BRPI0413654A - Composição adesiva sensìvel à pressão para fitas adesivas sensìveis à pressão medicinais, fita adesiva sensìvel à pressão medicinal, e, método para produzir uma composição adesiva sensìvel à pressão para fitas adesivas sensìveis à pressão medicinais - Google Patents
Composição adesiva sensìvel à pressão para fitas adesivas sensìveis à pressão medicinais, fita adesiva sensìvel à pressão medicinal, e, método para produzir uma composição adesiva sensìvel à pressão para fitas adesivas sensìveis à pressão medicinaisInfo
- Publication number
- BRPI0413654A BRPI0413654A BRPI0413654-3A BRPI0413654A BRPI0413654A BR PI0413654 A BRPI0413654 A BR PI0413654A BR PI0413654 A BRPI0413654 A BR PI0413654A BR PI0413654 A BRPI0413654 A BR PI0413654A
- Authority
- BR
- Brazil
- Prior art keywords
- pressure sensitive
- medicinal
- sensitive adhesive
- adhesive composition
- tapes
- Prior art date
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 229920005601 base polymer Polymers 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000002390 adhesive tape Substances 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000002243 precursor Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/40—Compositions for pressure-sensitive adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials For Medical Uses (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Package Frames And Binding Bands (AREA)
Abstract
"COMPOSIçãO ADESIVA SENSìVEL à PRESSãO PARA FITAS ADESIVAS SENSìVEIS à PRESSãO MEDICINAIS, FITA ADESIVA SENSìVEL à PRESSãO MEDICINAL, E, MéTODO PARA PRODUZIR UMA COMPOSIçãO ADESIVA SENSìVEL à PRESSãO PARA FITAS ADESIVAS SENSìVEIS à PRESSãO MEDICINAIS". Uma composição adesiva para fitas adesivas medicinais, compreendendo um polímero base contendo um polímero adesivo sensível à pressão obtido por reticulação ou cura de um precursor contendo um oligómero de acrilato de uretano e um iniciador de ultra-violeta (UV), o polímero base tendo uma temperatura de transição vítrea (Tg) de 0<198>C ou menos.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003207916A JP2005058288A (ja) | 2003-08-19 | 2003-08-19 | 医療用粘着テープのための粘着剤組成物及び粘着テープ |
| PCT/US2004/025160 WO2005019369A1 (en) | 2003-08-19 | 2004-08-04 | Pressure-sensitive adhesive tape and pressure-sensitive adhesive composition for medical adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0413654A true BRPI0413654A (pt) | 2006-10-24 |
Family
ID=34208958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0413654-3A BRPI0413654A (pt) | 2003-08-19 | 2004-08-04 | Composição adesiva sensìvel à pressão para fitas adesivas sensìveis à pressão medicinais, fita adesiva sensìvel à pressão medicinal, e, método para produzir uma composição adesiva sensìvel à pressão para fitas adesivas sensìveis à pressão medicinais |
Country Status (12)
| Country | Link |
|---|---|
| EP (1) | EP1656433B1 (pt) |
| JP (1) | JP2005058288A (pt) |
| CN (1) | CN100432177C (pt) |
| AT (1) | ATE387481T1 (pt) |
| AU (1) | AU2004267399A1 (pt) |
| BR (1) | BRPI0413654A (pt) |
| CA (1) | CA2536241A1 (pt) |
| DE (1) | DE602004012116T2 (pt) |
| ES (1) | ES2300822T3 (pt) |
| MX (1) | MXPA06001930A (pt) |
| PL (1) | PL1656433T3 (pt) |
| WO (1) | WO2005019369A1 (pt) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006299019A (ja) * | 2005-04-18 | 2006-11-02 | Three M Innovative Properties Co | 支持基材を有しない紫外線硬化型粘着テープまたはフィルム |
| US7521015B2 (en) | 2005-07-22 | 2009-04-21 | 3M Innovative Properties Company | Curable thiol-ene compositions for optical articles |
| JP2007117268A (ja) * | 2005-10-26 | 2007-05-17 | Seiko Epson Corp | 生体情報機器 |
| JP5173265B2 (ja) * | 2007-05-31 | 2013-04-03 | 株式会社瑞光 | 肌被覆用シート |
| KR101503561B1 (ko) | 2007-12-27 | 2015-03-17 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 우레아계 감압성 접착제 |
| KR20100112149A (ko) * | 2007-12-28 | 2010-10-18 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 열 및 화학선 경화성 접착제 조성물 |
| KR20100112148A (ko) * | 2007-12-28 | 2010-10-18 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 화학선 경화성 접착제 조성물 |
| DE102008012247A1 (de) * | 2008-03-03 | 2009-09-10 | Henkel Ag & Co. Kgaa | Absorbierendes Hygieneprodukt |
| CN102159611B (zh) * | 2008-09-23 | 2014-03-26 | 氰特表面技术有限公司 | 可辐射固化的粘合剂 |
| CN101721277A (zh) * | 2008-10-22 | 2010-06-09 | 3M创新有限公司 | 医用胶带及由其制成的医用制品 |
| WO2010132176A2 (en) | 2009-05-15 | 2010-11-18 | 3M Innovative Properties Company | Urethane-based pressure sensitive adhesives |
| US20120071808A1 (en) | 2009-05-29 | 2012-03-22 | Eisaku Sato | Patch material |
| JP5630256B2 (ja) * | 2010-12-24 | 2014-11-26 | Dic株式会社 | 紫外線硬化型粘着剤用樹脂組成物、粘着剤及び積層体 |
| CN103561785A (zh) * | 2011-05-03 | 2014-02-05 | 粘合剂研究股份有限公司 | 用于敷用于皮肤的压敏粘合剂及其制备方法 |
| JP5834606B2 (ja) * | 2011-08-05 | 2015-12-24 | Dic株式会社 | 紫外線硬化型粘着剤用樹脂組成物、粘着剤及び積層体 |
| JP6045892B2 (ja) * | 2012-11-30 | 2016-12-14 | 東洋化学株式会社 | 曲げ変形を受ける対象物に被覆して用いる被覆材用複合フィルム |
| KR101566060B1 (ko) | 2012-12-27 | 2015-11-04 | 제일모직주식회사 | 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재 |
| RU2703565C2 (ru) | 2014-10-09 | 2019-10-21 | Колопласт А/С | Композиция, содержащая полимер и инициатор изменения состояния |
| TWI586780B (zh) * | 2015-03-23 | 2017-06-11 | 阿科瑪法國公司 | 壓敏性黏合劑 |
| CN107849405B (zh) | 2016-02-23 | 2021-03-12 | 株式会社Lg化学 | 粘合带及其制造方法 |
| CN106634791A (zh) * | 2016-12-05 | 2017-05-10 | 常州大学 | 一种聚酯型导电压敏胶的制备方法 |
| JP2019151815A (ja) * | 2018-02-28 | 2019-09-12 | 東レ株式会社 | 積層体および樹脂フィルム |
| KR102755694B1 (ko) * | 2021-03-05 | 2025-01-21 | 동우 화인켐 주식회사 | 점착제 조성물, 이를 이용하여 형성된 점착제층, 상기 점착제층을 포함하는 점착 필름 |
| CN115537174A (zh) * | 2022-08-26 | 2022-12-30 | 佳信新材料(惠州)有限公司 | 一种亲肤、低致敏uv湿气双固化胶水及其制备方法 |
| JP2025105156A (ja) * | 2023-12-28 | 2025-07-10 | 株式会社ニトムズ | 皮膚貼付用粘着シート |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2993170B2 (ja) * | 1991-04-17 | 1999-12-20 | コーテック株式会社 | 創傷被覆材 |
| US5475038A (en) * | 1993-08-11 | 1995-12-12 | National Starch And Chemical Investment Holding Corporation | U.V. curable laminating adhesive composition |
| JP3717952B2 (ja) * | 1994-04-01 | 2005-11-16 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 医療用粘着剤及びこれを有する医療用ドレッシング材 |
| JPH07313585A (ja) * | 1994-05-24 | 1995-12-05 | Mitsubishi Chem Corp | 創傷被覆材 |
| JPH09176604A (ja) * | 1995-10-25 | 1997-07-08 | Sekisui Chem Co Ltd | 粘着剤組成物及びそれを用いた貼付剤 |
| DE19853813A1 (de) * | 1997-12-10 | 1999-06-17 | Henkel Kgaa | Klebstoff mit mehrstufiger Aushärtung und dessen Verwendung bei der Herstellung von Verbundmaterialien |
| US6663978B1 (en) * | 2000-06-28 | 2003-12-16 | 3M Innovative Properties Company | High refractive index pressure-sensitive adhesives |
| US6372074B1 (en) * | 2000-06-14 | 2002-04-16 | Avery Dennison Corporation | Method of forming a protective coating for color filters |
| JP2002060456A (ja) * | 2000-08-21 | 2002-02-26 | Kyoeisha Chem Co Ltd | ウレタンオリゴマーおよびそれを含有する粘着剤用基剤 |
| EP1375618A1 (en) * | 2002-06-19 | 2004-01-02 | 3M Innovative Properties Company | Radiation-curable, solvent-free and printable precursor of an adhesive |
| US6887917B2 (en) * | 2002-12-30 | 2005-05-03 | 3M Innovative Properties Company | Curable pressure sensitive adhesive compositions |
-
2003
- 2003-08-19 JP JP2003207916A patent/JP2005058288A/ja active Pending
-
2004
- 2004-08-04 EP EP04780061A patent/EP1656433B1/en not_active Expired - Lifetime
- 2004-08-04 MX MXPA06001930A patent/MXPA06001930A/es unknown
- 2004-08-04 CA CA002536241A patent/CA2536241A1/en not_active Abandoned
- 2004-08-04 PL PL04780061T patent/PL1656433T3/pl unknown
- 2004-08-04 WO PCT/US2004/025160 patent/WO2005019369A1/en not_active Ceased
- 2004-08-04 ES ES04780061T patent/ES2300822T3/es not_active Expired - Lifetime
- 2004-08-04 CN CNB2004800267905A patent/CN100432177C/zh not_active Expired - Fee Related
- 2004-08-04 BR BRPI0413654-3A patent/BRPI0413654A/pt not_active IP Right Cessation
- 2004-08-04 AT AT04780061T patent/ATE387481T1/de not_active IP Right Cessation
- 2004-08-04 DE DE602004012116T patent/DE602004012116T2/de not_active Expired - Lifetime
- 2004-08-04 AU AU2004267399A patent/AU2004267399A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| DE602004012116D1 (de) | 2008-04-10 |
| DE602004012116T2 (de) | 2009-02-19 |
| ES2300822T3 (es) | 2008-06-16 |
| MXPA06001930A (es) | 2006-05-31 |
| EP1656433A1 (en) | 2006-05-17 |
| JP2005058288A (ja) | 2005-03-10 |
| EP1656433B1 (en) | 2008-02-27 |
| WO2005019369A1 (en) | 2005-03-03 |
| PL1656433T3 (pl) | 2008-07-31 |
| CA2536241A1 (en) | 2005-03-03 |
| AU2004267399A1 (en) | 2005-03-03 |
| CN1852960A (zh) | 2006-10-25 |
| CN100432177C (zh) | 2008-11-12 |
| ATE387481T1 (de) | 2008-03-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 7A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2159 DE 22/05/2012. |
|
| B15K | Others concerning applications: alteration of classification |
Ipc: C09J 175/16 (2006.01), C09J 7/38 (2018.01), C08K 5 |