BG51470A3 - Printed circuit board having metallized apretures and method for its production - Google Patents

Printed circuit board having metallized apretures and method for its production

Info

Publication number
BG51470A3
BG51470A3 BG92784A BG9278490A BG51470A3 BG 51470 A3 BG51470 A3 BG 51470A3 BG 92784 A BG92784 A BG 92784A BG 9278490 A BG9278490 A BG 9278490A BG 51470 A3 BG51470 A3 BG 51470A3
Authority
BG
Bulgaria
Prior art keywords
printed circuit
solution
layer
circuit board
electrically conductive
Prior art date
Application number
BG92784A
Other languages
Bulgarian (bg)
English (en)
Inventor
Juergen Hupe
Walter Kronenberg
Original Assignee
Blasberg Oberflaechentech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19883806884 external-priority patent/DE3806884C1/de
Application filed by Blasberg Oberflaechentech filed Critical Blasberg Oberflaechentech
Publication of BG51470A3 publication Critical patent/BG51470A3/bg

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Burglar Alarm Systems (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
BG92784A 1988-03-03 1990-09-03 Printed circuit board having metallized apretures and method for its production BG51470A3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19883806884 DE3806884C1 (en) 1988-03-03 1988-03-03 Through-plated contact printed circuit and method for fabricating it
DE3832507 1988-09-24
PCT/EP1989/000204 WO1989008375A1 (en) 1988-03-03 1989-03-01 New through-hole plated printed circuit board and process for manufacturing same

Publications (1)

Publication Number Publication Date
BG51470A3 true BG51470A3 (en) 1993-05-14

Family

ID=25865472

Family Applications (1)

Application Number Title Priority Date Filing Date
BG92784A BG51470A3 (en) 1988-03-03 1990-09-03 Printed circuit board having metallized apretures and method for its production

Country Status (13)

Country Link
US (1) US5194313A (da)
EP (1) EP0402381B1 (da)
JP (1) JP2657423B2 (da)
KR (1) KR960014476B1 (da)
AT (1) ATE111294T1 (da)
AU (1) AU622650B2 (da)
BG (1) BG51470A3 (da)
CA (1) CA1315417C (da)
DE (1) DE68918085T2 (da)
DK (1) DK170690B1 (da)
FI (1) FI111509B (da)
RU (1) RU1816344C (da)
WO (1) WO1989008375A1 (da)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300208A (en) * 1989-08-14 1994-04-05 International Business Machines Corporation Fabrication of printed circuit boards using conducting polymer
AU644602B2 (en) * 1989-08-31 1993-12-16 Blasberg-Oberflachentechnik Gmbh Plated-through printed circuit board with resist and process for producing it
DE3928832C2 (de) * 1989-08-31 1995-04-20 Blasberg Oberflaechentech Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug
DD297669A5 (de) * 1989-09-14 1992-01-16 �����@������������������k�� Verfahren zur direkten metallisierung von leiterplatten
US5693209A (en) * 1989-09-14 1997-12-02 Atotech Deutschland Gmbh Process for metallization of a nonconductor surface
DE3931003A1 (de) * 1989-09-14 1991-03-28 Schering Ag Verfahren zur direkten metallisierung von leiterplatten
DE3935831A1 (de) * 1989-10-27 1991-05-02 Hoellmueller Maschbau H Anlage zur herstellung von durchkontaktierten leiterplatten und multilayern
US5106537A (en) * 1990-04-12 1992-04-21 Olin Hunt Sub Iii Corp. Liquid dispersion for enhancing the electroplating of a non-conductive surface
GB2243838A (en) * 1990-05-09 1991-11-13 Learonal Process for metallising a through-hole printed circuit board by electroplating
DE4040226C2 (de) * 1990-12-15 1994-09-29 Hoellmueller Maschbau H Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayern)
DE4202337A1 (de) * 1992-01-29 1993-08-05 Bayer Ag Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern
DE4227836C2 (de) * 1992-08-20 1997-09-25 Atotech Deutschland Gmbh Verfahren zur Metallisierung von Nichtleitern
US5262041A (en) * 1992-12-11 1993-11-16 Shipley Company Inc. Additive plating process
DE4314259C2 (de) * 1993-04-30 1997-04-10 Grundig Emv Verfahren zur Durchkontaktierung von Leiterplatten mittels leitfähiger Kunststoffe zur direkten Metallisierung
US5840363A (en) * 1993-04-30 1998-11-24 Grundig Ag Process for throughplating printed circuit boards using conductive plastics
US5532025A (en) * 1993-07-23 1996-07-02 Kinlen; Patrick J. Corrosion inhibiting compositions
US5415762A (en) * 1993-08-18 1995-05-16 Shipley Company Inc. Electroplating process and composition
DE4436391A1 (de) * 1994-10-12 1996-04-18 Bayer Ag Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern
EP0731192B2 (en) † 1995-03-10 2003-01-02 Shipley Company LLC Electroplating process and composition
FR2737507B1 (fr) * 1995-08-04 1997-09-26 Scps Structures poreuses complexes metallisees ou metalliques, premetallisees par depot d'un polymere conducteur
DE19637018A1 (de) * 1996-09-12 1998-03-19 Bayer Ag Verfahren zur Herstellung von starren und flexiblen Schaltungen
EP0905285B1 (en) * 1997-02-03 2000-12-27 Okuno Chemical Industries Co., Ltd. Method for electroplating nonconductive material
US6117554A (en) * 1997-05-30 2000-09-12 Poly-Med, Inc. Modulated molecularly bonded inherently conductive polymers on substrates with conjugated multiple lamellae and shaped articles thereof
US6303500B1 (en) 1999-02-24 2001-10-16 Micron Technology, Inc. Method and apparatus for electroless plating a contact pad
WO2000072331A1 (de) * 1999-05-20 2000-11-30 Bayer Aktiengesellschaft VERFAHREN ZUR HERSTELLUNG VON π-KONJUGIERTEN POLYMEREN
US20050045851A1 (en) * 2003-08-15 2005-03-03 Konarka Technologies, Inc. Polymer catalyst for photovoltaic cell
JP2002151845A (ja) * 2000-11-16 2002-05-24 Hitachi Chem Co Ltd めっき前処理方法
DE10124631C1 (de) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
AU2002354954A1 (en) * 2001-07-20 2003-03-03 The Research Foundation Of State University Of New York Polymer-matrix materials and methods for making same
US20060147616A1 (en) * 2004-12-20 2006-07-06 Russell Gaudiana Polymer catalyst for photovoltaic cell
EP1870491B1 (de) * 2006-06-22 2015-05-27 Enthone, Inc. Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen
EP1897975B1 (en) * 2006-09-07 2012-03-14 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates
US8366901B2 (en) * 2006-09-07 2013-02-05 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
EP1897974B1 (en) 2006-09-07 2012-08-01 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
ES2395736T3 (es) 2007-05-03 2013-02-14 Atotech Deutschland Gmbh Procedimiento para aplicar un revestimiento metálico a un substrato no conductor
EP2305856A1 (en) 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
PL2447296T3 (pl) * 2010-10-29 2018-06-29 Macdermid Enthone Inc. Kompozycja i sposób osadzania przewodzących polimerów na podłożach dielektrycznych
WO2016116876A1 (en) 2015-01-20 2016-07-28 Enthone Inc. Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrates
EP2602357A1 (en) 2011-12-05 2013-06-12 Atotech Deutschland GmbH Novel adhesion promoting agents for metallization of substrate surfaces
CN104204294B (zh) * 2012-03-29 2018-12-07 德国艾托特克公司 促进介电衬底与金属层之间粘着度的方法
EP2644744A1 (en) 2012-03-29 2013-10-02 Atotech Deutschland GmbH Method for promoting adhesion between dielectric substrates and metal layers
CN104018196A (zh) * 2013-02-28 2014-09-03 武汉孟鼎电化学技术有限公司 印制线路板无化学镀直接电镀方法
US10151035B2 (en) * 2016-05-26 2018-12-11 Rohm And Haas Electronic Materials Llc Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
CN107723764A (zh) * 2017-10-31 2018-02-23 电子科技大学 一种在绝缘基材上直接电镀的方法
JP6566064B1 (ja) * 2018-03-06 2019-08-28 栗田工業株式会社 ポリフェニレンサルファイド樹脂表面の処理方法
JP6540843B1 (ja) * 2018-03-06 2019-07-10 栗田工業株式会社 ポリプロピレン樹脂の親水化処理方法
WO2022153995A1 (ja) * 2021-01-14 2022-07-21 長野県 酸化還元反応により導電性を示す下地導電層用材料並びにそれを用いた製造プロセス、デバイス、めっき品、めっき品の製造方法及びコーティング液
CN115613019B (zh) * 2022-09-29 2024-08-09 南京科润工业介质股份有限公司 一种适用于全自动称量包装机分装的工件用余热发黑液
CN119815722A (zh) * 2024-12-30 2025-04-11 厦门柔性电子研究院有限公司 一种高频高速多层柔性电路板的孔金属化方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1381243A (en) * 1972-02-18 1975-01-22 Kollmorgen Corp Method for metallizing substrates
EP0206133B1 (de) * 1985-06-12 1991-07-31 BASF Aktiengesellschaft Verwendung von Polypyrrol zur Abscheidung von metallischem Kupfer auf elektrisch nichtleitende Materialen
DE3520980A1 (de) * 1985-06-12 1986-12-18 Basf Ag, 6700 Ludwigshafen Verfahren zum aufbringen einer schicht aus elektrisch leitfaehigen polymeren auf andere werkstoffe
JPS6223195A (ja) * 1985-07-23 1987-01-31 日本写真印刷株式会社 導電性回路基板とその製造法
JPS62136709A (ja) * 1985-12-09 1987-06-19 三井東圧化学株式会社 導電性パタ−ンの形成方法
IL82764A0 (en) * 1986-06-06 1987-12-20 Advanced Plating Technology Ap Selective plating process for the electrolytic coating of circuit boards

Also Published As

Publication number Publication date
JP2657423B2 (ja) 1997-09-24
US5194313A (en) 1993-03-16
ATE111294T1 (de) 1994-09-15
DE68918085T2 (de) 1995-01-26
CA1315417C (en) 1993-03-30
WO1989008375A1 (en) 1989-09-08
DK196090D0 (da) 1990-08-16
KR900701145A (ko) 1990-08-17
EP0402381B1 (en) 1994-09-07
DE68918085D1 (de) 1994-10-13
DK170690B1 (da) 1995-12-04
AU3189189A (en) 1989-09-22
FI904312A0 (fi) 1990-08-31
DK196090A (da) 1990-08-16
EP0402381A1 (en) 1990-12-19
KR960014476B1 (ko) 1996-10-15
AU622650B2 (en) 1992-04-16
RU1816344C (ru) 1993-05-15
JPH05506125A (ja) 1993-09-02
FI111509B (fi) 2003-07-31

Similar Documents

Publication Publication Date Title
BG51470A3 (en) Printed circuit board having metallized apretures and method for its production
US5373629A (en) Through-hole plate printed circuit board with resist and process for manufacturing same
JP4686113B2 (ja) 非導電基板の直接電解金属被膜
JP4044286B2 (ja) 金属を用いた基板の被覆方法
KR100188481B1 (ko) 유전기질과 도금기질을 직접 전기도금 하는 방법
CN101542021B (zh) 传导聚合物的沉积和非传导基材的金属化
US5391421A (en) Additive plating process
US4430154A (en) Method of producing printed circuit boards
US5693209A (en) Process for metallization of a nonconductor surface
US5183552A (en) Process for metallization of a nonconductor surface, especially on a circuit board having preexisting copper surfaces
DD283580A5 (de) Verfahren zur herstellung von durchkontaktierten ein- oder mehrlagigen leiterplatten und durchkontaktieren ein-oder mehrlagige leiterplatte
JPH03150392A (ja) 金属被覆ポリイミド複合物の調製方法
JPH05287582A (ja) 非導電性材料表面に電気メッキ層を直接形成する方法
EP1799884A4 (en) METHOD FOR PRODUCING A NON-LEADING SUBSTRATE FOR GALVANIZATION
KR100216328B1 (ko) 회로판의 직접 금속화 방법
JPH10245444A (ja) ポリイミド樹脂表面への導電性皮膜形成方法
JP3117216B2 (ja) 酸化薄層の選択的形成手段
JP3143707B2 (ja) 直接電気メッキ用温和塩基性促進液剤
CA2064214A1 (en) Plated-through printed circuit board with resist and process for producing it
HK1035385B (en) Method for metal coating of substrates