BRPI0402317A - Aparelho de usinagem a laser e seu uso - Google Patents

Aparelho de usinagem a laser e seu uso

Info

Publication number
BRPI0402317A
BRPI0402317A BR0402317-0A BRPI0402317A BRPI0402317A BR PI0402317 A BRPI0402317 A BR PI0402317A BR PI0402317 A BRPI0402317 A BR PI0402317A BR PI0402317 A BRPI0402317 A BR PI0402317A
Authority
BR
Brazil
Prior art keywords
substrate
machining apparatus
laser machining
laser
liquid
Prior art date
Application number
BR0402317-0A
Other languages
English (en)
Inventor
Charles Otis
Mehrgan Khavari
Jeffrey R Pollard
Mark C Huth
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of BRPI0402317A publication Critical patent/BRPI0402317A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/455—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using laser arrays, the laser array being smaller than the medium to be recorded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
    • B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
    • B41J2/473—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror using multiple light beams, wavelengths or colours

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Laser Beam Processing (AREA)

Abstract

"APARELHO DE USINAGEM A LASER E SEU USO". As configurações descritas se relacionam com micro-usinar a laser um substrato. Um método exemplar inclui formar um aspecto (404) em um substrato (300), pelo menos em parte, direcionando um feixe de laser (410) no substrato (300). Durante pelo menos uma porção da citada formação, o método inclui fornecer líquido (422) a pelo menos uma primeira região (508a) do aspecto ao longo de uma primeira trajetória de suprimento de líquido (b~ 1~) e fornecer líquido (422) a pelo menos uma segunda região diferente (508b) do aspecto (404) ao longo de pelo menos uma segunda trajetória de suprimento de líquido (b~ 2~).
BR0402317-0A 2003-11-14 2004-06-09 Aparelho de usinagem a laser e seu uso BRPI0402317A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/713,298 US7893386B2 (en) 2003-11-14 2003-11-14 Laser micromachining and methods of same

Publications (1)

Publication Number Publication Date
BRPI0402317A true BRPI0402317A (pt) 2006-01-24

Family

ID=34435680

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0402317-0A BRPI0402317A (pt) 2003-11-14 2004-06-09 Aparelho de usinagem a laser e seu uso

Country Status (12)

Country Link
US (1) US7893386B2 (pt)
EP (1) EP1533069A1 (pt)
JP (1) JP4319610B2 (pt)
KR (1) KR101107810B1 (pt)
CN (1) CN1616178B (pt)
AU (1) AU2004202047A1 (pt)
BR (1) BRPI0402317A (pt)
CA (1) CA2487209A1 (pt)
MX (1) MXPA04006580A (pt)
PL (1) PL205462B1 (pt)
RU (1) RU2365477C2 (pt)
SG (1) SG112011A1 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1598140A1 (de) * 2004-05-19 2005-11-23 Synova S.A. Laserbearbeitung eines Werkstücks
US7163640B2 (en) 2004-05-21 2007-01-16 Hewlett-Packard Development Company, L.P. Methods and systems for laser processing
US7923658B2 (en) 2004-09-13 2011-04-12 Hewlett-Packard Development Company, L.P. Laser micromachining methods and systems
JP2010240869A (ja) 2009-04-01 2010-10-28 Canon Inc 液体吐出ヘッド用基板の製造方法
US9044781B2 (en) * 2012-12-04 2015-06-02 Fei Company Microfluidics delivery systems
JP6378885B2 (ja) * 2014-01-27 2018-08-22 株式会社アマダホールディングス レーザ加工装置及びレーザ加工方法
US20190233321A1 (en) 2018-01-26 2019-08-01 Corning Incorporated Liquid-assisted laser micromachining of transparent dielectrics
RU2692153C1 (ru) * 2018-06-09 2019-06-21 Акционерное общество "Высокотехнологический научно-исследовательский институт неорганических материалов имени академика А.А. Бочвара" Способ лазерной обработки материалов в жидкой среде
WO2020222297A1 (en) * 2019-04-28 2020-11-05 Okinawa Institute Of Science And Technology School Corporation Method of fabricating a through glass via on a suspended nanocrystalline diamond
WO2022144808A1 (ru) * 2020-12-31 2022-07-07 Дмитрий ЧУХЛАНЦЕВ Установка для лазерного ударного упрочнения деталей

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556600A (en) * 1968-08-30 1971-01-19 Westinghouse Electric Corp Distribution and cutting of rocks,glass and the like
US3656988A (en) * 1969-02-27 1972-04-18 Watch Stones Co Ltd Method for the fabrication of holes in a workpiece by means of laser-beams and apparatus for the performance of the aforesaid method
USRE31052E (en) * 1978-05-30 1982-10-12 Kaepa, Inc. Lacing assembly for a shoe
USRE31042E (en) * 1978-08-29 1982-09-28 Houdaille Industries, Inc. Laser cutting head attachment for punch presses
DE3110235A1 (de) * 1981-03-17 1982-10-21 Trumpf GmbH & Co, 7257 Ditzingen "verfahren und vorrichtung zum brennschneiden mittels eines laserstrahls"
JPS59206189A (ja) * 1983-05-10 1984-11-21 Toshiba Corp レ−ザ切断装置
JPS6018289A (ja) 1983-07-13 1985-01-30 Kiyoshi Hajikano レ−ザ−微細加工方法
JPS63108990A (ja) 1986-10-24 1988-05-13 Mitsubishi Electric Corp レ−ザ加工ヘツド装置
JP2733317B2 (ja) * 1989-07-20 1998-03-30 株式会社アマダ チップコンベヤの粉塵除去装置
US5068513A (en) * 1990-09-28 1991-11-26 Beloit Corporation Water jet slitter with laser finish and method
US5359211A (en) * 1991-07-18 1994-10-25 Harris Corporation High voltage protection using SCRs
US5262613A (en) * 1991-09-24 1993-11-16 General Laser, Inc. Laser retrofit for mechanical engravers
DE4138468A1 (de) 1991-11-22 1993-06-03 Stiftung Fuer Lasertechnologie Einrichtung und verfahren zum abtragen von material von einem substrat
JPH05337676A (ja) * 1992-06-08 1993-12-21 Amada Co Ltd 熱切断加工機の集塵処理装置
US5356081A (en) * 1993-02-24 1994-10-18 Electric Power Research Institute, Inc. Apparatus and process for employing synergistic destructive powers of a water stream and a laser beam
JPH06246474A (ja) * 1993-02-24 1994-09-06 Amada Co Ltd 縦型レーザ加工機
DE4316012C2 (de) * 1993-05-13 1998-09-24 Gehring Gmbh & Co Maschf Verfahren zur Feinbearbeitung von Werkstück-Oberflächen
US5520290A (en) * 1993-12-30 1996-05-28 Huron Valley Steel Corporation Scrap sorting system
US5460284A (en) * 1994-04-01 1995-10-24 Xerox Corporation Capture system employing annular fluid stream
DE19537924C2 (de) * 1994-10-18 1997-06-12 Thyssen Industrie Verfahren zum Kühlen des Schweißnahtbereichs beim Laserschweißen und Vorrichtung zum Durchführen dieses Verfahrens
US5543365A (en) * 1994-12-02 1996-08-06 Texas Instruments Incorporated Wafer scribe technique using laser by forming polysilicon
GB9507719D0 (en) * 1995-04-13 1995-05-31 Boc Group Plc Machining of materials
JPH08318390A (ja) 1995-05-26 1996-12-03 Hitachi Ltd アブレーションデブリス除去装置
RU2089365C1 (ru) * 1995-07-06 1997-09-10 Кумертауское авиационное производственное предприятие Способ газолазерной резки металлических материалов и устройство для осуществления способа
KR970008386A (ko) * 1995-07-07 1997-02-24 하라 세이지 기판의 할단(割斷)방법 및 그 할단장치
US6120131A (en) * 1995-08-28 2000-09-19 Lexmark International, Inc. Method of forming an inkjet printhead nozzle structure
US6183064B1 (en) * 1995-08-28 2001-02-06 Lexmark International, Inc. Method for singulating and attaching nozzle plates to printheads
DE69625002T2 (de) 1995-08-28 2003-07-31 Lexmark International Inc., Greenwich Verfahren zum Bilden einer Düsenstruktur für einen Tintenstrahldruckkopf
US5741247A (en) * 1995-08-31 1998-04-21 Biolase Technology, Inc. Atomized fluid particles for electromagnetically induced cutting
US5658471A (en) * 1995-09-22 1997-08-19 Lexmark International, Inc. Fabrication of thermal ink-jet feed slots in a silicon substrate
JPH09168877A (ja) 1995-12-21 1997-06-30 Mitsubishi Electric Corp 配線基板の加工方法および加工装置
US6476343B2 (en) * 1996-07-08 2002-11-05 Sandia Corporation Energy-beam-driven rapid fabrication system
US5742028A (en) * 1996-07-24 1998-04-21 General Electric Company Preloaded laser shock peening
US5773791A (en) * 1996-09-03 1998-06-30 Kuykendal; Robert Water laser machine tool
US6045214A (en) 1997-03-28 2000-04-04 Lexmark International, Inc. Ink jet printer nozzle plate having improved flow feature design and method of making nozzle plates
JP2000117480A (ja) * 1998-10-15 2000-04-25 Fanuc Ltd レーザ加工機
JP3481153B2 (ja) * 1998-11-25 2003-12-22 株式会社ホンダロック 溶接ヒューム捕集装置
US6262390B1 (en) * 1998-12-14 2001-07-17 International Business Machines Corporation Repair process for aluminum nitride substrates
US6333488B1 (en) * 1999-08-30 2001-12-25 General Electric Company Method for setting up and controlling confinement media flow in laser shock peening
US6281473B1 (en) * 2000-01-19 2001-08-28 General Electric Company Apparatus and method for controlling confinement media thickness in laser shock peening
JP2001219269A (ja) * 2000-02-07 2001-08-14 Hitachi Ltd 水中加工装置及びその加工方法
JP3484396B2 (ja) * 2000-05-09 2004-01-06 新光電気工業株式会社 ウェハーの切断方法
US6494965B1 (en) * 2000-05-30 2002-12-17 Creo Products Inc. Method and apparatus for removal of laser ablation byproducts
US6388231B1 (en) * 2000-06-15 2002-05-14 Xerox Corporation Systems and methods for controlling depths of a laser cut
US6580053B1 (en) * 2000-08-31 2003-06-17 Sharp Laboratories Of America, Inc. Apparatus to control the amount of oxygen incorporated into polycrystalline silicon film during excimer laser processing of silicon films
RU2208504C2 (ru) * 2000-09-19 2003-07-20 Закрытое акционерное общество "ТехноЛазер" Устройство для лазерной пробивки отверстий в материалах
US6720522B2 (en) 2000-10-26 2004-04-13 Kabushiki Kaisha Toshiba Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
KR100829876B1 (ko) * 2000-10-26 2008-05-16 엑스에스아이엘 테크놀러지 리미티드 레이저 기계가공의 제어
JP4566384B2 (ja) * 2000-10-30 2010-10-20 日東電工株式会社 偏光板
US6765174B2 (en) * 2001-02-05 2004-07-20 Denso Corporation Method for machining grooves by a laser and honeycomb structure forming die and method for producing the same die
DE60210770T2 (de) 2001-03-22 2006-08-31 Xsil Technology Ltd. Ein laserbearbeitungssystem und -verfahren
US6512198B2 (en) * 2001-05-15 2003-01-28 Lexmark International, Inc Removal of debris from laser ablated nozzle plates
JP3938312B2 (ja) 2001-06-14 2007-06-27 住友電工ハードメタル株式会社 硬質材料の加工方法
JP2003015086A (ja) 2001-06-29 2003-01-15 Sony Corp 反射型投影装置
WO2003004210A1 (en) * 2001-07-02 2003-01-16 Virtek Laser Systems, Inc. Method of ablating an opening in a hard, non-metallic substrate
JP3635351B2 (ja) 2001-07-13 2005-04-06 日本電炉株式会社 Ｃｏ２レーザー切断機用ヘッドの先端に取り付ける深彫マーキング用ヘッド
WO2003028943A1 (en) 2001-10-03 2003-04-10 Lambda Physik Application Center, L.L.C. Method and apparatus for fine liquid spray assisted laser material processing
US20030062126A1 (en) * 2001-10-03 2003-04-03 Scaggs Michael J. Method and apparatus for assisting laser material processing
TWI236944B (en) * 2001-12-17 2005-08-01 Tokyo Electron Ltd Film removal method and apparatus, and substrate processing system
US7357486B2 (en) * 2001-12-20 2008-04-15 Hewlett-Packard Development Company, L.P. Method of laser machining a fluid slot
US7994450B2 (en) * 2002-01-07 2011-08-09 International Business Machines Corporation Debris minimization and improved spatial resolution in pulsed laser ablation of materials
US6888097B2 (en) * 2003-06-23 2005-05-03 Gas Technology Institute Fiber optics laser perforation tool

Also Published As

Publication number Publication date
CA2487209A1 (en) 2005-05-14
EP1533069A1 (en) 2005-05-25
US20050103758A1 (en) 2005-05-19
JP4319610B2 (ja) 2009-08-26
RU2365477C2 (ru) 2009-08-27
MXPA04006580A (es) 2005-08-19
KR20050046614A (ko) 2005-05-18
CN1616178A (zh) 2005-05-18
RU2004133168A (ru) 2006-05-10
US7893386B2 (en) 2011-02-22
JP2005144557A (ja) 2005-06-09
PL205462B1 (pl) 2010-04-30
KR101107810B1 (ko) 2012-01-25
PL371143A1 (en) 2005-05-16
CN1616178B (zh) 2010-09-29
AU2004202047A1 (en) 2005-06-02
SG112011A1 (en) 2005-06-29

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Legal Events

Date Code Title Description
B03A Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2160 DE 29/05/2012.