ATE528976T1 - Jetting-einrichtung und verfahren in einer jetting-einrichtung - Google Patents

Jetting-einrichtung und verfahren in einer jetting-einrichtung

Info

Publication number
ATE528976T1
ATE528976T1 AT03733781T AT03733781T ATE528976T1 AT E528976 T1 ATE528976 T1 AT E528976T1 AT 03733781 T AT03733781 T AT 03733781T AT 03733781 T AT03733781 T AT 03733781T AT E528976 T1 ATE528976 T1 AT E528976T1
Authority
AT
Austria
Prior art keywords
viscous medium
droplets
jetting
adjusted
nozzle
Prior art date
Application number
AT03733781T
Other languages
English (en)
Inventor
William Holm
Kenth Nilsson
Johan Berg
Johan Kronstedt
Hakan Sandell
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Application granted granted Critical
Publication of ATE528976T1 publication Critical patent/ATE528976T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Percussion Or Vibration Massage (AREA)
  • Treatment Of Fiber Materials (AREA)
AT03733781T 2002-07-18 2003-06-23 Jetting-einrichtung und verfahren in einer jetting-einrichtung ATE528976T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0202247A SE0202247D0 (sv) 2002-07-18 2002-07-18 Jetting device and method at a jetting device
PCT/SE2003/001063 WO2004010753A1 (en) 2002-07-18 2003-06-23 Jetting device and method at a jetting device

Publications (1)

Publication Number Publication Date
ATE528976T1 true ATE528976T1 (de) 2011-10-15

Family

ID=20288567

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03733781T ATE528976T1 (de) 2002-07-18 2003-06-23 Jetting-einrichtung und verfahren in einer jetting-einrichtung

Country Status (9)

Country Link
US (2) US7767266B2 (de)
EP (1) EP1552731B1 (de)
JP (1) JP4675105B2 (de)
KR (1) KR101065566B1 (de)
CN (1) CN100441070C (de)
AT (1) ATE528976T1 (de)
AU (1) AU2003239066A1 (de)
SE (1) SE0202247D0 (de)
WO (1) WO2004010753A1 (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1952099A1 (de) 2005-11-14 2008-08-06 Mydata Automation AB Jetting-vorrichtung und verfahren zum verbessern der leistungsfähigkeit einer jetting-vorrichtung
US20070145164A1 (en) * 2005-12-22 2007-06-28 Nordson Corporation Jetting dispenser with multiple jetting nozzle outlets
US7980197B2 (en) * 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
WO2008108097A1 (ja) * 2007-03-08 2008-09-12 Musashi Engineering, Inc. 液滴吐出装置および方法
GB0809876D0 (en) * 2008-05-30 2008-07-09 The Technology Partnership Plc Spray generator
US8757511B2 (en) 2010-01-11 2014-06-24 AdvanJet Viscous non-contact jetting method and apparatus
CN101811585B (zh) * 2010-03-19 2011-08-17 天津群创科技发展有限公司 锡膏自动供给装置
JP5553795B2 (ja) * 2010-05-21 2014-07-16 Ｔｄｋ株式会社 液体滴下装置
US8820871B2 (en) * 2010-10-27 2014-09-02 Matthews Resources, Inc. Valve jet printer with inert plunger tip
JP5779353B2 (ja) * 2011-01-19 2015-09-16 武蔵エンジニアリング株式会社 液体材料の塗布方法、塗布装置およびプログラム
US9346075B2 (en) 2011-08-26 2016-05-24 Nordson Corporation Modular jetting devices
US8708246B2 (en) 2011-10-28 2014-04-29 Nordson Corporation Positive displacement dispenser and method for dispensing discrete amounts of liquid
US9254642B2 (en) 2012-01-19 2016-02-09 AdvanJet Control method and apparatus for dispensing high-quality drops of high-viscosity material
CN102848042A (zh) * 2012-07-25 2013-01-02 昆山微容电子企业有限公司 安规陶瓷电容器引线粘锡装置
DE102012109124A1 (de) 2012-09-27 2014-03-27 Vermes Microdispensing GmbH Dosiersystem, Dosierverfahren und Herstellungsverfahren
DE102012109123A1 (de) 2012-09-27 2014-03-27 Vermes Microdispensing GmbH Dosiersystem, Dosierverfahren und Herstellungsverfahren
GB201222620D0 (en) * 2012-12-14 2013-01-30 Conpart As Method of applying a conductive adhesive
EP2974566B1 (de) * 2013-03-13 2018-05-09 Mycronic AB Verfahren und vorrichtung zur erzeugung eines tröpfchenstrahls
CN105189004B (zh) * 2013-03-13 2018-01-05 麦克罗尼克迈达塔有限责任公司 将粘性介质喷射在工件上的方法
US9398697B2 (en) * 2013-03-13 2016-07-19 Mycronic AB Methods and devices for jetting viscous medium on workpiece
DE202013101134U1 (de) 2013-03-15 2014-06-17 Vermes Microdispensing GmbH Dosierventil
KR102273617B1 (ko) * 2013-03-15 2021-07-05 마이크로닉 아베 워크피스 상에 점성 매체를 분사하기 위한 장치 및 방법
DE102013102693A1 (de) 2013-03-15 2014-09-18 Vermes Microdispensing GmbH Dosierventil und Dosierverfahren
EP3151739B1 (de) * 2014-06-04 2020-01-22 Boston Scientific Scimed, Inc. Druckmessungsführungsdrahtsysteme mit reduzierten druckoffsets
WO2016032746A1 (en) 2014-08-28 2016-03-03 Nordson Corporation Non-impact jetting dispensing module and method
KR20170092529A (ko) * 2014-09-09 2017-08-11 마이크로닉 아베 솔더 페이스트 플럭스를 도포하기 위한 방법 및 디바이스
EP3466221B1 (de) * 2016-05-26 2021-06-30 Mycronic AB Verfahren und vorrichtung zur kontrollierung von strahlabgabe durch wegmessen
JP6935688B2 (ja) * 2017-06-29 2021-09-15 セイコーエプソン株式会社 液体吐出装置および液体吐出方法
TWI748116B (zh) * 2017-08-08 2021-12-01 美商伊利諾工具工程公司 錫膏噴嘴、工作臺和加錫膏裝置
CN107716195A (zh) * 2017-10-27 2018-02-23 肇庆市高新区晓靖科技有限公司 一种超声雾化喷枪
US12214447B2 (en) * 2017-11-28 2025-02-04 Nordson Corporation Synchronous motion selective soldering apparatus and method
US20190366460A1 (en) * 2018-06-01 2019-12-05 Progress Y&Y Corp. Soldering apparatus and solder nozzle module thereof
WO2020126874A1 (en) * 2018-12-21 2020-06-25 Mycronic AB Method for controlling an ejector, and related system
CN113906834B (zh) 2019-05-01 2024-09-13 Io技术集团公司 用以使用3d印刷电连接芯片与顶部连接器的方法
CN112387548A (zh) * 2019-11-21 2021-02-23 绍兴市秀臻新能源科技有限公司 一种自动固定的蓄电池极板涂膏装置及其使用方法
CN114945429B (zh) * 2020-01-28 2024-09-03 迈康尼股份公司 具有柔性喷嘴的喷射装置
US11446750B2 (en) 2020-02-03 2022-09-20 Io Tech Group Ltd. Systems for printing solder paste and other viscous materials at high resolution
US11622451B2 (en) 2020-02-26 2023-04-04 Io Tech Group Ltd. Systems and methods for solder paste printing on components
CN111359843B (zh) * 2020-04-14 2021-08-13 姜伟 一种光学数位转换器点胶装置
US11497124B2 (en) 2020-06-09 2022-11-08 Io Tech Group Ltd. Methods for printing conformal materials on component edges at high resolution
US11691332B2 (en) 2020-08-05 2023-07-04 Io Tech Group Ltd. Systems and methods for 3D printing with vacuum assisted laser printing machine
EP4197786B1 (de) * 2021-12-16 2025-03-12 Quantica GmbH Verfahren und system für selbstwartung und rueckgewinnungssystem für einen druckkopf
CN115228692A (zh) * 2022-08-26 2022-10-25 东莞市昌泰精密技术有限公司 一种螺杆式的点胶装置
JP2025102351A (ja) 2023-12-26 2025-07-08 パナソニックＩｐマネジメント株式会社 液滴吐出装置

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266232A (en) 1979-06-29 1981-05-05 International Business Machines Corporation Voltage modulated drop-on-demand ink jet method and apparatus
US4721252A (en) * 1985-02-22 1988-01-26 Slautterback Corporation Hot-melt sputtering apparatus
JPH0449108A (ja) * 1990-06-18 1992-02-18 Iwashita Eng Kk スクリュー式吐出装置
US5229016A (en) * 1991-08-08 1993-07-20 Microfab Technologies, Inc. Method and apparatus for dispensing spherical-shaped quantities of liquid solder
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
JPH06174399A (ja) * 1991-12-27 1994-06-24 Nippon Oil & Fats Co Ltd 爆薬装填装置
US5581286A (en) 1991-12-31 1996-12-03 Compaq Computer Corporation Multi-channel array actuation system for an ink jet printhead
US5267986A (en) * 1992-04-06 1993-12-07 Self-Instill & Co., Inc. Cartridge for applying medicament to an eye from a dispenser
US5495270A (en) 1993-07-30 1996-02-27 Tektronix, Inc. Method and apparatus for producing dot size modulated ink jet printing
GB9322203D0 (en) 1993-10-28 1993-12-15 Xaar Ltd Droplet deposition apparatus
DE59609491D1 (de) * 1995-07-01 2002-08-29 Esec Trading Sa Formstempel zum Austragen von flüssigem Lot
US5938102A (en) * 1995-09-25 1999-08-17 Muntz; Eric Phillip High speed jet soldering system
US5747102A (en) 1995-11-16 1998-05-05 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
JPH09181434A (ja) * 1995-12-21 1997-07-11 M & M Prod Kk クリーム半田塗布装置
US6015083A (en) * 1995-12-29 2000-01-18 Microfab Technologies, Inc. Direct solder bumping of hard to solder substrate
US5756155A (en) * 1996-01-22 1998-05-26 Taiwan Semiconductor Manufacturing Company, Ltd. Combination nozzle and vacuum hood that is self cleaning
JP3289624B2 (ja) 1996-11-25 2002-06-10 ミノルタ株式会社 インクジェットヘッドの駆動装置
US5876615A (en) 1997-01-02 1999-03-02 Hewlett-Packard Company Molten solder drop ejector
US6020905A (en) 1997-01-24 2000-02-01 Lexmark International, Inc. Ink jet printhead for drop size modulation
JPH1128410A (ja) * 1997-07-14 1999-02-02 Meruto Giken Kk ホットメルト接着剤の溶融供給装置
US6029896A (en) 1997-09-30 2000-02-29 Microfab Technologies, Inc. Method of drop size modulation with extended transition time waveform
SE513527C2 (sv) 1998-06-11 2000-09-25 Mydata Automation Ab Anordning och förfarande för utskjutning av små droppar
US6305773B1 (en) 1998-07-29 2001-10-23 Xerox Corporation Apparatus and method for drop size modulated ink jet printing
JP4142800B2 (ja) * 1999-04-07 2008-09-03 株式会社ルネサステクノロジ バンプ形成装置及びバンプ形成方法
SE9901253D0 (sv) 1999-04-08 1999-04-08 Mydata Automation Ab Dispensing assembly
US6589791B1 (en) * 1999-05-20 2003-07-08 Cartesian Technologies, Inc. State-variable control system
JP2001046940A (ja) 1999-08-06 2001-02-20 Juki Corp 塗布装置
JP2001113212A (ja) * 1999-10-20 2001-04-24 Noiberuku Kk 液体吐出装置
US6629739B2 (en) 1999-12-17 2003-10-07 Xerox Corporation Apparatus and method for drop size switching in ink jet printing
JP2001217529A (ja) * 2000-02-04 2001-08-10 Osaka Asahi Kagaku Kk 電気的噴射制御方式によるフラックスの塗布方法と半田付け方法
US6520402B2 (en) * 2000-05-22 2003-02-18 The Regents Of The University Of California High-speed direct writing with metallic microspheres
JP2002021715A (ja) * 2000-07-10 2002-01-23 Matsushita Electric Ind Co Ltd 流体供給装置及び流体供給方法
SE0003647D0 (sv) * 2000-10-09 2000-10-09 Mydata Automation Ab Method, apparatus and use
JP4681126B2 (ja) * 2000-12-13 2011-05-11 富士機械製造株式会社 高粘性流体塗布装置
SE0101503D0 (sv) * 2001-04-27 2001-04-27 Mydata Automation Ab Method device and use of the device
JP4136477B2 (ja) * 2001-06-16 2008-08-20 武蔵エンジニアリング株式会社 液体の定量吐出装置
SE0104210D0 (sv) 2001-12-14 2001-12-14 Mydata Automation Ab Viscous medium feeder
JP3979353B2 (ja) * 2002-08-02 2007-09-19 セイコーエプソン株式会社 塗布方法
SE0302985D0 (sv) * 2003-11-13 2003-11-13 Mydata Automation Ab A method for generating a jetting program

Also Published As

Publication number Publication date
EP1552731B1 (de) 2011-10-12
US20050167519A1 (en) 2005-08-04
WO2004010753A1 (en) 2004-01-29
AU2003239066A1 (en) 2004-02-09
US8215535B2 (en) 2012-07-10
US7767266B2 (en) 2010-08-03
CN1669373A (zh) 2005-09-14
US20110017841A1 (en) 2011-01-27
KR101065566B1 (ko) 2011-09-19
SE0202247D0 (sv) 2002-07-18
JP2005532906A (ja) 2005-11-04
JP4675105B2 (ja) 2011-04-20
CN100441070C (zh) 2008-12-03
EP1552731A1 (de) 2005-07-13
KR20050019874A (ko) 2005-03-03

Similar Documents

Publication Publication Date Title
ATE528976T1 (de) Jetting-einrichtung und verfahren in einer jetting-einrichtung
SE9802079D0 (sv) Device and method for jetting small droplets
AU2002346740A1 (en) Interchangeable microdeposition head apparatus and method
EP1081998A3 (de) Bauteilen-bestückungsverfahren und Einrichtung
US5669971A (en) Selective coating apparatus
WO2008052116A3 (en) Dispensing method for variable line volume
DE60107116D1 (de) Verfahren und vorrichtung für tintenstrahldruck mit uv-strahlungshärtbarer tinte
DE60008814D1 (de) Schnelltrocknende Tintenstrahl-Tintenzusammensetzungen zum Abdichten von Tintenstrahldruckerdüsen
DE59907645D1 (de) Pulver-sprühbeschichtungsvorrichtung
WO2011116093A3 (en) Solder return for wave solder nozzle
CA2928888C (en) Production of polymeric particles and rough coatings by means of ink jet printing
DE59304489D1 (de) Verfahren zum verlöten von leiterplatten unter niederdruck
TW200519418A (en) Method and device for painting liquid droplet, device and electronic equipment
DE602004022816D1 (de) Palladium komplexe für den druck von leiterkarten
TW200624179A (en) Slit coater having pre-applying unit and coating method using the same
GB0416900D0 (en) Curtain coating process using a high solids content composition
ATE101071T1 (de) Vorrichtung zum aufbringen von loetpaste,klebstoff oder dergleichen auf einem substrat.
DE50307530D1 (de) Verfahren und vorrichtung zur beschichtung von leiterplatten mit laser-strukturierbaren, thermisch härtbaren lötstopplacken sowie galvanoresisten
WO2004049466A3 (en) Droplet - deposition related methods and apparatus
TW200709944A (en) Liquid droplet ejection apparatus, electro-optic panel, and electronic device
TW200611773A (en) A method and system for laser drilling hole on a felxible printed circuit board
GB2371006B (en) Nozzle for soldering apparatus
CN201483120U (zh) 波峰焊助焊剂喷雾系统
DK1496735T3 (da) Apparat til tilförsel af fodertilsætning og fremgangsmåde
JP2004006510A5 (de)

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties