ATE544044T1 - Verfahren und befestigung zum herstellen von koplanaren verdampfern aus wärmrohren sowie dadurch hergestellter verdampfer - Google Patents

Verfahren und befestigung zum herstellen von koplanaren verdampfern aus wärmrohren sowie dadurch hergestellter verdampfer

Info

Publication number
ATE544044T1
ATE544044T1 AT09014499T AT09014499T ATE544044T1 AT E544044 T1 ATE544044 T1 AT E544044T1 AT 09014499 T AT09014499 T AT 09014499T AT 09014499 T AT09014499 T AT 09014499T AT E544044 T1 ATE544044 T1 AT E544044T1
Authority
AT
Austria
Prior art keywords
evaporators
faces
evaporizers
fixing
heat pipe
Prior art date
Application number
AT09014499T
Other languages
English (en)
Inventor
Kuo-Len Lin
Chen-Hsiang Lin
Mong-Hua Hung
Ken Hsu
Chih-Hung Cheng
Original Assignee
Cpumate Inc
Golden Sun News Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cpumate Inc, Golden Sun News Tech Co Ltd filed Critical Cpumate Inc
Application granted granted Critical
Publication of ATE544044T1 publication Critical patent/ATE544044T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/06—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of metal tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
AT09014499T 2009-10-23 2009-11-20 Verfahren und befestigung zum herstellen von koplanaren verdampfern aus wärmrohren sowie dadurch hergestellter verdampfer ATE544044T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW098135973A TWI462690B (zh) 2009-10-23 2009-10-23 多熱管蒸發部共平面之製造方法及其成品、治具
EP09014499A EP2325592B1 (de) 2009-10-23 2009-11-20 Verfahren und Befestigung zum Herstellen von koplanaren Verdampfern aus Wärmrohren sowie dadurch hergestellter Verdampfer

Publications (1)

Publication Number Publication Date
ATE544044T1 true ATE544044T1 (de) 2012-02-15

Family

ID=49584976

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09014499T ATE544044T1 (de) 2009-10-23 2009-11-20 Verfahren und befestigung zum herstellen von koplanaren verdampfern aus wärmrohren sowie dadurch hergestellter verdampfer

Country Status (3)

Country Link
EP (1) EP2325592B1 (de)
AT (1) ATE544044T1 (de)
TW (1) TWI462690B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110788431B (zh) * 2019-11-18 2024-03-29 江苏同力空调设备有限公司 换热器芯体组件焊接工装及焊接方法
JP7235922B1 (ja) * 2022-07-26 2023-03-08 古河電気工業株式会社 ヒートシンク

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM249106U (en) * 2003-12-23 2004-11-01 Hon Hai Prec Ind Co Ltd Heatpipe type heat dissipation device
US7322102B2 (en) * 2005-01-05 2008-01-29 Cpumate Inc. Isothermal plate assembly with predetermined shape and method for manufacturing the same
TWM282235U (en) * 2005-06-24 2005-12-01 Golden Sun News Tech Co Ltd Improved structure of a heat dissipating device using heat pipes
TW200735754A (en) * 2006-03-06 2007-09-16 Shi-Ming Chen Method of fastening heat pipe and heat dissipating fins and device using the same
US20070261244A1 (en) * 2006-05-12 2007-11-15 Chih-Hung Cheng Leveling Method for Embedding Heat Pipe in Heat-Conducting Seat
TW200803706A (en) * 2006-06-29 2008-01-01 Cooler Master Co Ltd Heat conduction module and fabrication method thereof
CN200973220Y (zh) * 2006-11-10 2007-11-07 鈤新科技股份有限公司 固定座及固定座与热管的组合结构
US7866043B2 (en) * 2008-04-28 2011-01-11 Golden Sun News Techniques Co., Ltd. Method of flatting evaporating section of heat pipe embedded in heat dissipation device
CN101437386A (zh) * 2008-12-26 2009-05-20 奇鋐科技股份有限公司 散热结构及其制造方法

Also Published As

Publication number Publication date
TWI462690B (zh) 2014-11-21
EP2325592A1 (de) 2011-05-25
EP2325592B1 (de) 2012-02-01
TW201116201A (en) 2011-05-01

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