ATE71475T1 - Herstellungsverfahren einer niedergeschlagenen schicht. - Google Patents
Herstellungsverfahren einer niedergeschlagenen schicht.Info
- Publication number
- ATE71475T1 ATE71475T1 AT86309871T AT86309871T ATE71475T1 AT E71475 T1 ATE71475 T1 AT E71475T1 AT 86309871 T AT86309871 T AT 86309871T AT 86309871 T AT86309871 T AT 86309871T AT E71475 T1 ATE71475 T1 AT E71475T1
- Authority
- AT
- Austria
- Prior art keywords
- deposited film
- gaseous
- manufacturing process
- introducing
- deposited layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
- H10P14/3411—Silicon, silicon germanium or germanium
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording-members for original recording by exposure, e.g. to light, to heat or to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/02—Charge-receiving layers
- G03G5/04—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
- G03G5/08—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic
- G03G5/082—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic and not being incorporated in a bonding material, e.g. vacuum deposited
- G03G5/08214—Silicon-based
- G03G5/08278—Depositing methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/17—Photovoltaic cells having only PIN junction potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
- H10F71/103—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2922—Materials being non-crystalline insulating materials, e.g. glass or polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2923—Materials being conductive materials, e.g. metallic silicides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3204—Materials thereof being Group IVA semiconducting materials
- H10P14/3211—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3242—Structure
- H10P14/3244—Layer structure
- H10P14/3251—Layer structure consisting of three or more layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3442—N-type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3444—P-type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Vapour Deposition (AREA)
- Photoreceptors In Electrophotography (AREA)
- Photovoltaic Devices (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60295302A JPH0651906B2 (ja) | 1985-12-25 | 1985-12-25 | 堆積膜形成法 |
| EP86309871A EP0228870B1 (de) | 1985-12-25 | 1986-12-17 | Herstellungsverfahren einer niedergeschlagenen Schicht |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE71475T1 true ATE71475T1 (de) | 1992-01-15 |
Family
ID=17818848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT86309871T ATE71475T1 (de) | 1985-12-25 | 1986-12-17 | Herstellungsverfahren einer niedergeschlagenen schicht. |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4822636A (de) |
| EP (1) | EP0228870B1 (de) |
| JP (1) | JPH0651906B2 (de) |
| CN (1) | CN1018659B (de) |
| AT (1) | ATE71475T1 (de) |
| AU (1) | AU586525B2 (de) |
| CA (1) | CA1315616C (de) |
| DE (1) | DE3683364D1 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01183111A (ja) * | 1988-01-18 | 1989-07-20 | Seiko Epson Corp | 多結晶シリコン薄膜の製造方法 |
| JP3073327B2 (ja) * | 1992-06-30 | 2000-08-07 | キヤノン株式会社 | 堆積膜形成方法 |
| CN1076717C (zh) * | 1994-07-09 | 2001-12-26 | 山东大学 | 钛酸镁薄膜的制备方法 |
| CN1064416C (zh) * | 1996-05-02 | 2001-04-11 | 上海石油化工股份有限公司 | 可染细旦聚丙烯纤维的制造方法 |
| US5876503A (en) * | 1996-11-27 | 1999-03-02 | Advanced Technology Materials, Inc. | Multiple vaporizer reagent supply system for chemical vapor deposition utilizing dissimilar precursor compositions |
| US6329270B1 (en) * | 1997-03-07 | 2001-12-11 | Sharp Laboratories Of America, Inc. | Laser annealed microcrystalline film and method for same |
| US9920844B2 (en) | 2014-11-26 | 2018-03-20 | Lam Research Corporation | Valve manifold deadleg elimination via reentrant flow path |
| US9631276B2 (en) * | 2014-11-26 | 2017-04-25 | Lam Research Corporation | Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition |
| US11661654B2 (en) | 2018-04-18 | 2023-05-30 | Lam Research Corporation | Substrate processing systems including gas delivery system with reduced dead legs |
Family Cites Families (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US31708A (en) * | 1861-03-19 | Improved device for coating pins | ||
| US2552626A (en) * | 1948-02-17 | 1951-05-15 | Bell Telephone Labor Inc | Silicon-germanium resistor and method of making it |
| US3083550A (en) * | 1961-02-23 | 1963-04-02 | Alloyd Corp | Process of coating vitreous filaments |
| US3188230A (en) * | 1961-03-16 | 1965-06-08 | Alloyd Corp | Vapor deposition process and device |
| US3203827A (en) * | 1962-06-26 | 1965-08-31 | Union Carbide Corp | Chromium plating process |
| US3224912A (en) * | 1962-07-13 | 1965-12-21 | Monsanto Co | Use of hydrogen halide and hydrogen in separate streams as carrier gases in vapor deposition of ii-vi compounds |
| US3218204A (en) * | 1962-07-13 | 1965-11-16 | Monsanto Co | Use of hydrogen halide as a carrier gas in forming ii-vi compound from a crude ii-vicompound |
| US3306768A (en) * | 1964-01-08 | 1967-02-28 | Motorola Inc | Method of forming thin oxide films |
| US3466191A (en) * | 1966-11-07 | 1969-09-09 | Us Army | Method of vacuum deposition of piezoelectric films of cadmium sulfide |
| US3473978A (en) * | 1967-04-24 | 1969-10-21 | Motorola Inc | Epitaxial growth of germanium |
| US3655429A (en) * | 1969-04-16 | 1972-04-11 | Westinghouse Electric Corp | Method of forming thin insulating films particularly for piezoelectric transducers |
| US3664866A (en) * | 1970-04-08 | 1972-05-23 | North American Rockwell | Composite, method for growth of ii{11 {14 vi{11 {0 compounds on substrates, and process for making composition for the compounds |
| US3870558A (en) * | 1971-08-17 | 1975-03-11 | Tokyo Shibouro Electric Co Ltd | Process for preparing a layer of compounds of groups II and VI |
| US3984587A (en) * | 1973-07-23 | 1976-10-05 | Rca Corporation | Chemical vapor deposition of luminescent films |
| US3888705A (en) * | 1973-12-19 | 1975-06-10 | Nasa | Vapor phase growth of groups iii-v compounds by hydrogen chloride transport of the elements |
| USRE31708E (en) | 1976-11-01 | 1984-10-16 | Method of depositing electrically conductive, infra-red reflective, transparent coatings of stannic oxide | |
| US4146657A (en) * | 1976-11-01 | 1979-03-27 | Gordon Roy G | Method of depositing electrically conductive, infra-red reflective, transparent coatings of stannic oxide |
| US4180596A (en) * | 1977-06-30 | 1979-12-25 | International Business Machines Corporation | Method for providing a metal silicide layer on a substrate |
| GB2038883B (en) * | 1978-11-09 | 1982-12-08 | Standard Telephones Cables Ltd | Metallizing semiconductor devices |
| GB2038086A (en) * | 1978-12-19 | 1980-07-16 | Standard Telephones Cables Ltd | Amorphous semiconductor devices |
| US4239811A (en) * | 1979-08-16 | 1980-12-16 | International Business Machines Corporation | Low pressure chemical vapor deposition of silicon dioxide with oxygen enhancement of the chlorosilane-nitrous oxide reaction |
| EP0040939B1 (de) * | 1980-05-27 | 1985-01-02 | The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and | Herstellung von Cadmium-Quecksilber-Telluriden |
| JPS5710920A (en) * | 1980-06-23 | 1982-01-20 | Canon Inc | Film forming process |
| SE451353B (sv) * | 1980-09-09 | 1987-09-28 | Energy Conversion Devices Inc | Fotokensligt, amorft flercellsdon |
| US4522663A (en) * | 1980-09-09 | 1985-06-11 | Sovonics Solar Systems | Method for optimizing photoresponsive amorphous alloys and devices |
| JPS5767938A (en) * | 1980-10-16 | 1982-04-24 | Canon Inc | Production of photoconductive member |
| US4357179A (en) * | 1980-12-23 | 1982-11-02 | Bell Telephone Laboratories, Incorporated | Method for producing devices comprising high density amorphous silicon or germanium layers by low pressure CVD technique |
| US4421592A (en) * | 1981-05-22 | 1983-12-20 | United Technologies Corporation | Plasma enhanced deposition of semiconductors |
| US4402762A (en) * | 1981-06-02 | 1983-09-06 | John Puthenveetil K | Method of making highly stable modified amorphous silicon and germanium films |
| US4359490A (en) * | 1981-07-13 | 1982-11-16 | Fairchild Camera & Instrument Corp. | Method for LPCVD co-deposition of metal and silicon to form metal silicide |
| JPS6053745B2 (ja) * | 1981-07-31 | 1985-11-27 | アルバツク成膜株式会社 | 二元蒸着によつて不均質光学的薄膜を形成する方法 |
| JPS5833829A (ja) * | 1981-08-24 | 1983-02-28 | Toshiba Corp | 薄膜形成装置 |
| US4652463A (en) * | 1982-03-29 | 1987-03-24 | Hughes Aircraft | Process for depositing a conductive oxide layer |
| JPS58170536A (ja) * | 1982-03-31 | 1983-10-07 | Fujitsu Ltd | プラズマ処理方法及びその装置 |
| JPS58188129A (ja) * | 1982-04-28 | 1983-11-02 | Ricoh Co Ltd | 非晶質半導体の製造方法 |
| US4462847A (en) * | 1982-06-21 | 1984-07-31 | Texas Instruments Incorporated | Fabrication of dielectrically isolated microelectronic semiconductor circuits utilizing selective growth by low pressure vapor deposition |
| JPS5911620A (ja) * | 1982-07-12 | 1984-01-21 | Ricoh Co Ltd | 非晶質半導体の製造方法 |
| US4615905A (en) * | 1982-09-24 | 1986-10-07 | Sovonics Solar Systems, Inc. | Method of depositing semiconductor films by free radical generation |
| US4504518A (en) * | 1982-09-24 | 1985-03-12 | Energy Conversion Devices, Inc. | Method of making amorphous semiconductor alloys and devices using microwave energy |
| US4517223A (en) * | 1982-09-24 | 1985-05-14 | Sovonics Solar Systems | Method of making amorphous semiconductor alloys and devices using microwave energy |
| US4515107A (en) * | 1982-11-12 | 1985-05-07 | Sovonics Solar Systems | Apparatus for the manufacture of photovoltaic devices |
| JPS59119359A (ja) * | 1982-12-27 | 1984-07-10 | Canon Inc | 電子写真用光導電部材 |
| JPS59159167A (ja) * | 1983-03-01 | 1984-09-08 | Zenko Hirose | アモルフアスシリコン膜の形成方法 |
| JPS59199035A (ja) * | 1983-04-26 | 1984-11-12 | Fuji Electric Corp Res & Dev Ltd | 薄膜生成装置 |
| JPS6026664A (ja) * | 1983-07-22 | 1985-02-09 | Canon Inc | アモルフアスシリコン堆積膜形成法 |
| DE3429899A1 (de) * | 1983-08-16 | 1985-03-07 | Canon K.K., Tokio/Tokyo | Verfahren zur bildung eines abscheidungsfilms |
| JPS6043819A (ja) * | 1983-08-19 | 1985-03-08 | Semiconductor Energy Lab Co Ltd | 気相反応方法 |
| US4637938A (en) * | 1983-08-19 | 1987-01-20 | Energy Conversion Devices, Inc. | Methods of using selective optical excitation in deposition processes and the detection of new compositions |
| US4526809A (en) * | 1983-10-19 | 1985-07-02 | University Of Delaware | Process and apparatus for formation of photovoltaic compounds |
| US4546008A (en) * | 1983-11-07 | 1985-10-08 | Canon Kabushiki Kaisha | Method for forming a deposition film |
| US4645689A (en) * | 1984-02-17 | 1987-02-24 | At&T Bell Laboratories | Deposition technique |
| JPS60243663A (ja) * | 1984-05-18 | 1985-12-03 | Kyocera Corp | 電子写真感光体 |
| US4595601A (en) * | 1984-05-25 | 1986-06-17 | Kabushiki Kaisha Toshiba | Method of selectively forming an insulation layer |
| US4624736A (en) * | 1984-07-24 | 1986-11-25 | The United States Of America As Represented By The United States Department Of Energy | Laser/plasma chemical processing of substrates |
| US4657777A (en) * | 1984-12-17 | 1987-04-14 | Canon Kabushiki Kaisha | Formation of deposited film |
| JPH07101751B2 (ja) * | 1985-03-28 | 1995-11-01 | キヤノン株式会社 | 光起電力素子の製造方法 |
| JPH0647730B2 (ja) * | 1985-12-25 | 1994-06-22 | キヤノン株式会社 | 堆積膜形成法 |
-
1985
- 1985-12-25 JP JP60295302A patent/JPH0651906B2/ja not_active Expired - Lifetime
-
1986
- 1986-12-16 US US06/942,214 patent/US4822636A/en not_active Expired - Lifetime
- 1986-12-17 AU AU66645/86A patent/AU586525B2/en not_active Expired
- 1986-12-17 DE DE8686309871T patent/DE3683364D1/de not_active Expired - Lifetime
- 1986-12-17 EP EP86309871A patent/EP0228870B1/de not_active Expired - Lifetime
- 1986-12-17 AT AT86309871T patent/ATE71475T1/de active
- 1986-12-24 CA CA000526324A patent/CA1315616C/en not_active Expired - Lifetime
- 1986-12-25 CN CN86108685A patent/CN1018659B/zh not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| EP0228870A3 (en) | 1988-11-17 |
| AU586525B2 (en) | 1989-07-13 |
| CA1315616C (en) | 1993-04-06 |
| JPH0651906B2 (ja) | 1994-07-06 |
| EP0228870A2 (de) | 1987-07-15 |
| US4822636A (en) | 1989-04-18 |
| CN86108685A (zh) | 1987-07-29 |
| EP0228870B1 (de) | 1992-01-08 |
| JPS62151572A (ja) | 1987-07-06 |
| DE3683364D1 (de) | 1992-02-20 |
| CN1018659B (zh) | 1992-10-14 |
| AU6664586A (en) | 1987-07-02 |
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