BRPI0417271A - unidade de tratamento para o tratamento de eletrolìtico ou quìmico a úmido de peças de trabalho planas - Google Patents

unidade de tratamento para o tratamento de eletrolìtico ou quìmico a úmido de peças de trabalho planas

Info

Publication number
BRPI0417271A
BRPI0417271A BRPI0417271-0A BRPI0417271A BRPI0417271A BR PI0417271 A BRPI0417271 A BR PI0417271A BR PI0417271 A BRPI0417271 A BR PI0417271A BR PI0417271 A BRPI0417271 A BR PI0417271A
Authority
BR
Brazil
Prior art keywords
wet chemical
electrolytic
treatment
flat workpieces
treatment unit
Prior art date
Application number
BRPI0417271-0A
Other languages
English (en)
Inventor
Uwe Hauf
Ferdinand Wiener
Henry Kunze
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BRPI0417271A publication Critical patent/BRPI0417271A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Processing Of Meat And Fish (AREA)
  • Weting (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

"UNIDADE DE TRATAMENTO PARA O TRATAMENTO ELETROLìTICO OU QUìMICO A úMIDO DE PEçAS DE TRABALHO PLANAS". A presente invenção refere-se a unidades de tratamento para o tratamento eletrolítico ou químico a úmido de peças de trabalho planas (1), taís como folhas de metal, folhas de circuito impresso ou placas de circuito impresso, nas quais as peças de trabalho (1) são transportadas em uma trajetória de transporte por meio de elementos de condução (6, 6<39>, 6<39><39>, 7). A unidade de tratamento compreende elementos de transporte (4) com recessos (21), os ditos elementos de transporte (4) sendo orientados para serem paralelos à trajetória de transporte, e pelo menos um sistema de módulo para transportar os elementos de condução (6, 6<39>, 6<39><39>, 7) que consiste em elementos de inserção (14, 26), preferivelmente disposto em pares, o dito pelo menos um sistema de módulo sendo configurado tal que registra com e é deslizável dos recessos (21) dos elementos de transporte. A unidade de tratamento é preferivelmente utilizada em linhas horizontais equipadas com transportadores.
BRPI0417271-0A 2003-12-19 2004-12-07 unidade de tratamento para o tratamento de eletrolìtico ou quìmico a úmido de peças de trabalho planas BRPI0417271A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10361880A DE10361880B3 (de) 2003-12-19 2003-12-19 Behandlungseinheit zur nasschemischen oder elektrolytischen Behandlung von flachem Behandlungsgut und Verwendung der Behandlungseinheit
PCT/EP2004/014008 WO2005059206A2 (en) 2003-12-19 2004-12-07 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces

Publications (1)

Publication Number Publication Date
BRPI0417271A true BRPI0417271A (pt) 2007-03-27

Family

ID=34399723

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0417271-0A BRPI0417271A (pt) 2003-12-19 2004-12-07 unidade de tratamento para o tratamento de eletrolìtico ou quìmico a úmido de peças de trabalho planas

Country Status (13)

Country Link
US (1) US7993486B2 (pt)
EP (1) EP1694886B1 (pt)
JP (1) JP4887157B2 (pt)
KR (1) KR101149302B1 (pt)
CN (1) CN1894444B (pt)
AT (1) ATE374266T1 (pt)
BR (1) BRPI0417271A (pt)
DE (2) DE10361880B3 (pt)
ES (1) ES2293364T3 (pt)
NO (1) NO20063257L (pt)
PL (1) PL1694886T3 (pt)
TW (1) TWI388699B (pt)
WO (1) WO2005059206A2 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4805195B2 (ja) * 2007-03-13 2011-11-02 富士フイルム株式会社 軸受体、液切り装置及びめっき被膜付きフィルムの製造装置
DE102007026635B4 (de) * 2007-06-06 2010-07-29 Atotech Deutschland Gmbh Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware
US9449862B2 (en) 2011-06-03 2016-09-20 Tel Nexx, Inc. Parallel single substrate processing system
CN103266334B (zh) * 2013-04-24 2015-12-02 东莞市鸿展机械设备有限公司 隔液传送装置
CN103213804A (zh) * 2013-05-08 2013-07-24 湖南三星磊洋玻璃机械有限公司 一种固定架

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
DE3369294D1 (en) * 1982-05-28 1987-02-26 De La Rue Syst Banding method and apparatus
US4607590A (en) * 1982-09-07 1986-08-26 Pender Don P Apparatus for directing fluid stream against substrate sheet
JP2538671B2 (ja) * 1989-06-26 1996-09-25 川崎製鉄株式会社 水平処理槽におけるロ―ル交換装置
DE4035932A1 (de) * 1990-11-12 1992-05-14 Hoellmueller Hans Vorrichtung zur herstellung flexibler schaltungen bzw. von multilayer-innenschichten
JPH04311590A (ja) * 1991-04-11 1992-11-04 Seiko Instr Inc フープ材両面部分めっき装置
DE4402596C2 (de) * 1994-01-28 1997-03-27 Atotech Deutschland Gmbh Elektrolytisches Verfahren in horizontalen Durchlaufanlagen und Vorrichtung zur Durchführung desselben
US5592958A (en) * 1995-02-01 1997-01-14 Coates, Asi, Inc. Flood conveyer
US5755935A (en) * 1996-03-07 1998-05-26 Jackson; Dale Processing system
DE05075545T1 (de) * 1998-05-20 2006-08-31 Process Automation International Ltd., Tai Po Vorrichtung zur Elektroplattierung
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
DE10015349A1 (de) * 2000-03-23 2001-10-25 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Behandeln von durchgehende Löcher und/oder Vertiefungen aufweisenden Schaltungsträgern sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
DE10210538B4 (de) * 2002-03-05 2004-11-18 Atotech Deutschland Gmbh Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut

Also Published As

Publication number Publication date
US7993486B2 (en) 2011-08-09
PL1694886T3 (pl) 2008-03-31
EP1694886B1 (en) 2007-09-26
US20070012560A1 (en) 2007-01-18
JP4887157B2 (ja) 2012-02-29
CN1894444A (zh) 2007-01-10
CN1894444B (zh) 2010-07-14
ES2293364T3 (es) 2008-03-16
KR101149302B1 (ko) 2012-05-25
ATE374266T1 (de) 2007-10-15
DE10361880B3 (de) 2005-05-04
WO2005059206A3 (en) 2006-01-12
TW200533790A (en) 2005-10-16
TWI388699B (zh) 2013-03-11
KR20060133995A (ko) 2006-12-27
EP1694886A2 (en) 2006-08-30
NO20063257L (no) 2006-09-19
JP2007514866A (ja) 2007-06-07
DE602004009215T2 (de) 2008-06-26
DE602004009215D1 (de) 2007-11-08
HK1088641A1 (en) 2006-11-10
WO2005059206A2 (en) 2005-06-30

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2158 DE 15/05/2012.