BRPI0407536A - processo para produção de uma placa de impressão revelável em água para uso na impressão em relevo - Google Patents

processo para produção de uma placa de impressão revelável em água para uso na impressão em relevo

Info

Publication number
BRPI0407536A
BRPI0407536A BRPI0407536-6A BRPI0407536A BRPI0407536A BR PI0407536 A BRPI0407536 A BR PI0407536A BR PI0407536 A BRPI0407536 A BR PI0407536A BR PI0407536 A BRPI0407536 A BR PI0407536A
Authority
BR
Brazil
Prior art keywords
producing
water
printing plate
embossing
exposure
Prior art date
Application number
BRPI0407536-6A
Other languages
English (en)
Inventor
Keiichi Haraguchi
Masahiro Yoshida
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of BRPI0407536A publication Critical patent/BRPI0407536A/pt

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2024—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure of the already developed image

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)

Abstract

"PROCESSO PARA PRODUçãO DE UMA PLACA DE IMPRESSãO REVELáVEL EM áGUA PARA USO NA IMPRESSãO EM RELEVO". A invenção refere-se a um processo para produção de uma placa de impressão revelável em água para impressão em relevo, compreendendo prover uma placa sólida feita de uma composição de resina fotosensitiva compreendendo pelo menos (a) uma resina hidrófila, (b) uma resina hidrófoba, (c) um composto insaturado fotopolimerizável e (d) um iniciador de fotopolimerização e sujeitar a placa sólida a pelo menos às etapas de exposição a raios actínicos, revelação e pós-exposição. No processo, a etapa de pós-exposição é realizada em uma atmosfera de baixa concentração de oxigênio.
BRPI0407536-6A 2003-02-19 2004-02-17 processo para produção de uma placa de impressão revelável em água para uso na impressão em relevo BRPI0407536A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003041650 2003-02-19
PCT/JP2004/001681 WO2004074942A1 (ja) 2003-02-19 2004-02-17 凸版印刷用水現像性印刷版の製造方法

Publications (1)

Publication Number Publication Date
BRPI0407536A true BRPI0407536A (pt) 2006-02-14

Family

ID=32905294

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0407536-6A BRPI0407536A (pt) 2003-02-19 2004-02-17 processo para produção de uma placa de impressão revelável em água para uso na impressão em relevo

Country Status (10)

Country Link
US (1) US20060144272A1 (pt)
EP (1) EP1596253A4 (pt)
JP (1) JP3933675B2 (pt)
KR (1) KR100725570B1 (pt)
CN (1) CN100529971C (pt)
AU (1) AU2004214123B2 (pt)
BR (1) BRPI0407536A (pt)
CA (1) CA2516495A1 (pt)
MX (1) MXPA05008777A (pt)
WO (1) WO2004074942A1 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005064413A1 (ja) * 2003-12-26 2005-07-14 Asahi Kasei Chemicals Corporation 凸版印刷用水現像感光性樹脂版
JP2007087786A (ja) * 2005-09-22 2007-04-05 Toppan Printing Co Ltd 有機エレクトロルミネッセンスインキ及びこれを用いた有機エレクトロルミネッセンス素子の製造方法
CN101192004B (zh) * 2006-11-27 2010-05-12 乐凯集团第二胶片厂 适合于uv-ctp的阴图感光组成物和用其制作的平印版及平印版制作方法
JP2008216949A (ja) * 2007-02-06 2008-09-18 Toppan Printing Co Ltd 感光性樹脂版用露光装置、および有機ｅｌ素子の製造方法
US8236479B2 (en) * 2008-01-23 2012-08-07 E I Du Pont De Nemours And Company Method for printing a pattern on a substrate
US8241835B2 (en) 2008-01-30 2012-08-14 E I Du Pont De Nemours And Company Device and method for preparing relief printing form
US20090191482A1 (en) * 2008-01-30 2009-07-30 E.I. Du Pont De Nemours And Company Device and method for preparing relief printing form
WO2011002967A1 (en) 2009-07-02 2011-01-06 E. I. Du Pont De Nemours And Company Method for printing a material onto a substrate
CN102540709B (zh) * 2010-12-30 2014-05-07 乐凯华光印刷科技有限公司 红外线敏感的免化学处理感光组成物和用其制作的平印版
US9069252B2 (en) 2011-08-26 2015-06-30 E I Du Pont De Nemours And Company Method for preparing a relief printing form
US9097974B2 (en) 2012-08-23 2015-08-04 E I Du Pont De Nemours And Company Method for preparing a relief printing form
TWI680358B (zh) * 2014-10-31 2019-12-21 日商東京應化工業股份有限公司 光阻圖型形成裝置及光阻圖型形成方法
JP6264679B1 (ja) * 2016-03-16 2018-01-31 東洋紡株式会社 水現像可能なフレキソ印刷用感光性樹脂組成物、及びそれから得られるフレキソ印刷用感光性樹脂原版
WO2019049786A1 (ja) * 2017-09-05 2019-03-14 東洋紡株式会社 水現像可能なフレキソ印刷用感光性樹脂組成物、及びそれから得られるフレキソ印刷用感光性樹脂原版

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5248845B2 (pt) * 1973-12-25 1977-12-13
JPS585798B2 (ja) * 1977-06-30 1983-02-01 富士写真フイルム株式会社 平版印刷版用不感脂化液およびそれを用いる平版印刷版の製造方法
JPS5897043A (ja) 1981-12-04 1983-06-09 Teijin Ltd 液中後露光法
JPS60191237A (ja) * 1984-03-13 1985-09-28 Asahi Chem Ind Co Ltd 露光硬化後非粘着性感光性樹脂組成物
US4806506A (en) * 1987-09-14 1989-02-21 E. I. Du Pont De Nemours And Company Process for detackifying photopolymer flexographic printing plates
JP2940037B2 (ja) * 1989-12-25 1999-08-25 東洋紡績株式会社 感光性樹脂印刷原版および印刷版
GB2235927B (en) * 1989-09-14 1992-10-21 Asahi Chemical Ind A sulfonic acid group-containing polyurethane and a photosensitive resin composition containing the same
US5348844A (en) * 1990-12-03 1994-09-20 Napp Systems, Inc. Photosensitive polymeric printing medium and water developable printing plates
US5798019A (en) * 1995-09-29 1998-08-25 E. I. Du Pont De Nemours And Company Methods and apparatus for forming cylindrical photosensitive elements
ES2157494T3 (es) * 1996-02-20 2001-08-16 Asahi Chemical Ind Procedimiento para la fabricacion de placas de imprimir de resina fotosensible.
JP2656767B2 (ja) * 1996-03-08 1997-09-24 旭化成工業株式会社 印刷版の製造方法およびこの方法で得られた印刷版
JPH1078657A (ja) * 1996-09-03 1998-03-24 Toyobo Co Ltd 感光性樹脂組成物
JPH1090892A (ja) * 1996-09-13 1998-04-10 Toyobo Co Ltd 感光性樹脂組成物
JP2001337445A (ja) * 2000-05-29 2001-12-07 Toyobo Co Ltd フレキソ印刷用水現像型感光性原版用感光性樹脂組成物、フレキソ印刷用水現像型感光性原版およびフレキソ印刷版
WO2002033490A1 (en) * 2000-10-13 2002-04-25 Asahi Kasei Kabushiki Kaisha Method and apparatus for developing photosensitive resin relief printing plate
AU2002224117B2 (en) * 2000-11-28 2005-01-27 Asahi Kasei Chemicals Corporation Improved water-developable photosensitive resin for flexography

Also Published As

Publication number Publication date
JPWO2004074942A1 (ja) 2006-06-01
MXPA05008777A (es) 2005-10-18
AU2004214123A1 (en) 2004-09-02
US20060144272A1 (en) 2006-07-06
JP3933675B2 (ja) 2007-06-20
WO2004074942A1 (ja) 2004-09-02
AU2004214123B2 (en) 2007-06-28
EP1596253A1 (en) 2005-11-16
CN100529971C (zh) 2009-08-19
EP1596253A4 (en) 2010-02-03
CN1751274A (zh) 2006-03-22
CA2516495A1 (en) 2004-09-02
KR20050113607A (ko) 2005-12-02
KR100725570B1 (ko) 2007-06-08

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B08L Patent application lapsed because of non payment of annual fee [chapter 8.12 patent gazette]

Free format text: REFERENTE AO NAO RECOLHIMENTO DAS 9A E 10A ANUIDADES.

B08I Application fees: publication cancelled [chapter 8.9 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 8.12 NA RPI NO 2257 DE 08/04/2014 POR TER SIDO INDEVIDA.

B08F Application fees: application dismissed [chapter 8.6 patent gazette]

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B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2602 DE 17-11-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.