BRPI0907497A2 - Banho baseado em pirofosfatos para revestimento de camadas de ligas de estanho - Google Patents
Banho baseado em pirofosfatos para revestimento de camadas de ligas de estanhoInfo
- Publication number
- BRPI0907497A2 BRPI0907497A2 BRPI0907497-0A BRPI0907497A BRPI0907497A2 BR PI0907497 A2 BRPI0907497 A2 BR PI0907497A2 BR PI0907497 A BRPI0907497 A BR PI0907497A BR PI0907497 A2 BRPI0907497 A2 BR PI0907497A2
- Authority
- BR
- Brazil
- Prior art keywords
- tin alloy
- coating
- alloy layers
- based bath
- pyrophosphate based
- Prior art date
Links
- 229910001128 Sn alloy Inorganic materials 0.000 title abstract 3
- 238000000576 coating method Methods 0.000 title abstract 3
- 239000011248 coating agent Substances 0.000 title abstract 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 title 1
- 235000011180 diphosphates Nutrition 0.000 title 1
- 239000003792 electrolyte Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 229910001432 tin ion Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Physical Vapour Deposition (AREA)
- Coating With Molten Metal (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08003786A EP2103717B1 (de) | 2008-02-29 | 2008-02-29 | Pyrophosphat-basiertes Bad zur Abscheidung von Zinn-Legierungsschichten |
| PCT/EP2009/000802 WO2009109271A2 (en) | 2008-02-29 | 2009-02-05 | Pyrophosphate-based bath for plating on tin alloy layers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0907497A2 true BRPI0907497A2 (pt) | 2015-07-14 |
Family
ID=39521873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0907497-0A BRPI0907497A2 (pt) | 2008-02-29 | 2009-02-05 | Banho baseado em pirofosfatos para revestimento de camadas de ligas de estanho |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US8647491B2 (pt) |
| EP (1) | EP2103717B1 (pt) |
| JP (1) | JP5688841B2 (pt) |
| KR (1) | KR101540615B1 (pt) |
| CN (1) | CN101918618B (pt) |
| AT (1) | ATE465283T1 (pt) |
| BR (1) | BRPI0907497A2 (pt) |
| CA (1) | CA2716115A1 (pt) |
| DE (1) | DE502008000573D1 (pt) |
| ES (1) | ES2340973T3 (pt) |
| PL (1) | PL2103717T3 (pt) |
| PT (1) | PT2103717E (pt) |
| TW (1) | TWI439580B (pt) |
| WO (1) | WO2009109271A2 (pt) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011121799B4 (de) | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle |
| DE102011121798B4 (de) | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle |
| CN103849912A (zh) * | 2012-11-29 | 2014-06-11 | 沈阳工业大学 | 一种电镀光亮锡锌镍合金工艺 |
| CN103132113B (zh) * | 2013-03-08 | 2015-08-12 | 大连理工大学 | 一种弱碱性锡基无铅钎料复合镀液及其应用 |
| EP2801640A1 (en) * | 2013-05-08 | 2014-11-12 | ATOTECH Deutschland GmbH | Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy |
| CN103668402B (zh) * | 2013-10-08 | 2016-06-08 | 常州大学 | 一种纳米复合高锡铜合金电镀材料的制备方法 |
| AR100422A1 (es) * | 2014-05-15 | 2016-10-05 | Nippon Steel & Sumitomo Metal Corp | Solución para deposición para conexión roscada para un caño o tubo y método de producción de la conexión roscada para un caño o tubo |
| CN104152955A (zh) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | 碱性溶液电镀光亮白铜锡电镀液及工艺 |
| JP6621169B2 (ja) * | 2015-04-28 | 2019-12-18 | オーエム産業株式会社 | めっき品の製造方法 |
| WO2017199835A1 (ja) * | 2016-05-18 | 2017-11-23 | 日本高純度化学株式会社 | 電解ニッケル（合金）めっき液 |
| CN114351232A (zh) * | 2022-01-14 | 2022-04-15 | 张家港扬子江冷轧板有限公司 | 一种电镀锡预电镀漂洗水循环系统及循环方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3294578A (en) * | 1963-10-22 | 1966-12-27 | Gen Aniline & Film Corp | Deposition of a metallic coat on metal surfaces |
| JPS5344406B2 (pt) * | 1973-03-23 | 1978-11-29 | ||
| SU876797A1 (ru) * | 1980-02-27 | 1981-10-30 | Ростовский-на-Дону научно-исследовательский институт технологии машиностроения | Электролит хромировани |
| DE3320563A1 (de) * | 1982-09-29 | 1984-12-20 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen | Elektrolyte fuer die galvanische und reduktive abscheidung von metallen und metallegierungen |
| JPS61253384A (ja) * | 1985-01-07 | 1986-11-11 | Masami Kobayashi | アモルフアス合金のメツキ方法 |
| SU1432093A1 (ru) * | 1987-03-24 | 1988-10-23 | Ростовский государственный университет им.М.А.Суслова | Электролит дл получени покрытий на основе никел |
| DE3809672A1 (de) * | 1988-03-18 | 1989-09-28 | Schering Ag | Verfahren zur herstellung von hochtemperaturbestaendigen metallschichten auf keramikoberflaechen |
| JPH05163599A (ja) * | 1991-12-12 | 1993-06-29 | Hitachi Chem Co Ltd | 電気めっき用治具 |
| KR100268967B1 (ko) * | 1996-01-30 | 2000-10-16 | 모기 준이치 | 금속 착물 형성용 수용액, 주석-은 합금도금욕 및 당해도금욕을 사용하는 도금물의 제조방법 |
| JP3674887B2 (ja) | 1996-09-30 | 2005-07-27 | 日本ニュークローム株式会社 | 銅−スズ合金メッキ用ピロリン酸浴 |
| US6210556B1 (en) * | 1998-02-12 | 2001-04-03 | Learonal, Inc. | Electrolyte and tin-silver electroplating process |
| US6383352B1 (en) * | 1998-11-13 | 2002-05-07 | Mykrolis Corporation | Spiral anode for metal plating baths |
| JP3433291B2 (ja) * | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品 |
| US20040045832A1 (en) * | 1999-10-14 | 2004-03-11 | Nicholas Martyak | Electrolytic copper plating solutions |
| JP3455712B2 (ja) | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | 銅−スズ合金めっき用ピロリン酸浴 |
| US6706418B2 (en) * | 2000-07-01 | 2004-03-16 | Shipley Company L.L.C. | Metal alloy compositions and plating methods related thereto |
| US6875253B2 (en) * | 2001-02-08 | 2005-04-05 | Hitachi Maxell, Ltd. | Metal alloy fine particles and method for producing thereof |
| JP4249438B2 (ja) * | 2002-07-05 | 2009-04-02 | 日本ニュークローム株式会社 | 銅―錫合金めっき用ピロリン酸浴 |
| DE10313517B4 (de) * | 2003-03-25 | 2006-03-30 | Atotech Deutschland Gmbh | Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens |
| JP2005060822A (ja) * | 2003-08-08 | 2005-03-10 | Rohm & Haas Electronic Materials Llc | 複合基体の電気メッキ |
| AU2005280639A1 (en) * | 2004-02-17 | 2006-03-09 | Billy T. Fowler | Methods, compositions, and apparatuses for forming macrocyclic compounds |
| CN1657655A (zh) * | 2004-02-18 | 2005-08-24 | 中国科学院金属研究所 | 一种纳米金属管的制备方法 |
-
2008
- 2008-02-29 AT AT08003786T patent/ATE465283T1/de active
- 2008-02-29 EP EP08003786A patent/EP2103717B1/de not_active Not-in-force
- 2008-02-29 PT PT08003786T patent/PT2103717E/pt unknown
- 2008-02-29 DE DE502008000573T patent/DE502008000573D1/de active Active
- 2008-02-29 PL PL08003786T patent/PL2103717T3/pl unknown
- 2008-02-29 ES ES08003786T patent/ES2340973T3/es active Active
-
2009
- 2009-02-05 CA CA2716115A patent/CA2716115A1/en not_active Abandoned
- 2009-02-05 KR KR1020107018440A patent/KR101540615B1/ko not_active Expired - Fee Related
- 2009-02-05 BR BRPI0907497-0A patent/BRPI0907497A2/pt not_active IP Right Cessation
- 2009-02-05 US US12/864,180 patent/US8647491B2/en not_active Expired - Fee Related
- 2009-02-05 WO PCT/EP2009/000802 patent/WO2009109271A2/en not_active Ceased
- 2009-02-05 CN CN2009801015016A patent/CN101918618B/zh not_active Expired - Fee Related
- 2009-02-05 JP JP2010547984A patent/JP5688841B2/ja not_active Expired - Fee Related
- 2009-02-10 TW TW098104123A patent/TWI439580B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| ATE465283T1 (de) | 2010-05-15 |
| DE502008000573D1 (de) | 2010-06-02 |
| CA2716115A1 (en) | 2009-09-11 |
| WO2009109271A2 (en) | 2009-09-11 |
| CN101918618A (zh) | 2010-12-15 |
| TWI439580B (zh) | 2014-06-01 |
| EP2103717B1 (de) | 2010-04-21 |
| KR20100120160A (ko) | 2010-11-12 |
| KR101540615B1 (ko) | 2015-07-30 |
| US8647491B2 (en) | 2014-02-11 |
| JP5688841B2 (ja) | 2015-03-25 |
| US20100300890A1 (en) | 2010-12-02 |
| TW200949021A (en) | 2009-12-01 |
| EP2103717A1 (de) | 2009-09-23 |
| CN101918618B (zh) | 2012-02-22 |
| JP2011513585A (ja) | 2011-04-28 |
| PL2103717T3 (pl) | 2010-07-30 |
| ES2340973T3 (es) | 2010-06-11 |
| PT2103717E (pt) | 2010-06-14 |
| WO2009109271A3 (en) | 2010-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BRPI0907497A2 (pt) | Banho baseado em pirofosfatos para revestimento de camadas de ligas de estanho | |
| WO2007147603A3 (de) | Wässriges alkalisches, cyanidfreies bad zur galvanischen abscheidung von zink- und zinklegierungsüberzügen | |
| EP2025778A3 (en) | A Copper Plating Process | |
| PL2116634T3 (pl) | Zmodyfikowany elektrolit miedziowo-cynowy i sposób osadzania warstw brązu | |
| ATE555235T1 (de) | Pd- und pd-ni-elektrolytbäder | |
| TW200702498A (en) | Method for electrodeposition of bronzes | |
| EP2366686A3 (en) | Copper electroplating bath and method | |
| WO2011148242A3 (en) | Method of plating stainless steel and plated material | |
| BRPI0912309A2 (pt) | banho contendo pirofosfato para deposição livre de cianida de ligas de cobre-estanho. | |
| ZA200906528B (en) | Method for coating metal surfaces using an aqueous compound having polymers,the aqueous compound,and use of the coated substrates | |
| IN2014DN09953A (pt) | ||
| EP2586893A3 (en) | Copper plating bath and method | |
| EP2366692A3 (en) | Copper electropating bath and method | |
| MY162585A (en) | Steel sheet for containers and manufacturing method for same | |
| WO2007034117A3 (fr) | Procede d'electrodeposition destine au revetement d'une surface d'un substrat par un metal | |
| BRPI0921282A2 (pt) | processo de inspeção de um revestimento metálico, e método para controle analítico de um eletrólito de deposição servindo para depositar o dito reveastimento metálico. | |
| MX2016001230A (es) | Metodo para formar una pelicula de recubrimiento de capas multiples. | |
| EP2017373A3 (en) | High speed method for plating palladium and palladium alloys | |
| MY162540A (en) | Steel sheet for containers and manufacturing method for same | |
| WO2014124773A3 (en) | Method for depositing a first metallic layer onto non-conductive polymers | |
| WO2007021327A3 (en) | Pretreatment of magnesium substrates for electroplating | |
| WO2015001366A3 (en) | Method to produce a metal implant with the properties of antimicrobiality and biocompatibility and such a metal implant | |
| MX2016001847A (es) | Metodo de formacion de pelicula de recubrimiento de capas multiples. | |
| EP2108716A3 (en) | Method for Electroplating a plastic substrate | |
| GB2500811A (en) | Electrolytic gold or gold palladium surface finish application in coreless substrate processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 8A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |