BRPI0407659A - adesivos de uma só parte à base de solvente para ligar materiais poliméricos - Google Patents

adesivos de uma só parte à base de solvente para ligar materiais poliméricos

Info

Publication number
BRPI0407659A
BRPI0407659A BRPI0407659-1A BRPI0407659A BRPI0407659A BR PI0407659 A BRPI0407659 A BR PI0407659A BR PI0407659 A BRPI0407659 A BR PI0407659A BR PI0407659 A BRPI0407659 A BR PI0407659A
Authority
BR
Brazil
Prior art keywords
solvent
adhesive
organosilane
polymeric materials
joining
Prior art date
Application number
BRPI0407659-1A
Other languages
English (en)
Inventor
Douglas H Mowrey
Patrick A Warren
Original Assignee
Lord Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lord Corp filed Critical Lord Corp
Publication of BRPI0407659A publication Critical patent/BRPI0407659A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
    • C08G18/8083—Masked polyisocyanates masked with compounds having only one group containing active hydrogen with compounds containing at least one heteroatom other than oxygen or nitrogen
    • C08G18/809—Masked polyisocyanates masked with compounds having only one group containing active hydrogen with compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5465—Silicon-containing compounds containing nitrogen containing at least one C=N bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/28—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by reaction with halogens or compounds containing halogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

"ADESIVO DE UMA Só PARTE á BASE DE SOLVENTE PARA LIGAR MATERIAIS POLIMéRICOS". A presente invenção refere-se adesivos e métodos de ligação que empregam um único revestimento de um adesivo à base de solvente que liga eficazmente polímeros termoplásticos e especialmente elastómeros termoplásticos. Os componentes do adesivo são um componente de organossilano selecionado de aducto organossilano-isocianato e isocianato-organossilano, um polímero pós-clorado que contém unidades repetidas de propileno ou derivados deste, e um solvente. Também são descritos métodos para unir um substrato estrutural rígido a um polímero fundido tal como um TPE via moldagem por injeção ou extrusão. Adesão durável entre a parte do substrato rígido tratada com adesivo e o polímero processado sob fusão é obtida com ou sem um tratamento térmico aplicado ao substrato revestido com adesivo antes de uni-lo ao material termoplástico fundido.
BRPI0407659-1A 2003-02-28 2004-02-26 adesivos de uma só parte à base de solvente para ligar materiais poliméricos BRPI0407659A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/377,069 US6878231B2 (en) 2003-02-28 2003-02-28 One-part solvent-based adhesive for bonding polymer materials
PCT/US2004/005806 WO2004078867A2 (en) 2003-02-28 2004-02-26 One-part solvent-based adhesive for bonding polymer materials

Publications (1)

Publication Number Publication Date
BRPI0407659A true BRPI0407659A (pt) 2006-03-01

Family

ID=32908067

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0407659-1A BRPI0407659A (pt) 2003-02-28 2004-02-26 adesivos de uma só parte à base de solvente para ligar materiais poliméricos

Country Status (9)

Country Link
US (2) US6878231B2 (pt)
EP (1) EP1597298A2 (pt)
JP (1) JP2006520849A (pt)
KR (1) KR20060013635A (pt)
CN (1) CN1753927A (pt)
AU (1) AU2004218021A1 (pt)
BR (1) BRPI0407659A (pt)
MX (1) MXPA05009071A (pt)
WO (1) WO2004078867A2 (pt)

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CA2533721C (en) * 2005-01-25 2014-09-23 Dirtt Environmental Solutions Ltd. Method for wrapping a non-porous substrate object with a wood veneer
US20070200005A1 (en) * 2006-02-24 2007-08-30 Corbett Bradford G Jr Ozone and Chemical Resistant Coating for Railway Line Elastomeric Components
EP2152828B1 (en) * 2007-05-24 2011-07-06 Lord Corporation Powder adhesives for bonding elastomers
JP5177149B2 (ja) * 2008-01-10 2013-04-03 東亞合成株式会社 接着剤組成物及びそれを用いた熱融着性部材
US8153268B1 (en) 2008-03-26 2012-04-10 Loctite (R&D) Limited Polymer to metal bonding and compounds and compositions useful therefor
WO2010054287A1 (en) * 2008-11-07 2010-05-14 Lord Corporation Powdered primer for rubber to metal bonding
JP5797653B2 (ja) 2009-09-11 2015-10-21 ロックタイト （アール アンド ディー） リミテッドＬｏｃｔｉｔｅ （Ｒ ＆ Ｄ） Ｌｉｍｉｔｅｄ ポリマー接着用組成物
CN102666557B (zh) 2009-09-18 2016-03-30 汉高知识产权控股有限责任公司 膦酸酯粘接组合物
US8962745B2 (en) * 2010-12-27 2015-02-24 Bridgestone Corporation Functionalized polymers and vulcanizates with reduced hysteretic loss
KR101800492B1 (ko) 2011-04-29 2017-11-22 헨켈 아이피 앤드 홀딩 게엠베하 접착 적용품에 사용하는데 적합한 접착제
JP2015535860A (ja) 2012-09-14 2015-12-17 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 改良接着性組成物
CN105073866A (zh) 2012-09-14 2015-11-18 汉高股份有限及两合公司 包含硫浸渍的固体颗粒的改进的粘结组合物
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
CN104946164A (zh) * 2015-05-08 2015-09-30 南通启秀门窗有限公司 金属窗
KR20190116386A (ko) * 2017-02-20 2019-10-14 로오드 코포레이션 강성 기판에 대한 접합을 위한 접착제 및 방법
CN112479601B (zh) * 2020-09-27 2022-05-13 比亚迪股份有限公司 一种覆膜制品及其制备方法、电子设备壳体
CN114133516B (zh) * 2021-12-31 2023-05-26 广东美涂士建材股份有限公司 一种自清洁低表面能改性聚氨酯的制备方法

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Also Published As

Publication number Publication date
AU2004218021A1 (en) 2004-09-16
MXPA05009071A (es) 2005-10-19
EP1597298A2 (en) 2005-11-23
KR20060013635A (ko) 2006-02-13
WO2004078867A3 (en) 2004-10-28
US20070149665A1 (en) 2007-06-28
US20040168760A1 (en) 2004-09-02
US6878231B2 (en) 2005-04-12
JP2006520849A (ja) 2006-09-14
CN1753927A (zh) 2006-03-29
WO2004078867A2 (en) 2004-09-16

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 5A, 6A, 7A E 8A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2159 DE 22/05/2012.

B15K Others concerning applications: alteration of classification

Ipc: C08G 18/80 (2006.01), C09J 123/28 (2006.01), C08K