BE814281A - Procede pour la fabrication d'une multiplicite de microplaquettes semiconductrices - Google Patents

Procede pour la fabrication d'une multiplicite de microplaquettes semiconductrices

Info

Publication number
BE814281A
BE814281A BE143701A BE143701A BE814281A BE 814281 A BE814281 A BE 814281A BE 143701 A BE143701 A BE 143701A BE 143701 A BE143701 A BE 143701A BE 814281 A BE814281 A BE 814281A
Authority
BE
Belgium
Prior art keywords
microplatelets
multiplicity
semiconductor
manufacture
semiconductor microplatelets
Prior art date
Application number
BE143701A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE814281A publication Critical patent/BE814281A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
BE143701A 1973-04-30 1974-04-26 Procede pour la fabrication d'une multiplicite de microplaquettes semiconductrices BE814281A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35571873A 1973-04-30 1973-04-30
US500164A US3924323A (en) 1973-04-30 1974-08-23 Method of making a multiplicity of multiple-device semiconductor chips and article so produced

Publications (1)

Publication Number Publication Date
BE814281A true BE814281A (fr) 1974-08-16

Family

ID=26998976

Family Applications (1)

Application Number Title Priority Date Filing Date
BE143701A BE814281A (fr) 1973-04-30 1974-04-26 Procede pour la fabrication d'une multiplicite de microplaquettes semiconductrices

Country Status (7)

Country Link
US (1) US3924323A (fr)
BE (1) BE814281A (fr)
CA (1) CA1003122A (fr)
DE (1) DE2418813A1 (fr)
FR (1) FR2227641B1 (fr)
GB (1) GB1462275A (fr)
NL (1) NL7405760A (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2930460C2 (de) * 1979-07-27 1986-07-17 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zum Herstellen hochspannungsfester Mesadioden
FR2524707B1 (fr) * 1982-04-01 1985-05-31 Cit Alcatel Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
DE3524301A1 (de) * 1985-07-06 1987-01-15 Semikron Gleichrichterbau Verfahren zum herstellen von halbleiterelementen
DE3931495C2 (de) * 1989-09-21 1997-06-26 Itt Ind Gmbh Deutsche Verfahren zur "fließenden" Feinklassifizierung von Kapazitätsdioden
US5521125A (en) * 1994-10-28 1996-05-28 Xerox Corporation Precision dicing of silicon chips from a wafer
US6083811A (en) * 1996-02-07 2000-07-04 Northrop Grumman Corporation Method for producing thin dice from fragile materials
US5904546A (en) * 1996-02-12 1999-05-18 Micron Technology, Inc. Method and apparatus for dicing semiconductor wafers
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
KR19990063586A (ko) * 1996-07-12 1999-07-26 아끼구사 나오유끼 반도체 장치의 제조 방법 및 반도체 장치 제조용 금형 및 반도체 장치 및 그 실장방법
US6365438B1 (en) * 1997-05-09 2002-04-02 Citizen Watch Co., Ltd. Process for manufacturing semiconductor package and circuit board assembly
FR2782843B1 (fr) * 1998-08-25 2000-09-29 Commissariat Energie Atomique Procede d'isolation physique de regions d'une plaque de substrat
DE19850873A1 (de) 1998-11-05 2000-05-11 Philips Corp Intellectual Pty Verfahren zum Bearbeiten eines Erzeugnisses der Halbleitertechnik
US6569343B1 (en) * 1999-07-02 2003-05-27 Canon Kabushiki Kaisha Method for producing liquid discharge head, liquid discharge head, head cartridge, liquid discharging recording apparatus, method for producing silicon plate and silicon plate
JP4403631B2 (ja) * 2000-04-24 2010-01-27 ソニー株式会社 チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法
JP2001313350A (ja) * 2000-04-28 2001-11-09 Sony Corp チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法
JP3631956B2 (ja) * 2000-05-12 2005-03-23 富士通株式会社 半導体チップの実装方法
DE10202881B4 (de) * 2002-01-25 2007-09-20 Infineon Technologies Ag Verfahren zur Herstellung von Halbleiterchips mit einer Chipkantenschutzschicht, insondere für Wafer Level Packaging Chips
US6608370B1 (en) * 2002-01-28 2003-08-19 Motorola, Inc. Semiconductor wafer having a thin die and tethers and methods of making the same
AU2003234403A1 (en) * 2002-05-16 2003-12-02 Nova Research, Inc. Methods of fabricating magnetoresistive memory devices
US7169691B2 (en) * 2004-01-29 2007-01-30 Micron Technology, Inc. Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
TWI294168B (en) * 2006-04-18 2008-03-01 Siliconware Precision Industries Co Ltd Semiconductor package and substrate with array arrangement thereof and method for fabricating the same
US8212369B2 (en) * 2007-01-31 2012-07-03 Henkel Ag & Co. Kgaa Semiconductor wafer coated with a filled, spin-coatable material
EP2109881B1 (fr) * 2007-01-31 2018-09-26 Henkel AG & Co. KGaA Plaquette semi-conductrice revetue d'un materiau charge applicable par centrifugation
US20170330855A1 (en) * 2016-05-13 2017-11-16 Taiwan Semiconductor Manufacturing Company, Ltd. System and Method for Immersion Bonding

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2748041A (en) * 1952-08-30 1956-05-29 Rca Corp Semiconductor devices and their manufacture
US3411200A (en) * 1965-04-14 1968-11-19 Westinghouse Electric Corp Fabrication of semiconductor integrated circuits
US3343255A (en) * 1965-06-14 1967-09-26 Westinghouse Electric Corp Structures for semiconductor integrated circuits and methods of forming them
US3689357A (en) * 1970-12-10 1972-09-05 Gen Motors Corp Glass-polysilicon dielectric isolation

Also Published As

Publication number Publication date
US3924323A (en) 1975-12-09
GB1462275A (en) 1977-01-19
DE2418813A1 (de) 1974-11-14
AU6819674A (en) 1975-10-23
FR2227641B1 (fr) 1979-02-16
NL7405760A (fr) 1974-11-01
FR2227641A1 (fr) 1974-11-22
CA1003122A (en) 1977-01-04

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