CA1003122A - Method of making multiple isolated semiconductor chip units - Google Patents

Method of making multiple isolated semiconductor chip units

Info

Publication number: CA1003122A
Authority: CA; Canada
Prior art keywords: semiconductor chip; making multiple; chip units; multiple isolated; isolated semiconductor
Prior art date: 1973-04-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA196,998A

Other languages

English (en)

Other versions

CA196998S (en

Inventor

Lewis H. Trevail

Brian A. Hegarty

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

RCA Corp

Original Assignee

RCA Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-04-30

Filing date

1974-04-08

Publication date

1977-01-04

1974-04-08 Application filed by RCA Corp filed Critical RCA Corp

1977-01-04 Application granted granted Critical

1977-01-04 Publication of CA1003122A publication Critical patent/CA1003122A/en

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/014—Manufacture or treatment using batch processing
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/019—Manufacture or treatment using temporary auxiliary substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

CA196,998A 1973-04-30 1974-04-08 Method of making multiple isolated semiconductor chip units Expired CA1003122A (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US35571873A	1973-04-30	1973-04-30
US500164A US3924323A (en)	1973-04-30	1974-08-23	Method of making a multiplicity of multiple-device semiconductor chips and article so produced

Publications (1)

Publication Number	Publication Date
CA1003122A true CA1003122A (en)	1977-01-04

Family

ID=26998976

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA196,998A Expired CA1003122A (en)	1973-04-30	1974-04-08	Method of making multiple isolated semiconductor chip units

Country Status (7)

Country	Link
US (1)	US3924323A (fr)
BE (1)	BE814281A (fr)
CA (1)	CA1003122A (fr)
DE (1)	DE2418813A1 (fr)
FR (1)	FR2227641B1 (fr)
GB (1)	GB1462275A (fr)
NL (1)	NL7405760A (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2930460C2 (de) *	1979-07-27	1986-07-17	Telefunken electronic GmbH, 7100 Heilbronn	Verfahren zum Herstellen hochspannungsfester Mesadioden
FR2524707B1 (fr) *	1982-04-01	1985-05-31	Cit Alcatel	Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
DE3524301A1 (de) *	1985-07-06	1987-01-15	Semikron Gleichrichterbau	Verfahren zum herstellen von halbleiterelementen
DE3931495C2 (de) *	1989-09-21	1997-06-26	Itt Ind Gmbh Deutsche	Verfahren zur "fließenden" Feinklassifizierung von Kapazitätsdioden
US5521125A (en) *	1994-10-28	1996-05-28	Xerox Corporation	Precision dicing of silicon chips from a wafer
US6083811A (en) *	1996-02-07	2000-07-04	Northrop Grumman Corporation	Method for producing thin dice from fragile materials
US5904546A (en) *	1996-02-12	1999-05-18	Micron Technology, Inc.	Method and apparatus for dicing semiconductor wafers
EP1189271A3 (fr) *	1996-07-12	2003-07-16	Fujitsu Limited	Plaquettes de circuit et montage des dispositifs semiconducteurs au dessus de ces plaquettes
US6881611B1 (en)	1996-07-12	2005-04-19	Fujitsu Limited	Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
EP2015359B1 (fr) *	1997-05-09	2015-12-23	Citizen Holdings Co., Ltd.	Procédé de production d'un boîtier pour semi-conducteur et système de carte de circuits
FR2782843B1 (fr) *	1998-08-25	2000-09-29	Commissariat Energie Atomique	Procede d'isolation physique de regions d'une plaque de substrat
DE19850873A1 (de)	1998-11-05	2000-05-11	Philips Corp Intellectual Pty	Verfahren zum Bearbeiten eines Erzeugnisses der Halbleitertechnik
US6569343B1 (en) *	1999-07-02	2003-05-27	Canon Kabushiki Kaisha	Method for producing liquid discharge head, liquid discharge head, head cartridge, liquid discharging recording apparatus, method for producing silicon plate and silicon plate
JP4403631B2 (ja) *	2000-04-24	2010-01-27	ソニー株式会社	チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法
JP2001313350A (ja) *	2000-04-28	2001-11-09	Sony Corp	チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法
JP3631956B2 (ja) *	2000-05-12	2005-03-23	富士通株式会社	半導体チップの実装方法
DE10202881B4 (de) *	2002-01-25	2007-09-20	Infineon Technologies Ag	Verfahren zur Herstellung von Halbleiterchips mit einer Chipkantenschutzschicht, insondere für Wafer Level Packaging Chips
US6608370B1 (en) *	2002-01-28	2003-08-19	Motorola, Inc.	Semiconductor wafer having a thin die and tethers and methods of making the same
WO2003098632A2 (fr) *	2002-05-16	2003-11-27	Nova Research, Inc.	Procedes de fabrication de dispositifs de memoire magnetoresistants
US7169691B2 (en) *	2004-01-29	2007-01-30	Micron Technology, Inc.	Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
TWI294168B (en) *	2006-04-18	2008-03-01	Siliconware Precision Industries Co Ltd	Semiconductor package and substrate with array arrangement thereof and method for fabricating the same
EP2109881B1 (fr) *	2007-01-31	2018-09-26	Henkel AG & Co. KGaA	Plaquette semi-conductrice revetue d'un materiau charge applicable par centrifugation
US8212369B2 (en) *	2007-01-31	2012-07-03	Henkel Ag & Co. Kgaa	Semiconductor wafer coated with a filled, spin-coatable material
US20170330855A1 (en) *	2016-05-13	2017-11-16	Taiwan Semiconductor Manufacturing Company, Ltd.	System and Method for Immersion Bonding

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2748041A (en) *	1952-08-30	1956-05-29	Rca Corp	Semiconductor devices and their manufacture
US3411200A (en) *	1965-04-14	1968-11-19	Westinghouse Electric Corp	Fabrication of semiconductor integrated circuits
US3343255A (en) *	1965-06-14	1967-09-26	Westinghouse Electric Corp	Structures for semiconductor integrated circuits and methods of forming them
US3689357A (en) *	1970-12-10	1972-09-05	Gen Motors Corp	Glass-polysilicon dielectric isolation

1974
- 1974-04-08 CA CA196,998A patent/CA1003122A/en not_active Expired
- 1974-04-19 DE DE2418813A patent/DE2418813A1/de active Pending
- 1974-04-23 GB GB1770574A patent/GB1462275A/en not_active Expired
- 1974-04-26 FR FR7414628A patent/FR2227641B1/fr not_active Expired
- 1974-04-26 BE BE143701A patent/BE814281A/fr unknown
- 1974-04-29 NL NL7405760A patent/NL7405760A/xx unknown
- 1974-08-23 US US500164A patent/US3924323A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
AU6819674A (en)	1975-10-23
FR2227641A1 (fr)	1974-11-22
FR2227641B1 (fr)	1979-02-16
GB1462275A (en)	1977-01-19
DE2418813A1 (de)	1974-11-14
NL7405760A (fr)	1974-11-01
BE814281A (fr)	1974-08-16
US3924323A (en)	1975-12-09

Publication	Publication Date	Title
CA1003122A (en)	1977-01-04	Method of making multiple isolated semiconductor chip units
CA994004A (en)	1976-07-27	Multiple semiconductor chip assembly and manufacture
CA1021470A (en)	1977-11-22	Method of shaping semiconductor workpieces
CA1013481A (en)	1977-07-05	Stabilized semiconductor devices and method of making same
JPS5635427A (en)	1981-04-08	Method of manufacturing semiconductor device
AU474451B2 (en)	1976-07-22	Improvements relating tothe manufacture of semiconductor devices
CA1027465A (fr)	1978-03-07	Traitement de pastilles semiconductrices
CA992220A (en)	1976-06-29	Method of semiconductor chip separation
CA1014392A (en)	1977-07-26	Method of manufacturing multiple bags
CA1009765A (en)	1977-05-03	Method of manufacturing multi-function lsi wafers
CA978283A (en)	1975-11-18	Semiconductor chip separation apparatus
CA1015070A (en)	1977-08-02	Semiconductor components
CA921337A (en)	1973-02-20	Method of manufacturing silicon nitride products
SU674680A3 (ru)	1979-07-15	Способ металлизации диэлектрических подложек
CA962372A (en)	1975-02-04	Isolation of semiconductor devices
CA976665A (en)	1975-10-21	Bonding method for multiple chip arrays
CA900054A (en)	1972-05-09	Production of semiconductor chips
CA905019A (en)	1972-07-11	Production of semiconductor chips
CA825350A (en)	1969-10-14	Manufacture of semiconductor elements
CA812995A (en)	1969-05-13	Method of producing semiconductor materials
CA905016A (en)	1972-07-11	Production of semiconductor components
CA989523A (en)	1976-05-18	Process for the manufacture of semiconductor structural elements
CA911308A (en)	1972-10-03	Production of semiconductor arrangements
CA822060A (en)	1969-09-02	Method of making silicon
CA863542A (en)	1971-02-09	Method of making semiconductor devices