ATE534138T1 - Integrierter getter für vakuum- oder inertgas gekapselte leds - Google Patents

Integrierter getter für vakuum- oder inertgas gekapselte leds

Info

Publication number
ATE534138T1
ATE534138T1 AT05735876T AT05735876T ATE534138T1 AT E534138 T1 ATE534138 T1 AT E534138T1 AT 05735876 T AT05735876 T AT 05735876T AT 05735876 T AT05735876 T AT 05735876T AT E534138 T1 ATE534138 T1 AT E534138T1
Authority
AT
Austria
Prior art keywords
encapsuled
leds
vacuum
inert gas
getter
Prior art date
Application number
AT05735876T
Other languages
English (en)
Inventor
Marco Amiotti
Ronald Petersen
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa filed Critical Getters Spa
Application granted granted Critical
Publication of ATE534138T1 publication Critical patent/ATE534138T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Preparation Of Clay, And Manufacture Of Mixtures Containing Clay Or Cement (AREA)
AT05735876T 2004-04-15 2005-04-13 Integrierter getter für vakuum- oder inertgas gekapselte leds ATE534138T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US56289904P 2004-04-15 2004-04-15
US11/104,958 US7560820B2 (en) 2004-04-15 2005-04-12 Integrated getter for vacuum or inert gas packaged LEDs
PCT/US2005/012577 WO2005106958A2 (en) 2004-04-15 2005-04-13 Integrated getter for vacuum or inert gas packaged leds

Publications (1)

Publication Number Publication Date
ATE534138T1 true ATE534138T1 (de) 2011-12-15

Family

ID=35095383

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05735876T ATE534138T1 (de) 2004-04-15 2005-04-13 Integrierter getter für vakuum- oder inertgas gekapselte leds

Country Status (6)

Country Link
US (1) US7560820B2 (de)
EP (1) EP1745513B1 (de)
JP (1) JP5308663B2 (de)
KR (2) KR100973485B1 (de)
AT (1) ATE534138T1 (de)
WO (1) WO2005106958A2 (de)

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JP2013545263A (ja) * 2010-09-28 2013-12-19 コーニンクレッカ フィリップス エヌ ヴェ 発光装置
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KR102355604B1 (ko) * 2015-07-03 2022-01-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 및 이를 구비한 라이트 유닛
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CN109716745B (zh) * 2016-08-01 2020-12-18 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和模塑感光组件和制造方法
TWI599078B (zh) * 2016-08-05 2017-09-11 行家光電股份有限公司 具濕氣阻隔結構之晶片級封裝發光裝置
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Also Published As

Publication number Publication date
KR20080091303A (ko) 2008-10-09
EP1745513B1 (de) 2011-11-16
JP2007533160A (ja) 2007-11-15
US20050230691A1 (en) 2005-10-20
EP1745513A4 (de) 2010-02-24
EP1745513A2 (de) 2007-01-24
KR20070029173A (ko) 2007-03-13
WO2005106958A2 (en) 2005-11-10
HK1101841A1 (zh) 2007-10-26
KR100973485B1 (ko) 2010-08-03
JP5308663B2 (ja) 2013-10-09
US7560820B2 (en) 2009-07-14
WO2005106958A3 (en) 2007-01-04

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