ATE555495T1 - Dreh chipanbringung - Google Patents

Dreh chipanbringung

Info

Publication number
ATE555495T1
ATE555495T1 AT06848844T AT06848844T ATE555495T1 AT E555495 T1 ATE555495 T1 AT E555495T1 AT 06848844 T AT06848844 T AT 06848844T AT 06848844 T AT06848844 T AT 06848844T AT E555495 T1 ATE555495 T1 AT E555495T1
Authority
AT
Austria
Prior art keywords
wafer
ics
place
rotary
web
Prior art date
Application number
AT06848844T
Other languages
English (en)
Inventor
Andre Cote
Detlef Duschek
Original Assignee
Checkpoint Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Checkpoint Systems Inc filed Critical Checkpoint Systems Inc
Application granted granted Critical
Publication of ATE555495T1 publication Critical patent/ATE555495T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
AT06848844T 2005-11-18 2006-11-17 Dreh chipanbringung ATE555495T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US73812005P 2005-11-18 2005-11-18
US11/560,692 US7569932B2 (en) 2005-11-18 2006-11-16 Rotary chip attach
PCT/US2006/061035 WO2007076189A2 (en) 2005-11-18 2006-11-17 Rotary chip attach

Publications (1)

Publication Number Publication Date
ATE555495T1 true ATE555495T1 (de) 2012-05-15

Family

ID=38048020

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06848844T ATE555495T1 (de) 2005-11-18 2006-11-17 Dreh chipanbringung

Country Status (9)

Country Link
US (2) US7569932B2 (de)
EP (1) EP1964162B1 (de)
JP (1) JP2009516921A (de)
CN (1) CN101361165B (de)
AT (1) ATE555495T1 (de)
AU (1) AU2006330796B2 (de)
CA (1) CA2629773C (de)
ES (1) ES2384056T3 (de)
WO (1) WO2007076189A2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD589006S1 (en) * 2006-10-05 2009-03-24 Sunowealth Electric Machine Industry Co., Ltd. Blower casing
SG147353A1 (en) * 2007-05-07 2008-11-28 Mfg Integration Technology Ltd Apparatus for object processing
DE102007048397B3 (de) * 2007-10-09 2008-11-20 Siemens Ag Halbleiter-Chip-Zuführung über mehrere Wafer-Bereitstellungsebenen
PH12013502495A1 (en) * 2011-06-03 2014-02-10 Orion Systems Integration Pte Ltd Method and systems for semiconductor chip pick & transfer and bonding
JP5758786B2 (ja) * 2011-12-14 2015-08-05 株式会社日立製作所 太陽電池モジュールの製造方法および製造装置
WO2013171863A1 (ja) * 2012-05-16 2013-11-21 上野精機株式会社 ダイボンダー装置
TWI525741B (zh) * 2012-05-23 2016-03-11 The angle positioning method of the wafer-mounted ring assembly and the mechanism for carrying out the aforementioned method
US8779578B2 (en) * 2012-06-29 2014-07-15 Hewlett-Packard Development Company, L.P. Multi-chip socket
JP2014075531A (ja) * 2012-10-05 2014-04-24 Samsung Techwin Co Ltd 部品実装装置
DE102015013495B4 (de) * 2015-10-16 2018-04-26 Mühlbauer Gmbh & Co. Kg Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser
DE102015013494B3 (de) * 2015-10-16 2017-04-06 Mühlbauer Gmbh & Co. Kg Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung
CN105742931B (zh) * 2016-03-01 2018-01-16 宣城市亿鸣科技有限公司 一种滑轮式周期性电线打端子机
JP6312270B2 (ja) * 2016-03-25 2018-04-18 株式会社写真化学 デバイスチップを用いた電子デバイスの製造方法およびその製造装置
KR102417917B1 (ko) * 2016-04-26 2022-07-07 삼성전자주식회사 공정 시스템 및 그 동작 방법
US10297110B2 (en) 2016-06-29 2019-05-21 Igt Gaming system and method for providing a central determination of game outcomes and progressive awards
CN107665828A (zh) * 2016-07-29 2018-02-06 上海微电子装备（集团）股份有限公司 一种自动键合装置及方法
AR118939A1 (es) * 2020-05-15 2021-11-10 Marisa Rosana Lattanzi Máquina combinada para elaborar separadores laminares de productos que se contienen en cajas y cajones
US12550654B2 (en) * 2020-08-21 2026-02-10 Advanced Semiconductor Engineering, Inc. Method for manufacturing semiconductor package
CN112967991B (zh) * 2020-11-25 2022-10-21 重庆康佳光电技术研究院有限公司 转移装置、系统及方法
JP7573875B2 (ja) * 2021-09-29 2024-10-28 株式会社 東京ウエルズ ピックアップ装置、ワーク搬送装置、ワークのピックアップ方法
US12221239B2 (en) 2021-12-02 2025-02-11 3M Innovative Properties Company Methods and systems of using pocket roller to place objects on moving web
CN116072589A (zh) * 2023-03-07 2023-05-05 苏州易缆微光电技术有限公司 集成光模块封装设备

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4915565A (en) 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
JPS6226833A (ja) * 1985-07-26 1987-02-04 Mitsubishi Electric Corp ダイボンデング装置
JPH0267739A (ja) * 1988-09-01 1990-03-07 Mitsubishi Electric Corp ダイボンディング方法とその装置
JPH0821790B2 (ja) 1990-02-15 1996-03-04 松下電器産業株式会社 ロータリーヘッド式電子部品実装装置
US5362681A (en) * 1992-07-22 1994-11-08 Anaglog Devices, Inc. Method for separating circuit dies from a wafer
JP2536371B2 (ja) * 1992-09-10 1996-09-18 東芝精機株式会社 半導体ペレットボンディング方法
US5399505A (en) 1993-07-23 1995-03-21 Motorola, Inc. Method and apparatus for performing wafer level testing of integrated circuit dice
JPH0774499A (ja) * 1993-09-03 1995-03-17 Toshiba Corp 部品実装装置
SE505133C2 (sv) * 1994-10-12 1997-06-30 Mydata Automation Ab Plockhuvud för komponentmonteringsmaskin
US5671530A (en) * 1995-10-30 1997-09-30 Delco Electronics Corporation Flip-chip mounting assembly and method with vertical wafer feeder
US5708419A (en) 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
JPH10145091A (ja) * 1996-11-08 1998-05-29 Matsushita Electric Ind Co Ltd 電子部品実装装置
ATE361549T1 (de) * 1997-12-07 2007-05-15 Oerlikon Assembly Equipment Ag Halbleiter-montageeinrichtung mit einem hin und her geführten chipgreifer
TW460906B (en) 1999-03-05 2001-10-21 Siemens Ag Equipment to insert a substrate with flip-chips
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
DE10214347A1 (de) 2002-03-11 2003-09-25 Georg Rudolf Sillner Vorrichtung zum Ver- und/oder Bearbeiten von Halbleiterchips- oder Bauelementen sowie Transfer- und Wendemodul
ATE522925T1 (de) 2003-01-16 2011-09-15 Nxp Bv Chiptransferverfahren und vorrichtung
JP3739752B2 (ja) * 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
JP2005116553A (ja) * 2003-10-02 2005-04-28 Tokyo Electron Ltd 塗布膜形成装置及び塗布膜形成方法
US7155299B2 (en) * 2004-06-01 2006-12-26 Manufacturing Integration Technology Ltd Method and apparatus for precise marking and placement of an object
DK1674962T3 (da) * 2004-12-22 2009-12-14 Frama Ag Indretning til beskyttelse af data, der er lagret i en kredslöbsindretning, der består af elektroniske komponenter og en processor

Also Published As

Publication number Publication date
CA2629773A1 (en) 2007-07-05
US7820481B2 (en) 2010-10-26
EP1964162B1 (de) 2012-04-25
EP1964162A2 (de) 2008-09-03
WO2007076189A3 (en) 2007-12-21
CN101361165A (zh) 2009-02-04
JP2009516921A (ja) 2009-04-23
US20070114659A1 (en) 2007-05-24
US20090269882A1 (en) 2009-10-29
ES2384056T3 (es) 2012-06-28
AU2006330796B2 (en) 2012-03-15
CA2629773C (en) 2012-07-10
WO2007076189A2 (en) 2007-07-05
AU2006330796A1 (en) 2007-07-05
CN101361165B (zh) 2011-12-07
US7569932B2 (en) 2009-08-04

Similar Documents

Publication Publication Date Title
ATE555495T1 (de) Dreh chipanbringung
ATE546836T1 (de) Anwendung einer transparenten leuchtdiodenanzeigevorrichtung in einem kraftfahrzeug
MY155097A (en) Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
MY134479A (en) Method and apparatus for packaging integrated circuit devices
TW200509738A (en) Deposition mask, manufacturing method thereof, display unit, manufacturing method thereof, and electronic apparatus including display unit
TW200701434A (en) Integrated passive devices
ATE499725T1 (de) Modul und elektronische vorrichtung
TW200616128A (en) Semiconductor device and process for manufacturing the same and kit
EP1351293A3 (de) Kugelmatrix-Verpackung (BGA) für die Montage eines nach oben gerichteten Halbleiterchips mit zwei Substraten und Herstellungsverfahren dafür
EP1482567A4 (de) Lichtemissionsbauelement mit einem led-chip und verfahren zur herstellung dieses bauelements
SG149062A1 (en) Dicing die-bonding film
EP1675165A3 (de) Verfahren und System zur 3D Ausrichtung für Ganzscheibenintegration
ATE474286T1 (de) Verfahren und vorrichtung zum kontinuierlichen herstellen elektronischer folienbauteile sowie elektronisches folienbauteil
TW200514178A (en) Apparatus and method for removing semiconductor chip and apparatus for feeding semiconductor chips
TW200507193A (en) Adhesive sheet for dicing and die bonding and method of manufacturing semiconductor device
TW200746318A (en) Fabrication of three dimensional integrated circuit employing multiple die panels
TW200721432A (en) Semiconductor device, fabrication method therefor, and film fabrication method
EP1434262A3 (de) Halbleiteranordnung hergestellt durch Transfertechnik
TW200731485A (en) Method of making semiconductor package having exposed heat spreader
TW200605280A (en) Semiconductor device
EP1408538A4 (de) Polierelement, cmp-poliereinrichtung und herstellungsverfahren für ein halbleiterbauelement
TW200601599A (en) Semiconductor chip and circuit board, manufacturing method of same, and electronic equipment
EP1699078A4 (de) Ic-chip-anbringkörper-herstellungsverfahren und herstellungseinrichtung
TW200730051A (en) Wiring board
EP1530234A3 (de) Gehäuse für ein Leistungsbauelement mit Kühlkörper