BRPI0518077A - processo de fabricação de uma estrutura destinada à obtenção de um documento de segurança e/ou de valor ou para o aumento de segurança de um artigo e respectiva estrutura - Google Patents

processo de fabricação de uma estrutura destinada à obtenção de um documento de segurança e/ou de valor ou para o aumento de segurança de um artigo e respectiva estrutura

Info

Publication number
BRPI0518077A
BRPI0518077A BRPI0518077-5A BRPI0518077A BRPI0518077A BR PI0518077 A BRPI0518077 A BR PI0518077A BR PI0518077 A BRPI0518077 A BR PI0518077A BR PI0518077 A BRPI0518077 A BR PI0518077A
Authority
BR
Brazil
Prior art keywords
security
article
value document
enhancing
electronic device
Prior art date
Application number
BRPI0518077-5A
Other languages
English (en)
Inventor
Paolo Pepori
Pierre Doublet
Original Assignee
Arjowiggins Security
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arjowiggins Security filed Critical Arjowiggins Security
Publication of BRPI0518077A publication Critical patent/BRPI0518077A/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PROCESSO DE FABRICAçãO DE UMA ESTRUTURA DESTINADA à OBTENçãO DE UM DOCUMENTO DE SEGURANçA E/OU DE VALOR OU PARA O AUMENTO DE SEGURANçA DE UM ARTIGO E RESPECTIVA ESTRUTURA. A presente invenção se refere a um processo de fabricação de uma estrutura destinada à realização de um documento de segurança e/ou de valor ou para o aumento de segurança de um artigo, a estrutura compreendendo pelo menos um dispositivo eletrónico (106; 120) e pelo menos uma camada pelo menos parcialmente fibrosa (108; 34; 35) com uma janela (109; 40; 41) disposta para receber pelo menos parcialmente o dispositivo eletrónico, o processo compreendendo as etapas seguintes: -dispor o dispositivo eletrónico pelo menos parcialmente na janela da camada, e depois - colocar uma resina (112; 130) na janela de maneira a encapsular pelo menos parcialmente o dispositivo eletrónico.
BRPI0518077-5A 2004-10-29 2005-10-28 processo de fabricação de uma estrutura destinada à obtenção de um documento de segurança e/ou de valor ou para o aumento de segurança de um artigo e respectiva estrutura BRPI0518077A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0452488A FR2877462B1 (fr) 2004-10-29 2004-10-29 Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
PCT/FR2005/050914 WO2006048577A1 (fr) 2004-10-29 2005-10-28 Structure comportant un dispositif electronique pour la fabrication d'un document de securite

Publications (1)

Publication Number Publication Date
BRPI0518077A true BRPI0518077A (pt) 2008-10-28

Family

ID=34951047

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0518077-5A BRPI0518077A (pt) 2004-10-29 2005-10-28 processo de fabricação de uma estrutura destinada à obtenção de um documento de segurança e/ou de valor ou para o aumento de segurança de um artigo e respectiva estrutura

Country Status (6)

Country Link
US (1) US8079519B2 (pt)
EP (1) EP1805696A1 (pt)
BR (1) BRPI0518077A (pt)
CA (1) CA2585335A1 (pt)
FR (1) FR2877462B1 (pt)
WO (1) WO2006048577A1 (pt)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4888494B2 (ja) * 2007-02-06 2012-02-29 株式会社村田製作所 電磁結合モジュール付き包装材
FR2922342B1 (fr) * 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
FR2935060B1 (fr) * 2008-08-12 2010-09-10 Arjowiggins Licensing Sas E-document comportant un element de perturbation electromagnetique
FR2948796A1 (fr) * 2009-07-28 2011-02-04 Ask Sa Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication
FR2963137B1 (fr) * 2010-07-20 2016-02-19 Oberthur Technologies Insert a transpondeur et dispositif comprenant un tel insert
JP2012032931A (ja) * 2010-07-29 2012-02-16 Hitachi Ltd Ｒｆｉｄタグ及びｒｆｉｄタグの製造方法
DE202010014862U1 (de) 2010-10-28 2010-12-30 Beta Layout Gmbh Leiterplatte mit integriertem RFID-Mikrochip
US9790390B2 (en) 2010-11-02 2017-10-17 Standard Register, Inc. Thermochromic ink and document printed therewith
MX2013006604A (es) * 2010-12-21 2013-07-29 Merck Patent Gmbh Elemento coloreado de seguridad magnetizable.
US8720776B2 (en) * 2011-11-10 2014-05-13 Paul Llewellyn Greene X-ray security system
WO2013155268A1 (en) * 2012-04-11 2013-10-17 Universal Surveillance Systems, Llc Hybrid label
CN104077697B (zh) * 2013-03-29 2021-12-07 优品保有限公司 移动式现场物品鉴别的系统和方法
JP6196463B2 (ja) * 2013-04-30 2017-09-13 トッパン・フォームズ株式会社 情報媒体およびその製造方法
US9916580B2 (en) 2014-04-04 2018-03-13 Visa International Service Association Payment device with holographic security element
SG11201810511QA (en) * 2016-07-27 2018-12-28 Philip Morris Products Sa Modified container of consumer articles comprising an element of discernible thickness
WO2018151238A1 (ja) * 2017-02-16 2018-08-23 大日本印刷株式会社 情報ページ
FR3063414B1 (fr) * 2017-02-27 2021-07-23 Linxens Holding Procede de fabrication d’un circuit electrique, circuit electrique obtenu par ce procede et carte a puce comportant un tel circuit electrique.
SE1751265A1 (en) * 2017-10-13 2019-03-12 Stora Enso Oyj Method and arrangement for producing a label with integrated electrically conductive pattern
US11376882B2 (en) * 2018-10-16 2022-07-05 Idemia Identity & Security USA LLC Fused polyester identification documents
EP3726415A1 (en) * 2019-04-18 2020-10-21 Thales Dis France SA Security element on module

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
FR2691563B1 (fr) * 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
GB2279907B (en) 1993-07-02 1996-11-06 Gec Avery Ltd An integrated circuit card
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5975420A (en) * 1995-04-13 1999-11-02 Dai Nippon Printing Co., Ltd. Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module
DE19602821C1 (de) * 1996-01-26 1997-06-26 Siemens Ag Verfahren zur Herstellung einer Datenkarte
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FR2775533B1 (fr) 1998-02-27 2003-02-14 Gemplus Sca Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
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JP2001092934A (ja) 1999-09-20 2001-04-06 Toshiba Corp 無線情報記憶媒体、無線情報記憶媒体の製造方法、無線情報記憶媒体を備えた冊子体、無線情報記憶媒体を用いた身分確認システム、および無線情報記憶媒体の発行システム
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FR2832354B1 (fr) * 2001-11-20 2004-02-20 Arjo Wiggins Sa Procede de fabrication d'un article comportant une feuille et au moins un element rapporte sur cette feuille
FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
FI20022094A0 (fi) * 2002-11-25 2002-11-25 Rafsec Oy Transponderi ja menetelmä sen valmistamiseksi

Also Published As

Publication number Publication date
US20090294534A1 (en) 2009-12-03
CA2585335A1 (fr) 2006-05-11
US8079519B2 (en) 2011-12-20
WO2006048577A1 (fr) 2006-05-11
FR2877462A1 (fr) 2006-05-05
EP1805696A1 (fr) 2007-07-11
FR2877462B1 (fr) 2007-01-26

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2278 DE 02/09/2014.