ATE528794T1 - Verfahren zur herstellung von lokalisierten geoi- strukturen, die durch germanium-anreicherung erhalten werden - Google Patents

Verfahren zur herstellung von lokalisierten geoi- strukturen, die durch germanium-anreicherung erhalten werden

Info

Publication number
ATE528794T1
ATE528794T1 AT09168024T AT09168024T ATE528794T1 AT E528794 T1 ATE528794 T1 AT E528794T1 AT 09168024 T AT09168024 T AT 09168024T AT 09168024 T AT09168024 T AT 09168024T AT E528794 T1 ATE528794 T1 AT E528794T1
Authority
AT
Austria
Prior art keywords
layer
sige
germanium
silicon
forming
Prior art date
Application number
AT09168024T
Other languages
English (en)
Inventor
Jean-Francois Damlencourt
Benjamin Vincent
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE528794T1 publication Critical patent/ATE528794T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/665—Porous materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/751—Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01356—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being a Group IV material and not being silicon, e.g. Ge, SiGe or SiGeC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
    • H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6322—Formation by thermal treatments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers

Landscapes

  • Element Separation (AREA)
  • Recrystallisation Techniques (AREA)
  • Silicon Compounds (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Thin Film Transistor (AREA)
AT09168024T 2008-08-22 2009-08-18 Verfahren zur herstellung von lokalisierten geoi- strukturen, die durch germanium-anreicherung erhalten werden ATE528794T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0855671A FR2935194B1 (fr) 2008-08-22 2008-08-22 Procede de realisation de structures geoi localisees, obtenues par enrichissement en germanium

Publications (1)

Publication Number Publication Date
ATE528794T1 true ATE528794T1 (de) 2011-10-15

Family

ID=40451252

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09168024T ATE528794T1 (de) 2008-08-22 2009-08-18 Verfahren zur herstellung von lokalisierten geoi- strukturen, die durch germanium-anreicherung erhalten werden

Country Status (5)

Country Link
US (1) US9040391B2 (de)
EP (1) EP2157603B1 (de)
JP (1) JP2010050459A (de)
AT (1) ATE528794T1 (de)
FR (1) FR2935194B1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102184940B (zh) 2011-03-30 2014-01-08 清华大学 半导体结构及其形成方法
JP2014187259A (ja) 2013-03-25 2014-10-02 Toshiba Corp 半導体装置の製造方法
US9406508B2 (en) * 2013-10-31 2016-08-02 Samsung Electronics Co., Ltd. Methods of forming a semiconductor layer including germanium with low defectivity
CN104733320B (zh) * 2013-12-24 2018-01-30 中芯国际集成电路制造(上海)有限公司 场效应晶体管及其制备方法
FR3030882B1 (fr) 2014-12-22 2018-03-09 Commissariat A L'energie Atomique Et Aux Energies Alternatives Circuit integre comportant des transistors pmos a tensions de seuil distinctes
US9698224B2 (en) 2015-06-19 2017-07-04 International Business Machines Corporation Silicon germanium fin formation via condensation
US10600638B2 (en) 2016-10-24 2020-03-24 International Business Machines Corporation Nanosheet transistors with sharp junctions
CN107359203A (zh) * 2017-05-12 2017-11-17 惠科股份有限公司 显示面板和显示装置
US10147820B1 (en) 2017-07-26 2018-12-04 International Business Machines Corporation Germanium condensation for replacement metal gate devices with silicon germanium channel
US10690853B2 (en) 2018-06-25 2020-06-23 International Business Machines Corporation Optoelectronics integration using semiconductor on insulator substrate
US10699967B2 (en) 2018-06-28 2020-06-30 International Business Machines Corporation Co-integration of high carrier mobility PFET and NFET devices on the same substrate using low temperature condensation
FR3088481B1 (fr) * 2018-11-14 2024-06-07 Commissariat Energie Atomique Procede de fabrication d’un transistor a effet de champ a jonction alignee avec des espaceurs
CN117672853A (zh) * 2022-08-25 2024-03-08 上海华力集成电路制造有限公司 SiGe沟道的形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3547419B2 (ja) * 2001-03-13 2004-07-28 株式会社東芝 半導体装置及びその製造方法
US7125458B2 (en) * 2003-09-12 2006-10-24 International Business Machines Corporation Formation of a silicon germanium-on-insulator structure by oxidation of a buried porous silicon layer
US20050221591A1 (en) * 2004-04-06 2005-10-06 International Business Machines Corporation Method of forming high-quality relaxed SiGe alloy layers on bulk Si substrates
US7141115B2 (en) * 2004-09-02 2006-11-28 International Business Machines Corporation Method of producing silicon-germanium-on-insulator material using unstrained Ge-containing source layers
US7550309B2 (en) * 2004-09-24 2009-06-23 Shin-Etsu Handotai Co., Ltd. Method for producing semiconductor wafer
FR2898215B1 (fr) * 2006-03-01 2008-05-16 Commissariat Energie Atomique Procede de fabrication d'un substrat par condensation germanium
FR2902234B1 (fr) 2006-06-12 2008-10-10 Commissariat Energie Atomique PROCEDE DE REALISATION DE ZONES A BASE DE Si1-yGey DE DIFFERENTES TENEURS EN Ge SUR UN MEME SUBSTRAT PAR CONDENSATION DE GERMANIUM

Also Published As

Publication number Publication date
FR2935194B1 (fr) 2010-10-08
EP2157603B1 (de) 2011-10-12
EP2157603A1 (de) 2010-02-24
JP2010050459A (ja) 2010-03-04
FR2935194A1 (fr) 2010-02-26
US9040391B2 (en) 2015-05-26
US20100044836A1 (en) 2010-02-25

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