BRPI0519837B1 - ligas de cobre de fácil usinagem contendo um teor de chumbo muito baixo - Google Patents

ligas de cobre de fácil usinagem contendo um teor de chumbo muito baixo

Info

Publication number
BRPI0519837B1
BRPI0519837B1 BRPI0519837A BRPI0519837A BRPI0519837B1 BR PI0519837 B1 BRPI0519837 B1 BR PI0519837B1 BR PI0519837 A BRPI0519837 A BR PI0519837A BR PI0519837 A BRPI0519837 A BR PI0519837A BR PI0519837 B1 BRPI0519837 B1 BR PI0519837B1
Authority
BR
Brazil
Prior art keywords
weight
copper alloys
percent
alloys containing
lead content
Prior art date
Application number
BRPI0519837A
Other languages
English (en)
Inventor
Keiichiro Oishi
Original Assignee
Mitsubishi Shindo Kk
Sambo Copper Alloy Co Ltd
Sanbo Shindo Kogyo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36029527&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BRPI0519837(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsubishi Shindo Kk, Sambo Copper Alloy Co Ltd, Sanbo Shindo Kogyo Kabushiki Kaisha filed Critical Mitsubishi Shindo Kk
Publication of BRPI0519837A2 publication Critical patent/BRPI0519837A2/pt
Publication of BRPI0519837B1 publication Critical patent/BRPI0519837B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Domestic Plumbing Installations (AREA)
  • Drilling Tools (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

liga de cobre de fácil usinagem contendo um teor de chumbo muito baixo. a presente invenção refere-se a uma liga de cobre de fácil usinagem conforme a presente invenção contém uma quantidade grandemente reduzida de chumbo em comparação com as ligas de cobre de fácil usinagem convencionais, mas fornece uma capacidade de usinagem industrialmente satisfatória. as ligas de fácil usinagem compreendem 71,5 a 78,5 por cento, em peso, de cobre, 2,0 a 4,5 por cento, em peso, de silício, 0,005 por cento até menos de 0,2 por cento, em peso, de chumbo, e o percentual restante, em peso, de zinco.
BRPI0519837A 2005-09-22 2005-09-22 ligas de cobre de fácil usinagem contendo um teor de chumbo muito baixo BRPI0519837B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/018206 WO2007034571A1 (en) 2005-09-22 2005-09-22 Free-cutting copper alloy containing very low lead

Publications (2)

Publication Number Publication Date
BRPI0519837A2 BRPI0519837A2 (pt) 2009-03-17
BRPI0519837B1 true BRPI0519837B1 (pt) 2016-11-16

Family

ID=36029527

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0519837A BRPI0519837B1 (pt) 2005-09-22 2005-09-22 ligas de cobre de fácil usinagem contendo um teor de chumbo muito baixo

Country Status (12)

Country Link
US (1) US7883589B2 (pt)
EP (1) EP1929057B1 (pt)
JP (1) JP4951623B2 (pt)
KR (1) KR101211206B1 (pt)
CN (1) CN101098976B (pt)
AT (1) ATE557108T1 (pt)
BR (1) BRPI0519837B1 (pt)
CA (1) CA2619357C (pt)
EG (1) EG25433A (pt)
ES (1) ES2387065T3 (pt)
MX (1) MXPA06002911A (pt)
WO (1) WO2007034571A1 (pt)

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JP6448167B1 (ja) * 2017-08-15 2019-01-09 三菱伸銅株式会社 高強度快削性銅合金、及び、高強度快削性銅合金の製造方法
JP6448168B1 (ja) * 2017-08-15 2019-01-09 三菱伸銅株式会社 快削性銅合金、及び、快削性銅合金の製造方法
US11155909B2 (en) 2017-08-15 2021-10-26 Mitsubishi Materials Corporation High-strength free-cutting copper alloy and method for producing high-strength free-cutting copper alloy
CN107398485B (zh) * 2017-08-17 2019-11-29 诸暨易联众创企业管理服务有限公司 一种易切削导电用硫铜棒生产方法
DE112017003251B4 (de) * 2017-12-21 2025-01-02 Mitsubishi Electric Corporation Numerische Steuerungsvorrichtung
JP7180488B2 (ja) * 2019-03-25 2022-11-30 三菱マテリアル株式会社 銅合金丸棒材
PT3872199T (pt) 2019-06-25 2023-03-21 Mitsubishi Materials Corp Liga de cobre para maquinagem e processo de fabrico de liga de cobrre para maquinagem
CN110306078B (zh) * 2019-08-05 2020-10-23 成都云鑫有色金属有限公司 一种高强高导电易切削c97合金材料及其制备方法
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Also Published As

Publication number Publication date
JP2009509031A (ja) 2009-03-05
CA2619357A1 (en) 2007-03-29
EP1929057A1 (en) 2008-06-11
EG25433A (en) 2012-01-03
US7883589B2 (en) 2011-02-08
ATE557108T1 (de) 2012-05-15
KR20080050399A (ko) 2008-06-05
KR101211206B1 (ko) 2012-12-11
WO2007034571A1 (en) 2007-03-29
CN101098976B (zh) 2014-08-13
ES2387065T3 (es) 2012-09-12
CA2619357C (en) 2012-05-01
US20070062615A1 (en) 2007-03-22
JP4951623B2 (ja) 2012-06-13
CN101098976A (zh) 2008-01-02
EP1929057B1 (en) 2012-05-09
BRPI0519837A2 (pt) 2009-03-17
MXPA06002911A (es) 2007-04-12

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Free format text: CONFORME A PETICAO DE CUMPRIMENTO DE EXIGENCIA TECNICA, NPRJ 020130096197 DE 30/12/2013, ANULA-SE ODESPACHO DE ARQUIVAMENTO DO PEDIDO (11.2), PUBLICADO NA RPI 2265 DE 03/06/2014. O INTERESSADO PODERA SOLICITAR O PARECER TECNICO REFERENTE A ESTA DECISAO.

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