ATE530940T1 - Herstellungsverfahren und struktur eines moduls auf waferebene - Google Patents

Herstellungsverfahren und struktur eines moduls auf waferebene

Info

Publication number
ATE530940T1
ATE530940T1 AT10152636T AT10152636T ATE530940T1 AT E530940 T1 ATE530940 T1 AT E530940T1 AT 10152636 T AT10152636 T AT 10152636T AT 10152636 T AT10152636 T AT 10152636T AT E530940 T1 ATE530940 T1 AT E530940T1
Authority
AT
Austria
Prior art keywords
adhesive film
solid adhesive
level module
wafer
manufacturing process
Prior art date
Application number
AT10152636T
Other languages
English (en)
Inventor
Hsin-Chang Hsiung
Chih-Wei Tan
Po-Lin Su
Original Assignee
Himax Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Himax Semiconductor Inc filed Critical Himax Semiconductor Inc
Application granted granted Critical
Publication of ATE530940T1 publication Critical patent/ATE530940T1/de

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1471—Protective layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1476—Release layer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
  • Dicing (AREA)
AT10152636T 2009-09-02 2010-02-04 Herstellungsverfahren und struktur eines moduls auf waferebene ATE530940T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23918409P 2009-09-02 2009-09-02
US12/646,094 US8193599B2 (en) 2009-09-02 2009-12-23 Fabricating method and structure of a wafer level module

Publications (1)

Publication Number Publication Date
ATE530940T1 true ATE530940T1 (de) 2011-11-15

Family

ID=42062610

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10152636T ATE530940T1 (de) 2009-09-02 2010-02-04 Herstellungsverfahren und struktur eines moduls auf waferebene

Country Status (5)

Country Link
US (1) US8193599B2 (de)
EP (1) EP2224272B1 (de)
JP (1) JP2011053640A (de)
KR (1) KR101124652B1 (de)
AT (1) ATE530940T1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102045494A (zh) * 2009-10-22 2011-05-04 国碁电子(中山)有限公司 相机模组及其制作方法
CN102654629B (zh) * 2011-03-01 2015-08-05 英属盖曼群岛恒景科技股份有限公司 镜头模块与制造镜头模块的光圈的方法
SG2014008726A (en) * 2011-08-25 2014-04-28 Heptagon Micro Optics Pte Ltd Wafer-level fabrication of optical devices with front focal length correction
US8388793B1 (en) * 2011-08-29 2013-03-05 Visera Technologies Company Limited Method for fabricating camera module
AU2015308583B2 (en) 2014-08-29 2019-11-28 Medical Components, Inc. Huber safety needle
JP6896753B2 (ja) 2016-03-18 2021-06-30 メデイカル コンポーネンツ，インコーポレーテツド フーバー針アセンブリ

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61110396A (ja) * 1984-11-05 1986-05-28 Fujitsu Ltd 半導体記憶装置
JPH09111204A (ja) 1995-10-16 1997-04-28 Shinko Electric Ind Co Ltd 導電性接着テープおよびこれを用いた半導体装置用パッケージ
JP2000007758A (ja) * 1998-06-27 2000-01-11 Nagase Chiba Kk Ｂ−ステージ化できる液状エポキシ樹脂組成物
US6428641B1 (en) * 1998-08-31 2002-08-06 Amkor Technology, Inc. Method for laminating circuit pattern tape on semiconductor wafer
US6591125B1 (en) * 2000-06-27 2003-07-08 Therasense, Inc. Small volume in vitro analyte sensor with diffusible or non-leachable redox mediator
JP2000332414A (ja) * 1999-05-20 2000-11-30 Nec Corp 樹脂付き配線シート、それを用いた配線構造とそれらの製造方法
US6537854B1 (en) * 1999-05-24 2003-03-25 Industrial Technology Research Institute Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed
JP2001245217A (ja) * 2000-03-02 2001-09-07 Olympus Optical Co Ltd 小型撮像モジュール
US6707163B2 (en) * 2001-04-13 2004-03-16 Stmicroelectronics, Inc. Method of eliminating uncontrolled voids in sheet adhesive layer
JP2004200965A (ja) 2002-12-18 2004-07-15 Sanyo Electric Co Ltd カメラモジュール及びその製造方法
US7135352B2 (en) * 2004-02-26 2006-11-14 Eastman Kodak Company Method of fabricating a cover plate bonded over an encapsulated OLEDs
US7253957B2 (en) * 2004-05-13 2007-08-07 Micron Technology, Inc. Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
US7863702B2 (en) * 2004-06-10 2011-01-04 Samsung Electronics Co., Ltd. Image sensor package and method of manufacturing the same
JP3801601B2 (ja) 2004-06-15 2006-07-26 シャープ株式会社 蓋部を備えた半導体ウェハの製造方法及び半導体装置の製造方法
US20060139772A1 (en) 2004-12-27 2006-06-29 Canon Kabushiki Kaisha Method of fixing optical member and optical unit
US7964926B2 (en) * 2005-02-02 2011-06-21 Samsung Electronics Co., Ltd. Image sensing devices including image sensor chips, image sensor package modules employing the image sensing devices, electronic products employing the image sensor package modules, and methods of fabricating the same
JP4304163B2 (ja) * 2005-03-09 2009-07-29 パナソニック株式会社 撮像モジュールおよびその製造方法
WO2007059152A1 (en) * 2005-11-14 2007-05-24 World Properties, Inc. Circuit material, multi-layer circuits, and methods of manufacture thereof
CN101009779B (zh) 2006-01-24 2010-06-16 采钰科技股份有限公司 高精密度成像控制的影像感应模块
US20070217019A1 (en) * 2006-03-16 2007-09-20 Wen-Kuei Huang Optical components array device, microlens array and process of fabricating thereof
US7833577B2 (en) * 2007-05-11 2010-11-16 3M Innovative Properties Company Methods of making a pressure-sensitive adhesive assembly
US20090206431A1 (en) * 2008-02-20 2009-08-20 Micron Technology, Inc. Imager wafer level module and method of fabrication and use
US8361830B2 (en) * 2010-04-09 2013-01-29 Himax Semiconductor, Inc. Image sensor module and method of manufacturing the same

Also Published As

Publication number Publication date
JP2011053640A (ja) 2011-03-17
US20110049547A1 (en) 2011-03-03
KR101124652B1 (ko) 2012-03-20
EP2224272B1 (de) 2011-10-26
US8193599B2 (en) 2012-06-05
EP2224272A1 (de) 2010-09-01
KR20110025037A (ko) 2011-03-09

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Legal Events

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