ATE554142T1 - Härtbare silikonharzzusammensetzung, gehärtetes produkt daraus und opake silikonklebefolie aus der zusammensetzung - Google Patents

Härtbare silikonharzzusammensetzung, gehärtetes produkt daraus und opake silikonklebefolie aus der zusammensetzung

Info

Publication number
ATE554142T1
ATE554142T1 AT09011620T AT09011620T ATE554142T1 AT E554142 T1 ATE554142 T1 AT E554142T1 AT 09011620 T AT09011620 T AT 09011620T AT 09011620 T AT09011620 T AT 09011620T AT E554142 T1 ATE554142 T1 AT E554142T1
Authority
AT
Austria
Prior art keywords
composition
opaque
adhesive film
film made
resin composition
Prior art date
Application number
AT09011620T
Other languages
English (en)
Inventor
Tsutomu Kashiwagi
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Application granted granted Critical
Publication of ATE554142T1 publication Critical patent/ATE554142T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
  • Laminated Bodies (AREA)
AT09011620T 2008-09-11 2009-09-10 Härtbare silikonharzzusammensetzung, gehärtetes produkt daraus und opake silikonklebefolie aus der zusammensetzung ATE554142T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008233104 2008-09-11

Publications (1)

Publication Number Publication Date
ATE554142T1 true ATE554142T1 (de) 2012-05-15

Family

ID=41280422

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09011620T ATE554142T1 (de) 2008-09-11 2009-09-10 Härtbare silikonharzzusammensetzung, gehärtetes produkt daraus und opake silikonklebefolie aus der zusammensetzung

Country Status (5)

Country Link
US (2) US20100059177A1 (de)
EP (1) EP2163584B1 (de)
JP (1) JP2010090363A (de)
AT (1) ATE554142T1 (de)
TW (1) TW201022333A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9464191B2 (en) 2011-08-10 2016-10-11 Adeka Corporation Silicon-containing curing composition and cured product thereof
JP5848572B2 (ja) * 2011-10-04 2016-01-27 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
US11191435B2 (en) * 2013-01-22 2021-12-07 Seno Medical Instruments, Inc. Probe with optoacoustic isolator
US11287309B2 (en) 2011-11-02 2022-03-29 Seno Medical Instruments, Inc. Optoacoustic component utilization tracking
KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
TWI506058B (zh) 2014-03-18 2015-11-01 Benq Materials Corp 可固化矽樹脂組成物
EP3907074A4 (de) * 2018-12-27 2022-09-14 Nissan Chemical Corporation Haftzusammensetzung zur ablösung durch optische bestrahlung, laminatkörper, herstellungsverfahren und abziehverfahren
CN113396187B (zh) * 2019-01-29 2023-05-23 松下知识产权经营株式会社 冲击吸收材
US12139634B2 (en) * 2020-04-14 2024-11-12 Shin-Etsu Chemical Co., Ltd. Silylated isocyanurate compound, metal corrosion inhibitor, curable organosilicon resin composition, and semiconductor apparatus
KR20230042270A (ko) 2020-07-21 2023-03-28 파나소닉 홀딩스 코퍼레이션 충격 흡수재

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001013513A (ja) 1999-06-30 2001-01-19 Optrex Corp 液晶表示素子
JP4101469B2 (ja) 2001-04-10 2008-06-18 信越化学工業株式会社 半導電性シリコーンゴム組成物
WO2005032227A1 (ja) * 2003-09-29 2005-04-07 Ibiden Co., Ltd. プリント配線板用層間絶縁層、プリント配線板およびその製造方法
DE102004036573A1 (de) * 2004-07-28 2006-03-23 Ge Bayer Silicones Gmbh & Co. Kg Verwendung lichtaktivierbarer, härtbarer Silikonzusammensetzungen zur Herstellung von dickwandigen Formartikeln oder dickwandigen Beschichtungen
JP4816951B2 (ja) * 2005-12-06 2011-11-16 信越化学工業株式会社 シリコーン組成物及びその硬化物
US7553915B2 (en) * 2005-12-06 2009-06-30 Shin-Etsu Chemical Co., Ltd. Silicone composition and cured product
JP4902190B2 (ja) * 2005-12-20 2012-03-21 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP4636275B2 (ja) * 2006-07-18 2011-02-23 信越化学工業株式会社 シリコーン樹脂組成物で封止された半導体装置及び該半導体装置封止用シリコーン樹脂タブレット

Also Published As

Publication number Publication date
US20100059177A1 (en) 2010-03-11
EP2163584B1 (de) 2012-04-18
JP2010090363A (ja) 2010-04-22
TW201022333A (en) 2010-06-16
US20120261068A1 (en) 2012-10-18
EP2163584A1 (de) 2010-03-17

Similar Documents

Publication Publication Date Title
ATE554142T1 (de) Härtbare silikonharzzusammensetzung, gehärtetes produkt daraus und opake silikonklebefolie aus der zusammensetzung
KR102615831B1 (ko) 경화 반응성 오가노폴리실록산 조성물, 이를 이용한 감압 접착제 조성물 및 그 사용
JP2013525551A5 (de)
ATE528357T1 (de) Silikonbeschichtungszusammensetzungen
JP5426873B2 (ja) 両面粘着性シリコーンゴムシート及びその製造方法
TW200738843A (en) Double-faced pressure-sensitive adhesive tape or sheet, and liquid crystal display apparatus
WO2017068762A1 (en) Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film
WO2009107757A3 (en) Heat conductive cured product and making method
EP2192167A4 (de) Haftzusammensetzung für elektronische zusammensetzungen und haftfolie für elektronische zusammensetzungen damit
TW200734426A (en) Pressure-sensitive adhesive tape or sheet having light-reflective property and/or light-shielding property, and liquid crystal display apparatus
WO2009011353A9 (ja) 樹脂組成物及び画像表示装置
TW200734403A (en) Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
JP2008531824A5 (de)
WO2012060267A1 (ja) ハードコート層付ポリカーボネート
CN109415565B (zh) 固化性聚有机硅氧烷组合物及其用途
KR102087413B1 (ko) 박리 불량을 방지할 수 있는 이형필름
BRPI0520282A2 (pt) composição curável por calor, composição adesiva, produtos de reação curados, pelìcula adesiva, composição sintática, pré-impregnado, estopa pré-impregnada, e, processo para produzir uma composição curável por calor
TW201525097A (zh) 附黏著層之透明面材及顯示裝置
KR20170110793A (ko) 굴절률 정합 박막
DE602006003085D1 (de) Härtbare silikonzusammensetzung und elektronische komponenten
KR20080095202A (ko) 실리콘 겔 시트의 제조 방법
Kowalewska et al. Synergistic self-healing enhancement in multifunctional silicone elastomers and their application in smart materials
JPS63265982A (ja) 光硬化性ガラス接着用組成物
TW200628493A (en) Photocurable resin composition and optical disk adhesive
TWI688581B (zh) (甲基)丙烯酸酯樹脂之製造方法及光學構件之製造方法、硬化性組成物之製造方法、硬化物之製造方法