BRPI0820322A2 - Melhoradores de resiliência para compostos de resina epóxi - Google Patents

Melhoradores de resiliência para compostos de resina epóxi

Info

Publication number
BRPI0820322A2
BRPI0820322A2 BRPI0820322-9A BRPI0820322A BRPI0820322A2 BR PI0820322 A2 BRPI0820322 A2 BR PI0820322A2 BR PI0820322 A BRPI0820322 A BR PI0820322A BR PI0820322 A2 BRPI0820322 A2 BR PI0820322A2
Authority
BR
Brazil
Prior art keywords
enhancers
resilience
epoxy resin
resin compounds
compounds
Prior art date
Application number
BRPI0820322-9A
Other languages
English (en)
Inventor
Karsten Frick
JüRGEN FINTER
Ulrich Gerber
Yves Meier
Jeannette Clifford
Original Assignee
Sika Technology Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sika Technology Ag filed Critical Sika Technology Ag
Publication of BRPI0820322A2 publication Critical patent/BRPI0820322A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253—Rubbers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0820322-9A 2007-11-21 2008-11-21 Melhoradores de resiliência para compostos de resina epóxi BRPI0820322A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07121178A EP2062928A1 (de) 2007-11-21 2007-11-21 Schlagzähigkeitsverbesserer für Epoxidharzzusammensetzungen
PCT/EP2008/065949 WO2009065914A1 (de) 2007-11-21 2008-11-21 Schlagzähigkeitsverbesserer für epoxidharzzusammensetzungen

Publications (1)

Publication Number Publication Date
BRPI0820322A2 true BRPI0820322A2 (pt) 2015-05-26

Family

ID=39226653

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0820322-9A BRPI0820322A2 (pt) 2007-11-21 2008-11-21 Melhoradores de resiliência para compostos de resina epóxi

Country Status (7)

Country Link
US (1) US9796809B2 (pt)
EP (2) EP2062928A1 (pt)
JP (2) JP6143408B2 (pt)
CN (1) CN101868489B (pt)
BR (1) BRPI0820322A2 (pt)
ES (1) ES2588021T3 (pt)
WO (1) WO2009065914A1 (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2365046A1 (de) * 2010-03-02 2011-09-14 Sika Technology AG Schlagzäher bei Raumtemperatur härtender zwei-komponentiger Strukturklebstoff
US20140150970A1 (en) 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US20120128499A1 (en) 2010-11-19 2012-05-24 Desai Umesh C Structural adhesive compositions
WO2013086348A2 (en) * 2011-12-08 2013-06-13 Zephyros, Inc. Adhesive material
CN105102537A (zh) * 2013-05-10 2015-11-25 蓝立方知识产权有限责任公司 环氧树脂组合物
KR20150051106A (ko) * 2013-10-30 2015-05-11 아크조노벨코팅스인터내셔널비.브이. 분말 코팅 조성물
EP2883781A1 (en) 2013-12-13 2015-06-17 Sika Technology AG Lightweight baffle or reinforcement element and method for producing such a lightweight baffle or reinforcement element
EP3009461A1 (de) 2014-10-13 2016-04-20 Sika Technology AG Polyester-Präpolymere als Schlagzähigkeitsverbesserer in Epoxyformulierungen
EP3170877B1 (en) 2015-11-19 2020-11-18 3M Innovative Properties Company Structural adhesive with improved failure mode
TWI572631B (zh) * 2015-11-25 2017-03-01 財團法人工業技術研究院 共聚物與環氧樹脂複合物
WO2018234475A1 (de) * 2017-06-22 2018-12-27 Sika Technology Ag Verstärkungselement, system eines verstärkten strukturelementes und verfahren zur verstärkung eines strukturelementes
EP3743457A1 (en) 2018-01-25 2020-12-02 Sika Technology Ag Shape memory material with improved mechanical properties
US10822517B2 (en) 2018-11-28 2020-11-03 Industrial Technology Research Institute Resin composition and cured resin composition
EP3770227A1 (en) 2019-07-23 2021-01-27 Sika Technology Ag Shape memory material and use thereof for bonding of substrates
WO2023247584A1 (en) 2022-06-24 2023-12-28 Zephyros, Inc. Thermal runaway fumes management
EP4406995A1 (en) 2023-01-24 2024-07-31 Sika Technology AG One-component expandable thermosetting epoxy composition with reduced voc emission
EP4617297A1 (en) 2024-03-11 2025-09-17 Sika Technology AG One-component expandable thermosetting epoxy composition with consistent expansion properties after humidity storage
EP4707132A1 (en) 2024-09-09 2026-03-11 Sika Technology AG Thermaly conductive carrier for baffle or reinforcement element
WO2026082875A1 (en) 2024-10-16 2026-04-23 Sika Technology Ag Specific polymeric material for a baffle and/or reinforcer element

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59196376A (ja) * 1983-04-22 1984-11-07 Yokohama Rubber Co Ltd:The 構造用接着剤
US4740539A (en) * 1986-04-21 1988-04-26 Ashland Oil, Inc. Flexible two-component epoxy structural adhesives
US4707518A (en) * 1986-10-16 1987-11-17 Shah Dilipkumar N Rubber-modified epoxy adhesives
US4751129A (en) * 1987-08-10 1988-06-14 Century Adhesives Inc. One-part hot-sprayable epoxy resin systems and methods
DE3864484D1 (de) 1987-08-26 1991-10-02 Ciba Geigy Ag Modifizierte epoxidharze.
US5278257A (en) * 1987-08-26 1994-01-11 Ciba-Geigy Corporation Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin
JPS6466282A (en) 1987-09-08 1989-03-13 Shinko Chem Adhesive composition for bonding electronic part
ES2068911T3 (es) * 1988-07-28 1995-05-01 Ciba Geigy Ag Combinaciones de flexibilizadores para resinas epoxi.
EP0381625B1 (de) * 1989-02-02 1996-07-31 Ciba-Geigy Ag Zähe Epoxidharze
JPH02222444A (ja) 1989-02-23 1990-09-05 Yokohama Rubber Co Ltd:The エポキシ樹脂組成物
US5140068A (en) * 1990-04-27 1992-08-18 The B. F. Goodrich Company Epoxy resin systems modified with low viscosity statistical monofunctional reactive polymers
JP3906547B2 (ja) * 1998-02-13 2007-04-18 松下電工株式会社 銅張り積層板、多層積層板
DE19845607A1 (de) * 1998-10-06 2000-04-20 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
US20040181013A1 (en) * 1998-10-06 2004-09-16 Henkel Teroson Gmbh Impact resistant epoxide resin compositions
US6486256B1 (en) * 1998-10-13 2002-11-26 3M Innovative Properties Company Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
DE19858921A1 (de) * 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
FR2809741B1 (fr) * 2000-05-31 2002-08-16 Atofina Materiaux thermodurs a tenue au choc amelioree
JP4357717B2 (ja) 2000-08-10 2009-11-04 三井化学株式会社 接着性樹脂組成物
JP2003128873A (ja) 2001-10-22 2003-05-08 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いた接着シート
CN101050344A (zh) * 2007-04-30 2007-10-10 湖南神力实业有限公司 一种纳米交联橡胶微粉改性环氧胶粘剂及制备方法

Also Published As

Publication number Publication date
WO2009065914A1 (de) 2009-05-28
CN101868489B (zh) 2013-06-19
JP2014177645A (ja) 2014-09-25
CN101868489A (zh) 2010-10-20
EP2062928A1 (de) 2009-05-27
EP2220140A1 (de) 2010-08-25
US20100280167A1 (en) 2010-11-04
JP6143408B2 (ja) 2017-06-07
ES2588021T3 (es) 2016-10-28
US9796809B2 (en) 2017-10-24
JP2011504198A (ja) 2011-02-03
EP2220140B1 (de) 2016-07-06

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Legal Events

Date Code Title Description
B08F Application fees: dismissal - article 86 of industrial property law
B08K Lapse as no evidence of payment of the annual fee has been furnished to inpi (acc. art. 87)