NL7405760A - - Google Patents
Info
- Publication number
- NL7405760A NL7405760A NL7405760A NL7405760A NL7405760A NL 7405760 A NL7405760 A NL 7405760A NL 7405760 A NL7405760 A NL 7405760A NL 7405760 A NL7405760 A NL 7405760A NL 7405760 A NL7405760 A NL 7405760A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/014—Manufacture or treatment using batch processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/019—Manufacture or treatment using temporary auxiliary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35571873A | 1973-04-30 | 1973-04-30 | |
| US500164A US3924323A (en) | 1973-04-30 | 1974-08-23 | Method of making a multiplicity of multiple-device semiconductor chips and article so produced |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7405760A true NL7405760A (fr) | 1974-11-01 |
Family
ID=26998976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7405760A NL7405760A (fr) | 1973-04-30 | 1974-04-29 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3924323A (fr) |
| BE (1) | BE814281A (fr) |
| CA (1) | CA1003122A (fr) |
| DE (1) | DE2418813A1 (fr) |
| FR (1) | FR2227641B1 (fr) |
| GB (1) | GB1462275A (fr) |
| NL (1) | NL7405760A (fr) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2930460C2 (de) * | 1979-07-27 | 1986-07-17 | Telefunken electronic GmbH, 7100 Heilbronn | Verfahren zum Herstellen hochspannungsfester Mesadioden |
| FR2524707B1 (fr) * | 1982-04-01 | 1985-05-31 | Cit Alcatel | Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus |
| DE3524301A1 (de) * | 1985-07-06 | 1987-01-15 | Semikron Gleichrichterbau | Verfahren zum herstellen von halbleiterelementen |
| DE3931495C2 (de) * | 1989-09-21 | 1997-06-26 | Itt Ind Gmbh Deutsche | Verfahren zur "fließenden" Feinklassifizierung von Kapazitätsdioden |
| US5521125A (en) * | 1994-10-28 | 1996-05-28 | Xerox Corporation | Precision dicing of silicon chips from a wafer |
| US6083811A (en) * | 1996-02-07 | 2000-07-04 | Northrop Grumman Corporation | Method for producing thin dice from fragile materials |
| US5904546A (en) * | 1996-02-12 | 1999-05-18 | Micron Technology, Inc. | Method and apparatus for dicing semiconductor wafers |
| EP0853337B1 (fr) * | 1996-07-12 | 2004-09-29 | Fujitsu Limited | Procede de fabrication d'un dispositif a semiconducteur |
| US6881611B1 (en) | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
| EP2015359B1 (fr) * | 1997-05-09 | 2015-12-23 | Citizen Holdings Co., Ltd. | Procédé de production d'un boîtier pour semi-conducteur et système de carte de circuits |
| FR2782843B1 (fr) * | 1998-08-25 | 2000-09-29 | Commissariat Energie Atomique | Procede d'isolation physique de regions d'une plaque de substrat |
| DE19850873A1 (de) | 1998-11-05 | 2000-05-11 | Philips Corp Intellectual Pty | Verfahren zum Bearbeiten eines Erzeugnisses der Halbleitertechnik |
| EP1065059B1 (fr) * | 1999-07-02 | 2007-01-31 | Canon Kabushiki Kaisha | Procédé de production d'une tête à éjection de liquide, tête à éjection de liquide ainsi produite, cartouche, appareil d'éjection de liquide, procédé de production d'une plaque de silicium et plaque de silicium ainsi produite |
| JP4403631B2 (ja) * | 2000-04-24 | 2010-01-27 | ソニー株式会社 | チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法 |
| JP2001313350A (ja) * | 2000-04-28 | 2001-11-09 | Sony Corp | チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法 |
| JP3631956B2 (ja) * | 2000-05-12 | 2005-03-23 | 富士通株式会社 | 半導体チップの実装方法 |
| DE10202881B4 (de) * | 2002-01-25 | 2007-09-20 | Infineon Technologies Ag | Verfahren zur Herstellung von Halbleiterchips mit einer Chipkantenschutzschicht, insondere für Wafer Level Packaging Chips |
| US6608370B1 (en) * | 2002-01-28 | 2003-08-19 | Motorola, Inc. | Semiconductor wafer having a thin die and tethers and methods of making the same |
| US6927073B2 (en) * | 2002-05-16 | 2005-08-09 | Nova Research, Inc. | Methods of fabricating magnetoresistive memory devices |
| US7169691B2 (en) * | 2004-01-29 | 2007-01-30 | Micron Technology, Inc. | Method of fabricating wafer-level packaging with sidewall passivation and related apparatus |
| TWI294168B (en) * | 2006-04-18 | 2008-03-01 | Siliconware Precision Industries Co Ltd | Semiconductor package and substrate with array arrangement thereof and method for fabricating the same |
| US8212369B2 (en) * | 2007-01-31 | 2012-07-03 | Henkel Ag & Co. Kgaa | Semiconductor wafer coated with a filled, spin-coatable material |
| WO2008094149A1 (fr) * | 2007-01-31 | 2008-08-07 | Henkel Ag & Co. Kgaa | Plaquette semi-conductrice revêtue d'un matériau chargé applicable par centrifugation |
| US20170330855A1 (en) * | 2016-05-13 | 2017-11-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and Method for Immersion Bonding |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2748041A (en) * | 1952-08-30 | 1956-05-29 | Rca Corp | Semiconductor devices and their manufacture |
| US3411200A (en) * | 1965-04-14 | 1968-11-19 | Westinghouse Electric Corp | Fabrication of semiconductor integrated circuits |
| US3343255A (en) * | 1965-06-14 | 1967-09-26 | Westinghouse Electric Corp | Structures for semiconductor integrated circuits and methods of forming them |
| US3689357A (en) * | 1970-12-10 | 1972-09-05 | Gen Motors Corp | Glass-polysilicon dielectric isolation |
-
1974
- 1974-04-08 CA CA196,998A patent/CA1003122A/en not_active Expired
- 1974-04-19 DE DE2418813A patent/DE2418813A1/de active Pending
- 1974-04-23 GB GB1770574A patent/GB1462275A/en not_active Expired
- 1974-04-26 FR FR7414628A patent/FR2227641B1/fr not_active Expired
- 1974-04-26 BE BE143701A patent/BE814281A/fr unknown
- 1974-04-29 NL NL7405760A patent/NL7405760A/xx unknown
- 1974-08-23 US US500164A patent/US3924323A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| GB1462275A (en) | 1977-01-19 |
| AU6819674A (en) | 1975-10-23 |
| FR2227641B1 (fr) | 1979-02-16 |
| CA1003122A (en) | 1977-01-04 |
| BE814281A (fr) | 1974-08-16 |
| FR2227641A1 (fr) | 1974-11-22 |
| DE2418813A1 (de) | 1974-11-14 |
| US3924323A (en) | 1975-12-09 |