ATE540426T1 - Material zur verbindung von leiterplatten, stromkreisverbindungsstruktur und verfahren zur verbindung des leiterplattenelements - Google Patents

Material zur verbindung von leiterplatten, stromkreisverbindungsstruktur und verfahren zur verbindung des leiterplattenelements

Info

Publication number
ATE540426T1
ATE540426T1 AT10156277T AT10156277T ATE540426T1 AT E540426 T1 ATE540426 T1 AT E540426T1 AT 10156277 T AT10156277 T AT 10156277T AT 10156277 T AT10156277 T AT 10156277T AT E540426 T1 ATE540426 T1 AT E540426T1
Authority
AT
Austria
Prior art keywords
circuit
connection structure
board element
circuit board
boards
Prior art date
Application number
AT10156277T
Other languages
English (en)
Inventor
Motohiro Arifuku
Nichiomi Mochizuki
Takashi Nakazawa
Kouji Kobayashi
Tohru Fujinawa
Takashi Tatsuzawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of ATE540426T1 publication Critical patent/ATE540426T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4205—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
    • C08G18/4208—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
    • C08G18/4211—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols
    • C08G18/4213—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols from terephthalic acid and dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/06—Polyurethanes from polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
AT10156277T 2006-07-21 2006-07-21 Material zur verbindung von leiterplatten, stromkreisverbindungsstruktur und verfahren zur verbindung des leiterplattenelements ATE540426T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06768353A EP2046104B1 (de) 2006-07-21 2006-07-21 Schaltungsverbindungsmaterial, schaltungsglied-verbindungsstruktur und verfahren zum verbinden eines schaltungsglieds
PCT/JP2006/314475 WO2008010294A1 (en) 2006-07-21 2006-07-21 Circuit connection material, circuit member connecting structure and method of connecting circuit member

Publications (1)

Publication Number Publication Date
ATE540426T1 true ATE540426T1 (de) 2012-01-15

Family

ID=38956630

Family Applications (2)

Application Number Title Priority Date Filing Date
AT10156277T ATE540426T1 (de) 2006-07-21 2006-07-21 Material zur verbindung von leiterplatten, stromkreisverbindungsstruktur und verfahren zur verbindung des leiterplattenelements
AT10156276T ATE550401T1 (de) 2006-07-21 2006-07-21 Materiau de connexion de circuit, structure de connexion d'element de circuit et procede de connexion de l'element de circuit

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT10156276T ATE550401T1 (de) 2006-07-21 2006-07-21 Materiau de connexion de circuit, structure de connexion d'element de circuit et procede de connexion de l'element de circuit

Country Status (8)

Country Link
US (3) US8497431B2 (de)
EP (5) EP2429269B1 (de)
JP (1) JP4924609B2 (de)
KR (3) KR101108777B1 (de)
CN (1) CN101502188B (de)
AT (2) ATE540426T1 (de)
PL (5) PL2223982T3 (de)
WO (1) WO2008010294A1 (de)

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WO2008010294A1 (en) 2006-07-21 2008-01-24 Hitachi Chemical Company, Ltd. Circuit connection material, circuit member connecting structure and method of connecting circuit member
JP4673933B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 異方性導電材料及び接続構造体
JP4673931B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 異方性導電材料及び接続構造体
JP4673932B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 接続構造体の製造方法及び異方性導電材料
KR101538834B1 (ko) * 2009-08-26 2015-07-22 세키스이가가쿠 고교가부시키가이샤 이방성 도전 재료, 접속 구조체 및 접속 구조체의 제조 방법
DE102009029476B4 (de) 2009-09-15 2012-11-08 Lisa Dräxlmaier GmbH Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe
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WO2021212480A1 (zh) * 2020-04-24 2021-10-28 庆鼎精密电子（淮安）有限公司 软硬结合电路板及其制作方法

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Also Published As

Publication number Publication date
US8558118B2 (en) 2013-10-15
US8497431B2 (en) 2013-07-30
EP2223982B1 (de) 2012-01-04
KR20090033488A (ko) 2009-04-03
PL2440023T3 (pl) 2013-06-28
EP2223981A2 (de) 2010-09-01
EP2223981B1 (de) 2012-03-21
CN101502188B (zh) 2011-03-23
US8541688B2 (en) 2013-09-24
KR20100024519A (ko) 2010-03-05
EP2046104B1 (de) 2012-01-18
PL2223982T3 (pl) 2012-06-29
US20100108365A1 (en) 2010-05-06
PL2223981T3 (pl) 2012-08-31
KR20100024520A (ko) 2010-03-05
EP2223982A3 (de) 2010-11-17
JP4924609B2 (ja) 2012-04-25
PL2046104T3 (pl) 2012-06-29
US20100208444A1 (en) 2010-08-19
PL2429269T3 (pl) 2013-06-28
EP2440023B1 (de) 2013-03-06
KR101108777B1 (ko) 2012-02-15
EP2223981A3 (de) 2011-03-02
KR101121616B1 (ko) 2012-03-13
EP2429269A1 (de) 2012-03-14
CN101502188A (zh) 2009-08-05
EP2223982A2 (de) 2010-09-01
ATE550401T1 (de) 2012-04-15
EP2046104A4 (de) 2010-05-05
US20100212943A1 (en) 2010-08-26
EP2046104A1 (de) 2009-04-08
WO2008010294A1 (en) 2008-01-24
JPWO2008010294A1 (ja) 2009-12-17
EP2429269B1 (de) 2013-01-16
KR101065870B1 (ko) 2011-09-19
EP2440023A1 (de) 2012-04-11

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