexiblen kupferkaschierten folienlaminat ATE518412T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050070844A KR100661456B1 (ko) 2005-08-03 2005-08-03 Ｆｃｃｌ 필름 제조 장치 및 ｆｃｃｌ 필름 제조 방법

Publications (1)

Publication Number Publication Date
ATE518412T1 true ATE518412T1 (de) 2011-08-15

Family

ID=36803449

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05024159T ATE518412T1 (de) 2005-08-03 2005-11-05 System und verfahren zur herstellung von flexiblen kupferkaschierten folienlaminat

Country Status (5)

Country Link
US (1) US7678242B2 (de)
EP (1) EP1750491B9 (de)
JP (1) JP2007039783A (de)
KR (1) KR100661456B1 (de)
AT (1) ATE518412T1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5021538B2 (ja) * 2008-03-26 2012-09-12 日本電信電話株式会社 金属構造体の形成方法
CN102851716B (zh) * 2011-06-29 2016-03-09 鼎展电子股份有限公司 挠性覆铜板电镀装置
JP5673582B2 (ja) * 2012-02-29 2015-02-18 住友金属鉱山株式会社 電気めっきの前処理方法及び該前処理方法を含んだ電気めっき方法による銅張積層樹脂フィルムの製造方法
CN102732874B (zh) * 2012-06-28 2014-04-16 中宇建材集团有限公司 铜制品表面处理流水线
CA2957522A1 (en) * 2014-08-07 2016-02-11 Henkel Ag & Co. Kgaa Apparatus for electroceramic coating of high tension cable wire
KR102029139B1 (ko) * 2015-11-09 2019-10-07 케이씨에프테크놀로지스 주식회사 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
JP6740629B2 (ja) * 2016-02-15 2020-08-19 東レ株式会社 ポリマーフィルム製造装置
JP7009815B2 (ja) * 2017-07-27 2022-02-10 東レ株式会社 フィルムの薬液処理方法および薬液処理装置、ならびにイオン交換膜の製造方法および製造装置
CN110552053B (zh) * 2019-10-18 2024-06-11 广东坤川实业有限公司 一种自动内循环和流量控制的水镀装置
CN115674858B (zh) * 2022-11-22 2023-06-20 浙江松发复合新材料有限公司 一种不锈钢覆铜板带轧制加工设备及方法

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US4175018A (en) * 1977-01-19 1979-11-20 Ppg Industries, Inc. Method of electrocoating
JPS54145965A (en) * 1978-05-08 1979-11-14 Nippon Mining Co Method of and apparatus for producing board for printed circuit
US4183799A (en) * 1978-08-31 1980-01-15 Production Machinery Corporation Apparatus for plating a layer onto a metal strip
US4351713A (en) * 1979-08-22 1982-09-28 Thomas Steel Strip Corp. Electro-co-deposition of corrosion resistant nickel/zinc alloys onto steel substrates
DE3034670C2 (de) * 1980-09-13 1983-02-24 M.A.N.- Roland Druckmaschinen AG, 6050 Offenbach Papierführung für eine Rollen-Rotationsdruckmaschine
US4677002A (en) * 1984-08-03 1987-06-30 Poterala Robert J Apparatus and method for uniformly coating an irregular web
JPH01302250A (ja) * 1988-05-30 1989-12-06 Minolta Camera Co Ltd 現像機
US5181770A (en) * 1989-04-19 1993-01-26 Olin Corporation Surface topography optimization through control of chloride concentration in electroformed copper foil
JPH04224700A (ja) * 1990-12-26 1992-08-13 Nkk Corp 電解表面処理装置
US5804466A (en) * 1996-03-06 1998-09-08 Canon Kabushiki Kaisha Process for production of zinc oxide thin film, and process for production of semiconductor device substrate and process for production of photoelectric conversion device using the same film
US5755935A (en) * 1996-03-07 1998-05-26 Jackson; Dale Processing system
US5776327A (en) * 1996-10-16 1998-07-07 Mitsubishi Semiconuctor Americe, Inc. Method and apparatus using an anode basket for electroplating a workpiece
KR20000075321A (ko) * 1999-05-31 2000-12-15 윤영신 금속 박판의 후처리장치
JP3306404B2 (ja) 2000-01-28 2002-07-24 三井金属鉱業株式会社 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板
CN1316066C (zh) * 2002-06-04 2007-05-16 三井金属矿业株式会社 用于低介电基片的表面处理铜箔和包铜层压板和使用这些材料的印刷电路板
WO2003106740A1 (ja) * 2002-06-17 2003-12-24 東レ株式会社 めっき被膜付きフィルムの製造方法、めっき用 陰極ロール、ならびに、回路基板の製造方法
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KR20050119919A (ko) * 2004-06-17 2005-12-22 주식회사 티케이씨 구리 도금장치의 전처리 장치

Also Published As

Publication number Publication date
US20070032080A1 (en) 2007-02-08
US7678242B2 (en) 2010-03-16
EP1750491B9 (de) 2012-03-21
KR100661456B1 (ko) 2006-12-27
JP2007039783A (ja) 2007-02-15
EP1750491A2 (de) 2007-02-07
EP1750491A3 (de) 2008-08-20
EP1750491B1 (de) 2011-07-27

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