ATE522313T1 - Laserstrahlbearbeitungssystem - Google Patents

Laserstrahlbearbeitungssystem

Info

Publication number
ATE522313T1
ATE522313T1 AT04806951T AT04806951T ATE522313T1 AT E522313 T1 ATE522313 T1 AT E522313T1 AT 04806951 T AT04806951 T AT 04806951T AT 04806951 T AT04806951 T AT 04806951T AT E522313 T1 ATE522313 T1 AT E522313T1
Authority
AT
Austria
Prior art keywords
laser beam
processing
objective lens
laser
main surface
Prior art date
Application number
AT04806951T
Other languages
English (en)
Inventor
Norio Kurita
Tetsuya Osajima
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Application granted granted Critical
Publication of ATE522313T1 publication Critical patent/ATE522313T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
AT04806951T 2004-01-13 2004-12-13 Laserstrahlbearbeitungssystem ATE522313T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004005831A JP3708104B2 (ja) 2004-01-13 2004-01-13 レーザ加工方法及びレーザ加工装置
PCT/JP2004/018590 WO2005068126A1 (ja) 2004-01-13 2004-12-13 レーザ加工装置

Publications (1)

Publication Number Publication Date
ATE522313T1 true ATE522313T1 (de) 2011-09-15

Family

ID=34792115

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04806951T ATE522313T1 (de) 2004-01-13 2004-12-13 Laserstrahlbearbeitungssystem

Country Status (9)

Country Link
US (1) US7595895B2 (de)
EP (1) EP1716961B1 (de)
JP (1) JP3708104B2 (de)
KR (1) KR101119377B1 (de)
CN (1) CN1902026B (de)
AT (1) ATE522313T1 (de)
MY (1) MY139787A (de)
TW (1) TWI343291B (de)
WO (1) WO2005068126A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3708102B2 (ja) * 2003-12-12 2005-10-19 浜松ホトニクス株式会社 レーザ加工装置
JP4509578B2 (ja) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4601965B2 (ja) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4964554B2 (ja) 2006-10-03 2012-07-04 浜松ホトニクス株式会社 レーザ加工方法
KR100761238B1 (ko) * 2007-03-13 2007-09-27 에스엔유 프리시젼 주식회사 레이저빔 가공장치
DE102007016444B4 (de) * 2007-04-05 2024-08-22 Precitec Optronik Gmbh Bearbeitungseinrichtung
KR101770836B1 (ko) 2009-08-11 2017-08-23 하마마츠 포토닉스 가부시키가이샤 레이저 가공장치 및 레이저 가공방법
EP2336823A1 (de) * 2009-12-18 2011-06-22 Boegli-Gravures S.A. Verfahren und Vorrichtung zur Herstellung von Masken für eine Laseranlage zur Erzeugung von Mikrostrukturen.
EP2772922B1 (de) * 2011-10-25 2017-10-11 Eisuke Minehara Laserdekontaminationsvorrichtung
JP2013230478A (ja) * 2012-04-27 2013-11-14 Disco Corp レーザー加工装置及びレーザー加工方法
JP6299111B2 (ja) * 2013-08-28 2018-03-28 オムロン株式会社 レーザ加工装置
JP6604891B2 (ja) * 2016-04-06 2019-11-13 株式会社ディスコ ウエーハの生成方法
CN107243702B (zh) * 2017-08-16 2019-11-12 哈尔滨理工大学 一种基于微织构刀具制备的精准激光辅助对焦装置
US20230234170A1 (en) * 2020-06-03 2023-07-27 Fanuc Corporation Laser device
DE102020211533B3 (de) * 2020-09-15 2022-02-03 Volkswagen Aktiengesellschaft Messinstrument für ein Laserwerkzeug, Laserwerkzeug und Werkstückbearbeitungsvorrichtung sowie Verfahren zum Messen eines Abstands
DE102022109318A1 (de) * 2022-04-14 2023-10-19 4Jet Microtech Gmbh Laserbearbeitungsvorrichtung

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2236846B (en) 1988-11-22 1992-10-14 Fiat Auto Spa Laser welding monitoring systems.
US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
US5042950A (en) * 1990-05-22 1991-08-27 The United States Of America As Represented By The United States Department Of Energy Apparatus and method for laser beam diagnosis
JPH04244910A (ja) 1991-01-31 1992-09-01 Nec Corp 高さ検出装置
US5241419A (en) * 1992-01-27 1993-08-31 General Electric Company Co-axial viewing device for lasers
EP0554523B1 (de) * 1992-02-03 1997-04-16 Matsushita Electric Industrial Co., Ltd. Laserbearbeitungsvorrichtung und Verfahren zum Einstellen der Höhe des Kondensor
US5268554A (en) * 1992-06-29 1993-12-07 General Electric Co. Apparatus and system for positioning a laser beam
US5382770A (en) * 1993-01-14 1995-01-17 Reliant Laser Corporation Mirror-based laser-processing system with visual tracking and position control of a moving laser spot
JPH06254691A (ja) * 1993-03-08 1994-09-13 Mitsubishi Electric Corp レーザ加工機およびレーザ加工機の焦点設定方法
JPH06344167A (ja) 1993-06-07 1994-12-20 Toshiba Corp レーザ加工装置
US5744780A (en) * 1995-09-05 1998-04-28 The United States Of America As Represented By The United States Department Of Energy Apparatus for precision micromachining with lasers
JPH1128900A (ja) * 1997-05-12 1999-02-02 Sumitomo Heavy Ind Ltd レーザ光を用いた塗装除去方法及びレーザ処理装置
WO1999021181A1 (en) * 1997-10-16 1999-04-29 Seiko Epson Corporation Recorder
JP3152206B2 (ja) 1998-06-19 2001-04-03 日本電気株式会社 オートフォーカス装置及びオートフォーカス方法
JP4273542B2 (ja) 1998-09-08 2009-06-03 トヨタ自動車株式会社 レーザー溶接方法
JP2002219591A (ja) 2001-01-22 2002-08-06 Toshiba Corp レーザ光照射装置
JP2003225786A (ja) 2002-01-30 2003-08-12 Uht Corp レーザー加工ユニット及び該レーザー加工ユニットを備えた加工装置
JP2004188422A (ja) 2002-12-06 2004-07-08 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
JP2004337902A (ja) * 2003-05-14 2004-12-02 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
JP2004337903A (ja) 2003-05-14 2004-12-02 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
EP1716961A4 (de) 2008-08-13
MY139787A (en) 2009-10-30
JP3708104B2 (ja) 2005-10-19
US7595895B2 (en) 2009-09-29
CN1902026B (zh) 2010-04-28
EP1716961A1 (de) 2006-11-02
US20080212063A1 (en) 2008-09-04
EP1716961B1 (de) 2011-08-31
TW200533452A (en) 2005-10-16
TWI343291B (en) 2011-06-11
KR101119377B1 (ko) 2012-03-06
CN1902026A (zh) 2007-01-24
JP2005199285A (ja) 2005-07-28
WO2005068126A1 (ja) 2005-07-28
KR20060130652A (ko) 2006-12-19

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Legal Events

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