BRPI0705011A - eletrodo negativo cilìndrico de deposição fìsica de vapor (pvd) - Google Patents

eletrodo negativo cilìndrico de deposição fìsica de vapor (pvd)

Info

Publication number
BRPI0705011A
BRPI0705011A BRPI0705011-9A BRPI0705011A BRPI0705011A BR PI0705011 A BRPI0705011 A BR PI0705011A BR PI0705011 A BRPI0705011 A BR PI0705011A BR PI0705011 A BRPI0705011 A BR PI0705011A
Authority
BR
Brazil
Prior art keywords
pvd
evaporation material
negative electrode
vapor deposition
substrate
Prior art date
Application number
BRPI0705011-9A
Other languages
English (en)
Inventor
Toshiaki Takao
Takahiro Okazaki
Hirofumi Fujii
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of BRPI0705011A publication Critical patent/BRPI0705011A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1303—Paper containing [e.g., paperboard, cardboard, fiberboard, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/1355—Elemental metal containing [e.g., substrate, foil, film, coating, etc.]
    • Y10T428/1359—Three or more layers [continuous layer]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Materials For Medical Uses (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)

Abstract

ELETRODO NEGATIVO CILìNDRICO DE DEPOSIçãO FìSICA DE VAPOR A presente invenção proporciona um eletrodo negativo cilíndrico de deposição física de vapor (PVD) que compreende um material de evaporação cobrindo a superfície circunferencial externa de um substrato cilíndrico, o eletrodo negativo cilíndrico de PVD inclui uma parte de acoplamento dotada de pelo menos qualquer uma forma protuberante e uma forma rebaixada, formada com partes angulares arredondadas na interface entre o substrato e o material de evaporação. De acordo com essa estrutura, desfolhamento ou fissuramento do material de evaporação por parte de urna tensão residual provocada na interface entre o substrato e o material de evaporação por uma diferença de expansão térmica entre os dois pode ser suprimida, e pode-se assegurar também aderência suficiente entre os dois.
BRPI0705011-9A 2006-06-29 2007-06-29 eletrodo negativo cilìndrico de deposição fìsica de vapor (pvd) BRPI0705011A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006179874A JP4680841B2 (ja) 2006-06-29 2006-06-29 Ｐｖｄ用筒状ターゲット

Publications (1)

Publication Number Publication Date
BRPI0705011A true BRPI0705011A (pt) 2008-05-20

Family

ID=38617304

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0705011-9A BRPI0705011A (pt) 2006-06-29 2007-06-29 eletrodo negativo cilìndrico de deposição fìsica de vapor (pvd)

Country Status (8)

Country Link
US (1) US7955673B2 (pt)
EP (1) EP1873274B1 (pt)
JP (1) JP4680841B2 (pt)
CN (1) CN101096750B (pt)
AT (1) ATE478973T1 (pt)
BR (1) BRPI0705011A (pt)
DE (1) DE602007008644D1 (pt)
PT (1) PT1873274E (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060226003A1 (en) * 2003-01-22 2006-10-12 John Mize Apparatus and methods for ionized deposition of a film or thin layer
US9659758B2 (en) * 2005-03-22 2017-05-23 Honeywell International Inc. Coils utilized in vapor deposition applications and methods of production
US20060278520A1 (en) * 2005-06-13 2006-12-14 Lee Eal H Use of DC magnetron sputtering systems
DE102007044651B4 (de) * 2007-09-18 2011-07-21 W.C. Heraeus GmbH, 63450 Rohrsputtertarget mit grabenförmig strukturierter Außenfläche des Trägerrohres sowie Verfahren zu seiner Herstellung
US20090194414A1 (en) * 2008-01-31 2009-08-06 Nolander Ira G Modified sputtering target and deposition components, methods of production and uses thereof
US20130140173A1 (en) * 2011-06-10 2013-06-06 Séverin Stéphane Gérard Tierce Rotary sputter target assembly
CN103397301A (zh) * 2013-07-17 2013-11-20 中国南玻集团股份有限公司 圆筒旋转银靶及其制备方法
US11183373B2 (en) 2017-10-11 2021-11-23 Honeywell International Inc. Multi-patterned sputter traps and methods of making
CN112743075A (zh) * 2020-12-29 2021-05-04 宁波江丰电子材料股份有限公司 一种管状靶材的绑定方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6417862A (en) 1987-07-10 1989-01-20 Fujitsu Ltd Sputtering device
US5354446A (en) * 1988-03-03 1994-10-11 Asahi Glass Company Ltd. Ceramic rotatable magnetron sputtering cathode target and process for its production
JPH05230645A (ja) 1991-12-24 1993-09-07 Asahi Glass Co Ltd セラミックス回転カソードターゲット及びその製造法
JPH07173622A (ja) * 1993-12-17 1995-07-11 Kobe Steel Ltd Ｐｖｄ法用円筒状ターゲット
JPH07228967A (ja) 1994-02-17 1995-08-29 Mitsubishi Materials Corp 長尺円筒状スパッタリングターゲット
JPH08109472A (ja) 1994-10-14 1996-04-30 Asahi Glass Co Ltd スパッタリング用ターゲットおよびその製造方法
US5593624A (en) * 1995-05-24 1997-01-14 Lewis; Eugene R. Method for making cellular packaging board with inhibitor
JP3810840B2 (ja) 1996-01-16 2006-08-16 株式会社神戸製鋼所 アークイオンプレーティング装置に用いる積層ターゲット及びその製造方法
JP2000199055A (ja) 1999-01-06 2000-07-18 Hitachi Metals Ltd Ｃｒタ―ゲット材およびその製造方法
AU2001284441A1 (en) * 2000-09-08 2002-03-22 Asahi Glass Company, Limited Cylindrical target and method of manufacturing the cylindrical target
ES2293442T3 (es) 2005-08-02 2008-03-16 APPLIED MATERIALS GMBH & CO. KG Catodo tubular para pulverizacion catodica.

Also Published As

Publication number Publication date
JP4680841B2 (ja) 2011-05-11
DE602007008644D1 (de) 2010-10-07
PT1873274E (pt) 2010-09-30
EP1873274B1 (en) 2010-08-25
US20080003385A1 (en) 2008-01-03
ATE478973T1 (de) 2010-09-15
CN101096750B (zh) 2010-12-22
CN101096750A (zh) 2008-01-02
EP1873274A3 (en) 2008-01-23
JP2008007824A (ja) 2008-01-17
US7955673B2 (en) 2011-06-07
EP1873274A2 (en) 2008-01-02

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Legal Events

Date Code Title Description
B06T Formal requirements before examination [chapter 6.20 patent gazette]

Free format text: PARECER 6.20

B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]