BRPI0621083A2 - composição de resina epóxi curável contendo halogênio, artigo compósito reforçado com fibra, componente de circuito elétrico, processo para produzir um artigo revestido, pré- impregnado, laminado, placa de circuito impresso (pcb), processo para preparar um artigo revestido com resina, e artigo revestido com resina - Google Patents
composição de resina epóxi curável contendo halogênio, artigo compósito reforçado com fibra, componente de circuito elétrico, processo para produzir um artigo revestido, pré- impregnado, laminado, placa de circuito impresso (pcb), processo para preparar um artigo revestido com resina, e artigo revestido com resina Download PDFInfo
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- BRPI0621083A2 BRPI0621083A2 BRPI0621083-0A BRPI0621083A BRPI0621083A2 BR PI0621083 A2 BRPI0621083 A2 BR PI0621083A2 BR PI0621083 A BRPI0621083 A BR PI0621083A BR PI0621083 A2 BRPI0621083 A2 BR PI0621083A2
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- epoxy resin
- resin composition
- catalyst
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 189
- 239000000203 mixture Substances 0.000 title claims abstract description 188
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 182
- 229920005989 resin Polymers 0.000 title claims abstract description 64
- 239000011347 resin Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 40
- 229910052736 halogen Inorganic materials 0.000 title claims abstract description 35
- 150000002367 halogens Chemical class 0.000 title claims abstract description 35
- 230000008569 process Effects 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000003733 fiber-reinforced composite Substances 0.000 title claims 3
- 239000003054 catalyst Substances 0.000 claims abstract description 89
- 150000001875 compounds Chemical class 0.000 claims abstract description 77
- 239000002671 adjuvant Substances 0.000 claims abstract description 42
- -1 halogenated flame retardant compound Chemical class 0.000 claims abstract description 34
- 239000004848 polyfunctional curative Substances 0.000 claims abstract description 34
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
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- 239000010949 copper Substances 0.000 claims abstract description 22
- 239000011342 resin composition Substances 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
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- 230000004044 response Effects 0.000 claims abstract description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 41
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 34
- 239000007787 solid Substances 0.000 claims description 31
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- 239000002904 solvent Substances 0.000 claims description 22
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 15
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- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims description 13
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- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical group OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims description 10
- IZXIZTKNFFYFOF-UHFFFAOYSA-N 2-Oxazolidone Chemical compound O=C1NCCO1 IZXIZTKNFFYFOF-UHFFFAOYSA-N 0.000 claims description 9
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 7
- 239000011152 fibreglass Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
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- 125000002883 imidazolyl group Chemical group 0.000 claims 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
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- 238000000354 decomposition reaction Methods 0.000 abstract description 9
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- 239000003795 chemical substances by application Substances 0.000 description 48
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 31
- 239000002966 varnish Substances 0.000 description 23
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- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000004922 lacquer Substances 0.000 description 15
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical class N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 11
- 150000002989 phenols Chemical class 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 150000002430 hydrocarbons Chemical class 0.000 description 9
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 7
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- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 6
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 6
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 6
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- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical compound CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
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- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical class CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- PMUPSYZVABJEKC-UHFFFAOYSA-N 1-methylcyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)CCCCC1C(O)=O PMUPSYZVABJEKC-UHFFFAOYSA-N 0.000 description 1
- JHJUYGMZIWDHMO-UHFFFAOYSA-N 2,6-dibromo-4-(3,5-dibromo-4-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(Br)C(O)=C(Br)C=C1S(=O)(=O)C1=CC(Br)=C(O)C(Br)=C1 JHJUYGMZIWDHMO-UHFFFAOYSA-N 0.000 description 1
- CZAZXHQSSWRBHT-UHFFFAOYSA-N 2-(2-hydroxyphenyl)-3,4,5,6-tetramethylphenol Chemical compound OC1=C(C)C(C)=C(C)C(C)=C1C1=CC=CC=C1O CZAZXHQSSWRBHT-UHFFFAOYSA-N 0.000 description 1
- HSAOVLDFJCYOPX-UHFFFAOYSA-N 2-[4-(1,3-benzothiazol-2-yl)phenyl]-1,3-benzothiazole Chemical compound C1=CC=C2SC(C3=CC=C(C=C3)C=3SC4=CC=CC=C4N=3)=NC2=C1 HSAOVLDFJCYOPX-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/13—Phenols; Phenolates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75302805P | 2005-12-22 | 2005-12-22 | |
| US60/753,028 | 2005-12-22 | ||
| PCT/US2006/048578 WO2007075769A1 (fr) | 2005-12-22 | 2006-12-20 | Composition de resine epoxy durcissable et stratifies ainsi obtenus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0621083A2 true BRPI0621083A2 (pt) | 2011-11-29 |
Family
ID=37968126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0621083-0A BRPI0621083A2 (pt) | 2005-12-22 | 2006-12-20 | composição de resina epóxi curável contendo halogênio, artigo compósito reforçado com fibra, componente de circuito elétrico, processo para produzir um artigo revestido, pré- impregnado, laminado, placa de circuito impresso (pcb), processo para preparar um artigo revestido com resina, e artigo revestido com resina |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20090159313A1 (fr) |
| EP (1) | EP1966268A1 (fr) |
| JP (1) | JP5502326B2 (fr) |
| KR (1) | KR20080077639A (fr) |
| CN (1) | CN101341181B (fr) |
| BR (1) | BRPI0621083A2 (fr) |
| TW (1) | TWI476243B (fr) |
| WO (1) | WO2007075769A1 (fr) |
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| WO2009014852A2 (fr) * | 2007-07-20 | 2009-01-29 | Dow Global Technologies Inc. | Procédé d'époxylation de polyènes bruts |
| WO2009040921A1 (fr) * | 2007-09-27 | 2009-04-02 | Panasonic Electric Works Co., Ltd. | Composition de résine époxyde et stratifié de préimprégné et de revêtement métallique produit à l'aide de cette composition |
| US8975318B2 (en) * | 2008-02-21 | 2015-03-10 | Huntsman Advanced Materials Americas Llc | Halogen-free benzoxazine based curable compositions for high TG applications |
| US20090226719A1 (en) * | 2008-03-05 | 2009-09-10 | Sara Molina | Composite material formulation |
| WO2009117345A2 (fr) | 2008-03-17 | 2009-09-24 | Henkel Corporation | Compositions adhésives pouvant être utilisées dans des applications de report de puces |
| JP2011074123A (ja) * | 2009-09-29 | 2011-04-14 | Panasonic Electric Works Co Ltd | 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板 |
| EP2496632B1 (fr) | 2009-11-06 | 2015-04-29 | Dow Global Technologies LLC | Compositions de résine époxy stables à la conservation pour stratifiés électriques |
| SG181486A1 (en) * | 2009-12-02 | 2012-07-30 | Dow Global Technologies Llc | Coating compositions |
| US8698320B2 (en) | 2009-12-07 | 2014-04-15 | Henkel IP & Holding GmbH | Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices |
| US20130146816A1 (en) * | 2010-04-19 | 2013-06-13 | Trillion Science Inc. | One part epoxy resin including acrylic block copolymer |
| US8455573B2 (en) * | 2010-12-20 | 2013-06-04 | E I Du Pont De Nemours And Company | Curable composition comprising imidazolium monocarboxylate salt |
| US20120156474A1 (en) * | 2010-12-20 | 2012-06-21 | E. I. Du Pont De Nemours And Company | Article having curable coating comprising imidazolium monocarboxylate salt |
| WO2013023101A1 (fr) * | 2011-08-10 | 2013-02-14 | Cac, Inc. | Appareil d'interconnexion d'axe z à couches multiples et son procédé d'utilisation |
| WO2013065516A1 (fr) | 2011-10-31 | 2013-05-10 | 東レ株式会社 | Composition de résine époxy en deux parties pour matériaux composites renforcés par fibres, et matériau composite renforcé par fibres |
| DK2695903T3 (en) | 2012-08-08 | 2019-01-14 | Siemens Ag | Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process |
| EP2909249B1 (fr) * | 2012-10-17 | 2019-07-31 | Dow Global Technologies LLC | Résines époxy solides modifiées par du caoutchouc noyau-enveloppe |
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| JP5969133B2 (ja) * | 2013-08-23 | 2016-08-17 | 台光電子材料（昆山）有限公司Ｅｌｉｔｅ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌ （Ｋｕｎｓｈａｎ） Ｃｏ． Ｌｔｄ | 樹脂組成物ならびにそれを使用した銅張積層板およびプリント回路板 |
| JP6670045B2 (ja) * | 2015-03-13 | 2020-03-18 | 日鉄ケミカル＆マテリアル株式会社 | オキサゾリドン環含有エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物 |
| WO2018190329A1 (fr) * | 2017-04-12 | 2018-10-18 | 三菱ケミカル株式会社 | Composé de moulage en feuille et matériau composite renforcé par des fibres |
| CN109233543B (zh) * | 2017-05-03 | 2020-09-22 | 中山台光电子材料有限公司 | 树脂组合物及由其制成的物品 |
| WO2018216975A1 (fr) * | 2017-05-24 | 2018-11-29 | 코오롱인더스트리(주) | Composite d'aramide de protection, son procédé de préparation, et stratifié de protection fabriqué à partir de celui-ci |
| CN111393804B (zh) * | 2020-04-22 | 2023-03-28 | 广东众森实业发展有限公司 | 环氧树脂组合物及其制备方法和由其制得的纤维预浸料 |
| WO2022070849A1 (fr) * | 2020-09-30 | 2022-04-07 | 日鉄ケミカル＆マテリアル株式会社 | Mélange précurseur de résine époxy thermoplastique de type polymérisation in situ, composition de résine époxy, feuille de composition de résine époxy, préimprégné et plastique renforcé par des fibres thermoplastiques de type polymérisation in situ l'utilisant |
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-
2006
- 2006-12-20 WO PCT/US2006/048578 patent/WO2007075769A1/fr not_active Ceased
- 2006-12-20 BR BRPI0621083-0A patent/BRPI0621083A2/pt not_active IP Right Cessation
- 2006-12-20 CN CN2006800484130A patent/CN101341181B/zh not_active Expired - Fee Related
- 2006-12-20 JP JP2008547480A patent/JP5502326B2/ja not_active Expired - Fee Related
- 2006-12-20 US US12/097,647 patent/US20090159313A1/en not_active Abandoned
- 2006-12-20 EP EP20060847819 patent/EP1966268A1/fr not_active Withdrawn
- 2006-12-20 KR KR1020087015087A patent/KR20080077639A/ko not_active Abandoned
- 2006-12-21 TW TW095148171A patent/TWI476243B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007075769A1 (fr) | 2007-07-05 |
| JP2009521566A (ja) | 2009-06-04 |
| KR20080077639A (ko) | 2008-08-25 |
| US20090159313A1 (en) | 2009-06-25 |
| JP5502326B2 (ja) | 2014-05-28 |
| EP1966268A1 (fr) | 2008-09-10 |
| TWI476243B (zh) | 2015-03-11 |
| CN101341181B (zh) | 2013-09-04 |
| TW200732415A (en) | 2007-09-01 |
| CN101341181A (zh) | 2009-01-07 |
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