BRPI0912309A2 - banho contendo pirofosfato para deposição livre de cianida de ligas de cobre-estanho. - Google Patents

banho contendo pirofosfato para deposição livre de cianida de ligas de cobre-estanho.

Info

Publication number: BRPI0912309A2
Authority: BR; Brazil
Prior art keywords: copper; pyrophosphate; cyanide; containing bath; tin alloys
Prior art date: 2008-06-02

Application number

BRPI0912309A

Other languages

English (en)

Inventor

Heiko Brunner

Klaus-Dieter Schulz

Lars Kohlmann

Philip Hartmann

Original Assignee

Atotech Deutschland Gmbh

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-06-02

Filing date

2009-05-29

Publication date

2015-10-13

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39831596&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BRPI0912309(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

2009-05-29 Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh

2015-10-13 Publication of BRPI0912309A2 publication Critical patent/BRPI0912309A2/pt

2019-12-10 Publication of BRPI0912309B1 publication Critical patent/BRPI0912309B1/pt

Links

KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical group [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title abstract 3
XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 title abstract 2
235000011180 diphosphates Nutrition 0.000 title abstract 2
229910001128 Sn alloy Inorganic materials 0.000 title 1
230000008021 deposition Effects 0.000 title 1
GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract 4
-1 poly(propyleneglycol) Polymers 0.000 abstract 4
YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical group C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 abstract 2
239000007795 chemical reaction product Substances 0.000 abstract 2
238000000576 coating method Methods 0.000 abstract 2
239000000758 substrate Substances 0.000 abstract 2
IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical group C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 abstract 1
XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 1
239000011248 coating agent Substances 0.000 abstract 1
229920001223 polyethylene glycol Polymers 0.000 abstract 1
229920001451 polypropylene glycol Polymers 0.000 abstract 1
238000000926 separation method Methods 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)

BRPI0912309 2008-06-02 2009-05-29 método para a deposição galvânica de revestimentos de liga de cobre-estanho brilhantes e uniformes BRPI0912309B1 (pt)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
EP08010058A EP2130948B1 (de)	2008-06-02	2008-06-02	Pyrophosphathaltiges Bad zur cyanidfreien Abscheidung von Kupfer-Zinn-Legierungen
PCT/EP2009/003886 WO2009146865A1 (en)	2008-06-02	2009-05-29	Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys

Publications (2)

Publication Number	Publication Date
BRPI0912309A2 true BRPI0912309A2 (pt)	2015-10-13
BRPI0912309B1 BRPI0912309B1 (pt)	2019-12-10

Family

ID=39831596

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BRPI0912309 BRPI0912309B1 (pt)	2008-06-02	2009-05-29	método para a deposição galvânica de revestimentos de liga de cobre-estanho brilhantes e uniformes

Country Status (14)

Country	Link
US (2)	US20100326838A1 (pt)
EP (1)	EP2130948B1 (pt)
JP (1)	JP5735415B2 (pt)
KR (1)	KR101609171B1 (pt)
CN (1)	CN102046852B (pt)
AT (1)	ATE492665T1 (pt)
BR (1)	BRPI0912309B1 (pt)
CA (1)	CA2724211C (pt)
DE (1)	DE502008002080D1 (pt)
ES (1)	ES2354395T3 (pt)
PL (1)	PL2130948T3 (pt)
SI (1)	SI2130948T1 (pt)
TW (1)	TWI441958B (pt)
WO (1)	WO2009146865A1 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5569718B2 (ja) *	2009-08-21	2014-08-13	キザイ株式会社	シアンフリー光沢銅−スズ合金めっき浴
US8262895B2 (en) *	2010-03-15	2012-09-11	Rohm And Haas Electronic Materials Llc	Plating bath and method
US8268157B2 (en) *	2010-03-15	2012-09-18	Rohm And Haas Electronic Materials Llc	Plating bath and method
CN102242381A (zh) *	2011-06-29	2011-11-16	杭州阿玛尔科技有限公司	以亚甲基二膦酸为主配位剂的碱性无氰镀铜电镀液
CN102220610B (zh) *	2011-07-29	2012-12-05	福州大学	一种无氰型铜锡合金电镀液
JP5505392B2 (ja)	2011-10-04	2014-05-28	株式会社デンソー	複合材料、及びこれを用いた電気接点電極、電気接点皮膜、導電性フィラー、電気接点構造、並びに複合材料の製造方法
CN104152955A (zh) *	2014-07-17	2014-11-19	广东致卓精密金属科技有限公司	碱性溶液电镀光亮白铜锡电镀液及工艺
JP6491989B2 (ja) *	2014-10-10	2019-03-27	日本ニュークローム株式会社	表面の虹色着色処理方法
JP6621169B2 (ja) *	2015-04-28	2019-12-18	オーエム産業株式会社	めっき品の製造方法
CN105200469A (zh) *	2015-10-30	2015-12-30	无锡市嘉邦电力管道厂	一种锡-铜合金电镀液及其电镀方法
CN106350838A (zh) *	2016-09-29	2017-01-25	广州市汇吉科技企业孵化器有限公司	一种长寿命光亮剂及其制备方法
CN108642533B (zh) *	2018-05-15	2020-03-27	河南电池研究院有限公司	一种Sn-Cu电镀液、锂离子电池用锡基合金电极及其制备方法和锂离子电池

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2493092A (en) *	1946-01-11	1950-01-03	United Chromium Inc	Method of electrodepositing copper and baths therefor
US4469564A (en) *	1982-08-11	1984-09-04	At&T Bell Laboratories	Copper electroplating process
US4842756A (en) *	1987-03-23	1989-06-27	Texaco Inc.	Multifunctional viscosity index improver
JP3674887B2 (ja)	1996-09-30	2005-07-27	日本ニュークローム株式会社	銅−スズ合金メッキ用ピロリン酸浴
US6210556B1 (en) *	1998-02-12	2001-04-03	Learonal, Inc.	Electrolyte and tin-silver electroplating process
JP3455712B2 (ja)	2000-04-14	2003-10-14	日本ニュークローム株式会社	銅−スズ合金めっき用ピロリン酸浴
TWI228156B (en) *	2001-05-09	2005-02-21	Ebara Udylite Kk	Copper-plating bath, method for electroplating substrate by using the same, and additives for the bath
JP4249438B2 (ja) *	2002-07-05	2009-04-02	日本ニュークローム株式会社	銅―錫合金めっき用ピロリン酸浴
US7147767B2 (en) *	2002-12-16	2006-12-12	3M Innovative Properties Company	Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
TW200613586A (en) *	2004-07-22	2006-05-01	Rohm & Haas Elect Mat	Leveler compounds
JP2006156068A (ja)	2004-11-29	2006-06-15	Sanyo Chem Ind Ltd	導電性微粒子
EP1741804B1 (en) *	2005-07-08	2016-04-27	Rohm and Haas Electronic Materials, L.L.C.	Electrolytic copper plating method
TWI328622B (en) *	2005-09-30	2010-08-11	Rohm & Haas Elect Mat	Leveler compounds

2008
- 2008-06-02 DE DE502008002080T patent/DE502008002080D1/de active Active
- 2008-06-02 ES ES08010058T patent/ES2354395T3/es active Active
- 2008-06-02 PL PL08010058T patent/PL2130948T3/pl unknown
- 2008-06-02 EP EP08010058A patent/EP2130948B1/de not_active Not-in-force
- 2008-06-02 SI SI200830180T patent/SI2130948T1/sl unknown
- 2008-06-02 AT AT08010058T patent/ATE492665T1/de active
2009
- 2009-05-29 CN CN2009801204709A patent/CN102046852B/zh not_active Expired - Fee Related
- 2009-05-29 WO PCT/EP2009/003886 patent/WO2009146865A1/en not_active Ceased
- 2009-05-29 CA CA2724211A patent/CA2724211C/en not_active Expired - Fee Related
- 2009-05-29 BR BRPI0912309 patent/BRPI0912309B1/pt not_active IP Right Cessation
- 2009-05-29 US US12/866,996 patent/US20100326838A1/en not_active Abandoned
- 2009-05-29 JP JP2011510900A patent/JP5735415B2/ja not_active Expired - Fee Related
- 2009-05-29 KR KR1020107019214A patent/KR101609171B1/ko not_active Expired - Fee Related
- 2009-06-01 TW TW098117986A patent/TWI441958B/zh not_active IP Right Cessation
2013
- 2013-12-09 US US14/100,633 patent/US9399824B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
WO2009146865A1 (en)	2009-12-10
KR20110022558A (ko)	2011-03-07
JP2011522116A (ja)	2011-07-28
PL2130948T3 (pl)	2011-05-31
CN102046852B (zh)	2013-06-12
DE502008002080D1 (de)	2011-02-03
CN102046852A (zh)	2011-05-04
ES2354395T3 (es)	2011-03-14
EP2130948B1 (de)	2010-12-22
EP2130948A1 (de)	2009-12-09
US20140124376A1 (en)	2014-05-08
CA2724211A1 (en)	2009-12-10
SI2130948T1 (sl)	2011-04-29
US9399824B2 (en)	2016-07-26
US20100326838A1 (en)	2010-12-30
ATE492665T1 (de)	2011-01-15
KR101609171B1 (ko)	2016-04-05
TW201011130A (en)	2010-03-16
TWI441958B (zh)	2014-06-21
JP5735415B2 (ja)	2015-06-17
CA2724211C (en)	2016-10-25
BRPI0912309B1 (pt)	2019-12-10

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Legal Events

Date	Code	Title	Description
2018-04-17	B06F	Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
2018-09-11	B06T	Formal requirements before examination [chapter 6.20 patent gazette]	Free format text: O DEPOSITANTE DEVE RESPONDER A EXIGENCIA FORMULADA NESTE PARECER EM ATE 60 (SESSENTA) DIAS, A PARTIR DA DATA DE PUBLICACAO NA RPI, SOB PENA DO ARQUIVAMENTO DO PEDIDO, DE ACORDO COM O ARTIGO 34, INCISO II, DA LPI, POR MEIO DO SERVICO DE CODIGO 206.PUBLIQUE-SE A EXIGENCIA (6.20).
2019-04-09	B07A	Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
2019-10-22	B09A	Decision: intention to grant [chapter 9.1 patent gazette]
2019-12-10	B16A	Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]	Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 10/12/2019, OBSERVADAS AS CONDICOES LEGAIS. (CO) 10 (DEZ) ANOS CONTADOS A PARTIR DE 10/12/2019, OBSERVADAS AS CONDICOES LEGAIS
2021-04-06	B21F	Lapse acc. art. 78, item iv - on non-payment of the annual fees in time	Free format text: REFERENTE A 12A ANUIDADE.
2021-08-10	B24J	Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)	Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2622 DE 06-04-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.