EP1843394A3 - Halbleiter-Strahlungsquelle sowie Lichthärtgerät - Google Patents

Halbleiter-Strahlungsquelle sowie Lichthärtgerät Download PDF

Info

Publication number
EP1843394A3
EP1843394A3 EP07001222A EP07001222A EP1843394A3 EP 1843394 A3 EP1843394 A3 EP 1843394A3 EP 07001222 A EP07001222 A EP 07001222A EP 07001222 A EP07001222 A EP 07001222A EP 1843394 A3 EP1843394 A3 EP 1843394A3
Authority
EP
European Patent Office
Prior art keywords
radiation source
semi
hardening apparatus
light hardening
conductor radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07001222A
Other languages
English (en)
French (fr)
Other versions
EP1843394B1 (de
EP1843394A2 (de
Inventor
Wolfgang Plank
Bruno Senn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ivoclar Vivadent AG
Original Assignee
Ivoclar Vivadent AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ivoclar Vivadent AG filed Critical Ivoclar Vivadent AG
Publication of EP1843394A2 publication Critical patent/EP1843394A2/de
Publication of EP1843394A3 publication Critical patent/EP1843394A3/de
Application granted granted Critical
Publication of EP1843394B1 publication Critical patent/EP1843394B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C19/00—Dental auxiliary appliances
    • A61C19/003—Apparatus for curing resins by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Dentistry (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Led Device Packages (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

Es ist eine Halbleiter-Strahlungsquelle mit einem Basiskörper vorgesehen, auf dem mindestens zwei LED-Chips gelagert sind, von denen mindestens ein Chip mit einem abgleichbaren Vorwiderstand verbunden ist. Die LED-Chips (12, 14) sind in Wärmeleitverbindung auf dem Basiskörper (24) angebracht sind und auf dem Basiskörper (24) ist auch mindestens eine Printplatte (30) gelagert, die den Vorwiderstand (40, 42) trägt.
EP07001222.4A 2006-04-03 2007-01-20 Halbleiter-strahlungsquelle und lichthärtgerät mit dieser Active EP1843394B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006015335A DE102006015335B4 (de) 2006-04-03 2006-04-03 Halbleiter-Strahlungsquelle sowie Lichthärtgerät

Publications (3)

Publication Number Publication Date
EP1843394A2 EP1843394A2 (de) 2007-10-10
EP1843394A3 true EP1843394A3 (de) 2008-07-09
EP1843394B1 EP1843394B1 (de) 2019-03-27

Family

ID=38134082

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07001222.4A Active EP1843394B1 (de) 2006-04-03 2007-01-20 Halbleiter-strahlungsquelle und lichthärtgerät mit dieser

Country Status (4)

Country Link
US (1) US7595513B2 (de)
EP (1) EP1843394B1 (de)
JP (1) JP5054411B2 (de)
DE (1) DE102006015335B4 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7846391B2 (en) 2006-05-22 2010-12-07 Lumencor, Inc. Bioanalytical instrumentation using a light source subsystem
US8098375B2 (en) 2007-08-06 2012-01-17 Lumencor, Inc. Light emitting diode illumination system
DE102007049345B4 (de) * 2007-10-12 2013-06-06 Rüdiger Lanz Motorisch beweglicher, kopfbewegter Scheinwerfer
JP5405731B2 (ja) * 2007-10-23 2014-02-05 日立コンシューマエレクトロニクス株式会社 光源モジュール
KR20090104518A (ko) * 2008-03-31 2009-10-06 서울반도체 주식회사 프로젝션 시스템용 발광 다이오드 패키지
US7968902B2 (en) * 2008-03-31 2011-06-28 Bridgelux, Inc. Light emitting devices with constant forward voltage
DE102008032346A1 (de) * 2008-07-09 2010-01-14 Hella Kgaa Hueck & Co. Leuchtmittel mit mindestens einer Halbleiterlichtquelle und Verfahren zur Herstellung eines Leuchtmittels
US8242462B2 (en) 2009-01-23 2012-08-14 Lumencor, Inc. Lighting design of high quality biomedical devices
KR20100097434A (ko) * 2009-02-26 2010-09-03 삼성전자주식회사 색 온도를 조절할 수 있는 발광 패키지 및 그 제조 방법, 상기 발광 패키지의 색 온도 조절 방법
DE102010026344A1 (de) 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Leuchtdiode
EP2413391A1 (de) * 2010-07-27 2012-02-01 Cirocomm Technology Corp. Lichteinheit für eine LED-Lampe und Verfahren dafür
JP5899923B2 (ja) * 2011-12-28 2016-04-06 市光工業株式会社 車両用灯具の半導体型光源、車両用灯具の半導体型光源ユニット、車両用灯具
US9217561B2 (en) * 2012-06-15 2015-12-22 Lumencor, Inc. Solid state light source for photocuring
DE102012109177A1 (de) * 2012-09-27 2014-04-17 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
DE202013101190U1 (de) * 2013-03-20 2014-06-24 Zumtobel Lighting Gmbh Anordnung zur Lichtabgabe mit einer LED, einer Platine und einem optischen Element
US10159548B2 (en) 2014-09-17 2018-12-25 Garrison Dental Solutions, L.L.C. Dental curing light
JP6588218B2 (ja) * 2015-04-17 2019-10-09 シチズン電子株式会社 Ｌｅｄ発光装置およびその製造方法
DE102015108499A1 (de) * 2015-05-29 2016-12-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer Strahlungsquelle
CN211045429U (zh) * 2016-07-15 2020-07-17 3M创新有限公司 柔性多层构造以及lesd封装
US10718490B2 (en) * 2016-09-23 2020-07-21 Shenzhen Keweitian Eco-Lighting Co., Ltd. LED lamp bead structure having quasi-solar spectrum
JP6465460B2 (ja) * 2017-07-13 2019-02-06 東芝ライテック株式会社 照明装置、および灯具
DE102018127115A1 (de) * 2018-10-30 2020-04-30 Automotive Lighting Reutlingen Gmbh Verfahren zum Herstellen einer Lichtquellenanordnung und nach einem solchen Verfahren hergestellte Lichtquellenanordnung
EP4072632A1 (de) * 2019-12-11 2022-10-19 Sanofi Modulares system für eine arzneimittelabgabevorrichtung mit elektronischen und entsprechenden modulen und verfahren
US11373991B2 (en) 2020-02-06 2022-06-28 Lumileds Llc Methods of manufacturing light-emitting devices with metal inlays and bottom contacts
EP4186098A4 (de) * 2020-07-21 2024-10-09 Lumileds LLC Verfahren zur herstellung einer lichtemittierenden vorrichtung mit metalleinlage und topkontakten
US11575074B2 (en) 2020-07-21 2023-02-07 Lumileds Llc Light-emitting device with metal inlay and top contacts

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0509389A2 (de) * 1991-04-15 1992-10-21 Bayer Corporation Eingekapselte lichtemittierende Diode
EP0802572A2 (de) * 1996-04-20 1997-10-22 ABBPATENT GmbH SMD-Leuchtdiode
US20020177099A1 (en) * 1999-09-24 2002-11-28 Cao Group, Inc. Light for activating light-activated materials, the light including a plurality of individual chips and providing a particular spectral profile
US20040218390A1 (en) * 2003-01-24 2004-11-04 Digital Optics International Corporation High-density illumination system
US20050002191A1 (en) * 2001-05-24 2005-01-06 Masanori Shimizu Illumination light source
US20050152146A1 (en) * 2002-05-08 2005-07-14 Owen Mark D. High efficiency solid-state light source and methods of use and manufacture
WO2005067063A1 (en) * 2004-01-12 2005-07-21 Asetronics Ag Arrangement with a light emitting device on a substrate
US6930332B2 (en) * 2001-08-28 2005-08-16 Matsushita Electric Works, Ltd. Light emitting device using LED
US20060012988A1 (en) * 2004-06-30 2006-01-19 Hsiang-Cheng Hsieh Fine-tunable mixing light for light emitting diode
DE102005028176A1 (de) * 2004-06-21 2006-02-16 Citizen Electronics Co., Ltd., Fujiyoshida Leuchtdiode

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR890002811B1 (ko) * 1986-11-04 1989-07-31 삼성전자 주식회사 히트 싱크를 겸한 과전류 파괴방지용 집적회로를 내장한 발광소자 패키지
JPH0717161Y2 (ja) * 1987-07-03 1995-04-19 星和電機株式会社 面発光素子
DE8907530U1 (de) * 1988-07-27 1989-08-03 Contraves Ag, Zuerich Beleuchtungselement
US5130761A (en) * 1990-07-17 1992-07-14 Kabushiki Kaisha Toshiba Led array with reflector and printed circuit board
JPH04347901A (ja) * 1991-04-26 1992-12-03 Sumitomo Electric Ind Ltd 帯域阻止フィルタおよびその阻止帯域調整方法
JPH10163412A (ja) * 1996-12-02 1998-06-19 Fuji Electric Co Ltd 樹脂封止型混成集積回路
DE19721311C1 (de) * 1997-05-21 1998-12-03 Eka Ges Fuer Medizinisch Tech Bestrahlungsgerät zur Polymerisation von lichthärtenden Kunststoffen
JPH114022A (ja) * 1998-02-27 1999-01-06 Sanyo Electric Co Ltd 線状光源
DE19810573C2 (de) * 1998-03-11 2002-09-12 Ivoclar Vivadent Ag Lichthärtgerät
US6095812A (en) 1998-03-11 2000-08-01 Ivoclar Ag Device for curing with light
JP3656715B2 (ja) * 1999-07-23 2005-06-08 松下電工株式会社 光源装置
DE10037420A1 (de) * 2000-07-21 2002-01-31 Sli Miniature Lighting Gmbh Hochpräzise oberflächenmontierbare Leuchtdiode
JP4122742B2 (ja) * 2001-08-28 2008-07-23 松下電工株式会社 発光装置
JP2004303686A (ja) * 2003-04-01 2004-10-28 Tanimura Gangu Kenkyusho:Kk 照明装置
JP4360858B2 (ja) * 2003-07-29 2009-11-11 シチズン電子株式会社 表面実装型ｌｅｄ及びそれを用いた発光装置
JP2005158963A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP4492193B2 (ja) * 2004-04-13 2010-06-30 岡谷電機産業株式会社 表示ランプ
JP4651008B2 (ja) * 2005-02-01 2011-03-16 シチズン電子株式会社 発光ダイオード
JP5066333B2 (ja) * 2005-11-02 2012-11-07 シチズン電子株式会社 Ｌｅｄ発光装置。
JP5268082B2 (ja) * 2006-02-22 2013-08-21 シチズン電子株式会社 光半導体装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0509389A2 (de) * 1991-04-15 1992-10-21 Bayer Corporation Eingekapselte lichtemittierende Diode
EP0802572A2 (de) * 1996-04-20 1997-10-22 ABBPATENT GmbH SMD-Leuchtdiode
US20020177099A1 (en) * 1999-09-24 2002-11-28 Cao Group, Inc. Light for activating light-activated materials, the light including a plurality of individual chips and providing a particular spectral profile
US20050002191A1 (en) * 2001-05-24 2005-01-06 Masanori Shimizu Illumination light source
US6930332B2 (en) * 2001-08-28 2005-08-16 Matsushita Electric Works, Ltd. Light emitting device using LED
US20050152146A1 (en) * 2002-05-08 2005-07-14 Owen Mark D. High efficiency solid-state light source and methods of use and manufacture
US20040218390A1 (en) * 2003-01-24 2004-11-04 Digital Optics International Corporation High-density illumination system
WO2005067063A1 (en) * 2004-01-12 2005-07-21 Asetronics Ag Arrangement with a light emitting device on a substrate
DE102005028176A1 (de) * 2004-06-21 2006-02-16 Citizen Electronics Co., Ltd., Fujiyoshida Leuchtdiode
US20060012988A1 (en) * 2004-06-30 2006-01-19 Hsiang-Cheng Hsieh Fine-tunable mixing light for light emitting diode

Also Published As

Publication number Publication date
US20070228516A1 (en) 2007-10-04
JP5054411B2 (ja) 2012-10-24
US7595513B2 (en) 2009-09-29
DE102006015335B4 (de) 2013-05-02
JP2007281471A (ja) 2007-10-25
EP1843394B1 (de) 2019-03-27
EP1843394A2 (de) 2007-10-10
DE102006015335A1 (de) 2007-10-11

Similar Documents

Publication Publication Date Title
EP1843394A3 (de) Halbleiter-Strahlungsquelle sowie Lichthärtgerät
DE102004047681B4 (de) LED-Schaltungsanordnung mit einem Diodengleichrichter
ATE546836T1 (de) Anwendung einer transparenten leuchtdiodenanzeigevorrichtung in einem kraftfahrzeug
DE112008001425T5 (de) Verbindungsvorrichtung, die eine Wärmesenke sowie elektrische Verbindungen zwischen einem Wärme erzeugenden Bauelement und einer Stromversorgungsquelle bildet
WO2016005069A1 (de) Halbleiterlampe
WO2010094534A2 (de) Starrflexible trägerplatte
DE202010001128U1 (de) LED-Leuchtvorrichtung mit größerem Leuchtwinkel
DE202009017522U1 (de) LED-Einbauleuchte mit Kühlkörper
EP1968115A3 (de) Lichtemissionsvorrichtung
EP1843080A3 (de) Halbleiter-Strahlungsquelle
EP1770773A3 (de) Wärmeverteilmodul und seine Herstellung
DE202010013037U1 (de) Demontierbare Leuchtröhre für Beleuchtungszwecke
EP1770793A3 (de) Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements
DE102012221229A1 (de) Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
DE102014109717A1 (de) Substrat, Licht emittierende Vorrichtung, Beleuchtungslichtquelle und Leuchteinrichtung
AT520982A3 (de) Leuchte, Gehäusekomponente für eine Leuchte, sowie Verfahren zur Herstellung einer Leuchte
EP2287519A3 (de) LED-Modul, Verfahren zu dessen Herstellung und LED-Beleuchtungs-Vorrichtung
AT13183U1 (de) Linsenhalter für leds
DE202016106624U1 (de) Lichtemittierendes Modul und Beleuchtungseinrichtung mit solch einem Modul
EP1414065A3 (de) Leistungsbauelementanordnung zur mechatronischen integration von Leistungsbauelementen
EP2216592A2 (de) Lampe
DE212013000310U1 (de) LED-Photovoltaik-Modul
DE29514090U1 (de) Gehäuselose Rettungszeichenleuchte
DE102006037481A1 (de) Scheinwerfermodul für ein Fahrzeug
EP1526402A3 (de) Optisches Anordnungsmodul

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK RS

17P Request for examination filed

Effective date: 20080804

17Q First examination report despatched

Effective date: 20080910

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 502007016627

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01L0025160000

Ipc: H01L0025075000

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 25/075 20060101AFI20180926BHEP

Ipc: A61C 19/00 20060101ALI20180926BHEP

Ipc: H01L 25/16 20060101ALI20180926BHEP

Ipc: H01L 33/62 20100101ALN20180926BHEP

Ipc: A61C 13/15 20060101ALI20180926BHEP

Ipc: H01L 33/64 20100101ALN20180926BHEP

Ipc: H01L 33/60 20100101ALN20180926BHEP

INTG Intention to grant announced

Effective date: 20181015

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 33/62 20100101ALN20180926BHEP

Ipc: H01L 25/16 20060101ALI20180926BHEP

Ipc: A61C 13/15 20060101ALI20180926BHEP

Ipc: A61C 19/00 20060101ALI20180926BHEP

Ipc: H01L 25/075 20060101AFI20180926BHEP

Ipc: H01L 33/64 20100101ALN20180926BHEP

Ipc: H01L 33/60 20100101ALN20180926BHEP

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 502007016627

Country of ref document: DE

Representative=s name: SPLANEMANN PATENTANWAELTE PARTNERSCHAFT MBB, DE

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502007016627

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1114044

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190415

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: KELLER AND PARTNER PATENTANWAELTE AG, CH

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20190327

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190628

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190627

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190727

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190727

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502007016627

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

26N No opposition filed

Effective date: 20200103

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 502007016627

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: SE

Ref legal event code: EUG

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20200120

REG Reference to a national code

Ref country code: SE

Ref legal event code: EUG

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20200131

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200801

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200120

Ref country code: SE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200121

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200120

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200131

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200131

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200131

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200131

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200120

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200120

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 1114044

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200120

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200120

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190327