BRPI0806015A2 - processo de preparação de filmes finos ou ultra-finos e nanocompósitos de nanopartìculas de óxidos metálicos e/ou metais impregnados e/ou depositados em substratos vìtreos, poliméricos, madeiras, metais e outros - Google Patents
processo de preparação de filmes finos ou ultra-finos e nanocompósitos de nanopartìculas de óxidos metálicos e/ou metais impregnados e/ou depositados em substratos vìtreos, poliméricos, madeiras, metais e outros Download PDFInfo
- Publication number
- BRPI0806015A2 BRPI0806015A2 BRPI0806015A BRPI0806015A2 BR PI0806015 A2 BRPI0806015 A2 BR PI0806015A2 BR PI0806015 A BRPI0806015 A BR PI0806015A BR PI0806015 A2 BRPI0806015 A2 BR PI0806015A2
- Authority
- BR
- Brazil
- Prior art keywords
- metal
- metals
- wood
- substrates
- temperature
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 39
- 239000002184 metal Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 33
- 229910044991 metal oxide Inorganic materials 0.000 title claims abstract description 25
- 150000004706 metal oxides Chemical class 0.000 title claims abstract description 25
- 239000002023 wood Substances 0.000 title claims abstract description 19
- 230000008569 process Effects 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000002105 nanoparticle Substances 0.000 title claims description 7
- 239000010409 thin film Substances 0.000 title abstract description 16
- 239000002114 nanocomposite Substances 0.000 title abstract description 10
- 150000002739 metals Chemical class 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 17
- 230000009477 glass transition Effects 0.000 claims abstract description 10
- 230000008859 change Effects 0.000 claims abstract description 7
- 230000003647 oxidation Effects 0.000 claims abstract description 7
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract 5
- 229920000307 polymer substrate Polymers 0.000 claims abstract 2
- 238000000151 deposition Methods 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 238000005470 impregnation Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001764 infiltration Methods 0.000 claims description 2
- 230000008595 infiltration Effects 0.000 claims description 2
- 239000002082 metal nanoparticle Substances 0.000 claims description 2
- -1 WHERE Substances 0.000 claims 3
- 230000007935 neutral effect Effects 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000011224 oxide ceramic Substances 0.000 claims 1
- 229910052574 oxide ceramic Inorganic materials 0.000 claims 1
- 230000000737 periodic effect Effects 0.000 claims 1
- 230000001603 reducing effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 15
- 239000000126 substance Substances 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 abstract 1
- 239000012467 final product Substances 0.000 abstract 1
- 239000010936 titanium Substances 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000007832 Na2SO4 Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004110 electrostatic spray deposition (ESD) technique Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000367 silver sulfate Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BRPI0806015 BRPI0806015A2 (pt) | 2008-12-29 | 2008-12-29 | processo de preparação de filmes finos ou ultra-finos e nanocompósitos de nanopartìculas de óxidos metálicos e/ou metais impregnados e/ou depositados em substratos vìtreos, poliméricos, madeiras, metais e outros |
| PCT/BR2009/000419 WO2010075615A1 (fr) | 2008-12-29 | 2009-12-23 | Procédé de préparation de films minces ou ultra-minces et nanocomposites de nanoparticules d'oxydes métalliques et/ou de métaux imprégnés dans des substrats de verre, de polymère, de bois ou de métal et/ou déposés sur ceux-ci |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BRPI0806015 BRPI0806015A2 (pt) | 2008-12-29 | 2008-12-29 | processo de preparação de filmes finos ou ultra-finos e nanocompósitos de nanopartìculas de óxidos metálicos e/ou metais impregnados e/ou depositados em substratos vìtreos, poliméricos, madeiras, metais e outros |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0806015A2 true BRPI0806015A2 (pt) | 2010-09-14 |
Family
ID=42309733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0806015 BRPI0806015A2 (pt) | 2008-12-29 | 2008-12-29 | processo de preparação de filmes finos ou ultra-finos e nanocompósitos de nanopartìculas de óxidos metálicos e/ou metais impregnados e/ou depositados em substratos vìtreos, poliméricos, madeiras, metais e outros |
Country Status (2)
| Country | Link |
|---|---|
| BR (1) | BRPI0806015A2 (fr) |
| WO (1) | WO2010075615A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019529711A (ja) * | 2016-09-20 | 2019-10-17 | エージェンシー フォー サイエンス, テクノロジー アンド リサーチ | 抗菌的適用のための、酸化還元活性のある金属/金属酸化物複合物 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5399388A (en) * | 1994-02-28 | 1995-03-21 | The United States Of America As Represented By The Secretary Of The Navy | Method of forming thin films on substrates at low temperatures |
| US6573531B1 (en) * | 1999-09-03 | 2003-06-03 | The Trustees Of Columbia University In The City Of New York | Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures |
| DE10312658A1 (de) * | 2003-03-21 | 2004-09-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Beschichtung flexibler Substrate mit Aluminium |
| ES2285605T3 (es) * | 2005-06-11 | 2007-11-16 | Tutech Innovation Gmbh | Procedimiento para la microencapsulacion de sustancias organicas en forma de particula mediante rociado de un gas soporte hipercritico inerte junto con material de recubrimiento para las sustancias organicas en un lecho fluidizado de alta presion en un autoclave. |
| US8628714B2 (en) * | 2006-09-29 | 2014-01-14 | Massachusetts Institute Of Technology | System and method for providing the capability of peeling thin polymer films from a substrate |
-
2008
- 2008-12-29 BR BRPI0806015 patent/BRPI0806015A2/pt not_active Application Discontinuation
-
2009
- 2009-12-23 WO PCT/BR2009/000419 patent/WO2010075615A1/fr not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010075615A1 (fr) | 2010-07-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B03A | Publication of an application: publication of a patent application or of a certificate of addition of invention | ||
| B06F | Objections, documents and/or translations needed after an examination request according art. 34 industrial property law | ||
| B06I | Technical and formal requirements: publication cancelled | ||
| B07A | Technical examination (opinion): publication of technical examination (opinion) | ||
| B09B | Decision: refusal | ||
| B09B | Decision: refusal |
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