PL2046104T3 - Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów - Google Patents

Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów

Info

Publication number
PL2046104T3
PL2046104T3 PL06768353T PL06768353T PL2046104T3 PL 2046104 T3 PL2046104 T3 PL 2046104T3 PL 06768353 T PL06768353 T PL 06768353T PL 06768353 T PL06768353 T PL 06768353T PL 2046104 T3 PL2046104 T3 PL 2046104T3
Authority
PL
Poland
Prior art keywords
circuit
circuit member
connection material
connecting structure
board
Prior art date
Application number
PL06768353T
Other languages
English (en)
Inventor
Motohiro Arifuku
Nichiomi Mochizuki
Takashi Nakazawa
Kouji Kobayashi
Tohru Fujinawa
Takashi Tatsuzawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of PL2046104T3 publication Critical patent/PL2046104T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4205—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
    • C08G18/4208—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
    • C08G18/4211—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols
    • C08G18/4213—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols from terephthalic acid and dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/06—Polyurethanes from polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
PL06768353T 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów PL2046104T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06768353A EP2046104B1 (en) 2006-07-21 2006-07-21 Circuit connection material, circuit member connecting structure and method of connecting circuit member
PCT/JP2006/314475 WO2008010294A1 (en) 2006-07-21 2006-07-21 Circuit connection material, circuit member connecting structure and method of connecting circuit member

Publications (1)

Publication Number Publication Date
PL2046104T3 true PL2046104T3 (pl) 2012-06-29

Family

ID=38956630

Family Applications (5)

Application Number Title Priority Date Filing Date
PL10156277T PL2223982T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL06768353T PL2046104T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL11189685T PL2440023T3 (pl) 2006-07-21 2006-07-21 Zastosowanie materiału do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL10156276T PL2223981T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL11180866T PL2429269T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PL10156277T PL2223982T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów

Family Applications After (3)

Application Number Title Priority Date Filing Date
PL11189685T PL2440023T3 (pl) 2006-07-21 2006-07-21 Zastosowanie materiału do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL10156276T PL2223981T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
PL11180866T PL2429269T3 (pl) 2006-07-21 2006-07-21 Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów

Country Status (8)

Country Link
US (3) US8497431B2 (pl)
EP (5) EP2429269B1 (pl)
JP (1) JP4924609B2 (pl)
KR (3) KR101121616B1 (pl)
CN (1) CN101502188B (pl)
AT (2) ATE550401T1 (pl)
PL (5) PL2223982T3 (pl)
WO (1) WO2008010294A1 (pl)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6356485B1 (en) * 1999-02-13 2002-03-12 Integrated Device Technology, Inc. Merging write cycles by comparing at least a portion of the respective write cycle addresses
KR101121616B1 (ko) 2006-07-21 2012-03-13 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법
JP4673933B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 異方性導電材料及び接続構造体
JP4673931B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 異方性導電材料及び接続構造体
JP4673932B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 接続構造体の製造方法及び異方性導電材料
JP5602743B2 (ja) * 2009-08-26 2014-10-08 積水化学工業株式会社 異方性導電材料、接続構造体及び接続構造体の製造方法
DE102009029476B4 (de) 2009-09-15 2012-11-08 Lisa Dräxlmaier GmbH Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe
CN105176471A (zh) * 2010-07-26 2015-12-23 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
WO2021212480A1 (zh) * 2020-04-24 2021-10-28 庆鼎精密电子（淮安）有限公司 软硬结合电路板及其制作方法

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3994764A (en) * 1975-06-13 1976-11-30 Pratt & Lambert, Inc. Adhesive compositions
US4223115A (en) 1978-04-24 1980-09-16 Lord Corporation Structural adhesive formulations
DE3112123A1 (de) * 1981-03-27 1982-10-07 Basf Ag, 6700 Ludwigshafen Lagerstabile dispersionen von aromatischen polyestern in polyhydroxylverbindungen, verfahren zu deren herstellung und deren verwendung zur herstellung von gegebenenfalls zelligen polyurethan- und/oder polyisocyanurat-kunststoffen
JPS6147760A (ja) 1984-08-16 1986-03-08 Shin Etsu Polymer Co Ltd 異方導電接着剤
JPH01135639A (ja) 1987-11-24 1989-05-29 Nippon Sheet Glass Co Ltd ポリエステル積層物
US5037715A (en) * 1987-12-10 1991-08-06 Mitsui Toatsu Chemicals, Inc. Resins for toner of electrophotography and method for manufacturing the same
JPH03110711A (ja) 1989-09-22 1991-05-10 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
TW210422B (pl) * 1991-06-04 1993-08-01 Akzo Nv
JPH0652715A (ja) * 1992-07-30 1994-02-25 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
JPH0776185A (ja) 1993-06-17 1995-03-20 Sony Corp ラミネートフィルム
JP3876993B2 (ja) 1997-02-27 2007-02-07 セイコーエプソン株式会社 接着構造、液晶装置、及び電子機器
US7618713B2 (en) * 1997-03-31 2009-11-17 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
EP1542273B1 (en) 1997-03-31 2013-09-25 Hitachi Chemical Co., Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
JPH11110747A (ja) 1997-10-07 1999-04-23 Toyobo Co Ltd 磁気記録カード用基材
JP4423513B2 (ja) 1997-10-20 2010-03-03 東洋紡績株式会社 接着用樹脂組成物及び接着用フィルム
TW459032B (en) 1998-03-18 2001-10-11 Sumitomo Bakelite Co An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive
JP2000239642A (ja) 1999-02-23 2000-09-05 Toyobo Co Ltd 反応性ホットメルト接着剤組成物
JP2001055555A (ja) 1999-08-19 2001-02-27 Dainippon Ink & Chem Inc ラミネート用接着剤組成物
CN100335585C (zh) 1999-08-25 2007-09-05 日立化成工业株式会社 配线连接材料以及使用它的配线板制造方法
US6762249B1 (en) 1999-08-25 2004-07-13 Hitachi Chemical Company, Ltd. Wiring-connecting material and process for producing circuit board with the same
JP4916677B2 (ja) * 1999-08-25 2012-04-18 日立化成工業株式会社 配線接続材料及びそれを用いた配線板製造方法
CN101037581A (zh) * 1999-08-25 2007-09-19 日立化成工业株式会社 粘合剂,配线端子的连接方法和配线结构体
JP3915512B2 (ja) * 2000-04-25 2007-05-16 日立化成工業株式会社 回路接続用接着剤並びにそれを用いた回路接続方法及び回路接続構造体
JP2002111213A (ja) 2000-09-26 2002-04-12 Nippon Mektron Ltd 任意層間接続用バイア・ホールを有する多層プリント基板およびその製造方法
JP4734706B2 (ja) * 2000-11-01 2011-07-27 Ｊｓｒ株式会社 電気抵抗測定用コネクター並びに回路基板の電気抵抗測定装置および測定方法
KR20030037017A (ko) 2001-11-01 2003-05-12 엘지전선 주식회사 이방성 도전 접착필름
JP4158080B2 (ja) 2002-01-30 2008-10-01 東洋紡績株式会社 導電性ペースト
US6815501B2 (en) 2002-04-09 2004-11-09 E. I. Du Pont De Nemours And Company Dual cure coating compositions and process for the production of multilayer coatings
JP4235895B2 (ja) 2002-04-18 2009-03-11 東洋紡績株式会社 昇華型感熱転写記録材用ポリエステルフィルムおよびその製造方法
JP2003313533A (ja) 2002-04-23 2003-11-06 Sumitomo Bakelite Co Ltd 異方導電性接着剤
US7371452B2 (en) * 2003-04-28 2008-05-13 Eastman Kodak Company Conductive patterned sheet utilizing multi-layered conductive conduit channels
JP4470091B2 (ja) 2003-08-11 2010-06-02 東洋紡績株式会社 ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板
WO2005035617A1 (ja) 2003-10-10 2005-04-21 Asahi Kasei Chemicals Corporation 潜在性硬化剤および組成物
JP2005194393A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
EP1734095B1 (en) 2004-04-09 2014-10-08 DIC Corporation Moisture-curable polyurethane hot melt adhesive
JP2006052258A (ja) * 2004-08-10 2006-02-23 Unitika Ltd 活性エネルギー線硬化型樹脂組成物
JP4844003B2 (ja) 2005-05-10 2011-12-21 日立化成工業株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
US7535462B2 (en) * 2005-06-02 2009-05-19 Eastman Kodak Company Touchscreen with one carbon nanotube conductive layer
JP2005290394A (ja) 2005-07-04 2005-10-20 Hitachi Chem Co Ltd 回路接続用接着フィルム及びそれを用いた回路板の製造方法
KR101121616B1 (ko) 2006-07-21 2012-03-13 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법
JP2008290327A (ja) 2007-05-24 2008-12-04 Meiki Co Ltd 射出成形装置および射出成形方法

Also Published As

Publication number Publication date
EP2429269B1 (en) 2013-01-16
EP2223981A2 (en) 2010-09-01
JP4924609B2 (ja) 2012-04-25
PL2223981T3 (pl) 2012-08-31
US20100208444A1 (en) 2010-08-19
ATE540426T1 (de) 2012-01-15
US8497431B2 (en) 2013-07-30
KR101065870B1 (ko) 2011-09-19
EP2046104A4 (en) 2010-05-05
PL2440023T3 (pl) 2013-06-28
CN101502188B (zh) 2011-03-23
EP2429269A1 (en) 2012-03-14
ATE550401T1 (de) 2012-04-15
JPWO2008010294A1 (ja) 2009-12-17
US20100212943A1 (en) 2010-08-26
CN101502188A (zh) 2009-08-05
EP2440023A1 (en) 2012-04-11
KR20100024519A (ko) 2010-03-05
PL2223982T3 (pl) 2012-06-29
KR101108777B1 (ko) 2012-02-15
WO2008010294A1 (en) 2008-01-24
US8558118B2 (en) 2013-10-15
KR20100024520A (ko) 2010-03-05
EP2223982A2 (en) 2010-09-01
EP2046104B1 (en) 2012-01-18
KR101121616B1 (ko) 2012-03-13
EP2223982B1 (en) 2012-01-04
KR20090033488A (ko) 2009-04-03
EP2046104A1 (en) 2009-04-08
US8541688B2 (en) 2013-09-24
EP2223982A3 (en) 2010-11-17
EP2223981B1 (en) 2012-03-21
PL2429269T3 (pl) 2013-06-28
EP2440023B1 (en) 2013-03-06
US20100108365A1 (en) 2010-05-06
EP2223981A3 (en) 2011-03-02

Similar Documents

Publication Publication Date Title
WO2006020990A3 (en) Direct drive display with a multi-layer backplane and process for its manufacture
WO2008009575A3 (en) Method of bonding
TW200744869A (en) Hot stamp adhesive with optical effect pigment
WO2005123825A3 (en) High thermal conductivity materials with grafted surface functional groups
PL2108524T3 (pl) Sposób wytwarzania powlekanych paneli oraz powlekany panel
PL2422885T3 (pl) Sposób krycia
BRPI0607213A2 (pt) aparelho para manipular gotìculas, método para atuar em uma gotìcula, método para unir duas ou mais gotìculas e método para dividir uma gotìcula em duas ou mais gotìculas
EP1814157A3 (en) Sheet unit including a plurarity of organic light emitting display panels and fabricating method of the same
TW200730060A (en) Multilayer printed circuit board and manufacturing method thereof
WO2007050402A3 (en) Combined power source and printed transistor circuit apparatus and method
TW200608066A (en) Laminated optical article
GB2465736A (en) Method for coating and applying designs to substrates
WO2007033980A3 (de) Verfahren zum bestücken eines teppichs bwz. eines flächenförmigen trägers mit elektronischen bauteilen, vorrichtung hierzu, sowie teppich bzw. flächenförmiger träger mit elektronischen bauteilen
WO2008108923A3 (en) Flat panel oled device having deformable substrate
EP1519206A3 (en) Joined multi functional optical device
PL2429269T3 (pl) Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
EP1757442A3 (en) Articles comprising nanoparticles
WO2007027242A3 (en) Electroluminescent panel with inkjet-printed electrode regions
WO2009003651A3 (de) Anzeigevorrichtung, insbesondere transparente multimediafassade
TW200637450A (en) Heater that attaches electronic component to and detaches the same from substrate
PT1846874E (pt) Método para aplicar uma composição electrónica a um substrato e um dispositivo para aplicar a referida composição
EP1813863A4 (en) HEAT DISPERSION STRUCTURE FOR AN LED DIODE LAMP
WO2006104625A3 (en) Activator means for pre-applied adhesives
DK1767697T3 (da) Gulvmateriale, fremgangsmåder til at fremstille og lægge dette
EP2045305A4 (en) ADHESIVE ADHESIVE FOR FIXING AN IC MODULE AND MULTILAYER BAND AND CHIP CARD WITH THE ADHESIVE