BRPI0910587A2 - método e aparelho para eletrogalvanização - Google Patents
método e aparelho para eletrogalvanizaçãoInfo
- Publication number
- BRPI0910587A2 BRPI0910587A2 BRPI0910587A BRPI0910587A BRPI0910587A2 BR PI0910587 A2 BRPI0910587 A2 BR PI0910587A2 BR PI0910587 A BRPI0910587 A BR PI0910587A BR PI0910587 A BRPI0910587 A BR PI0910587A BR PI0910587 A2 BRPI0910587 A2 BR PI0910587A2
- Authority
- BR
- Brazil
- Prior art keywords
- electroplating
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/003—Electroplating using gases, e.g. pressure influence
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/619—Amorphous layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/081,623 US8062496B2 (en) | 2008-04-18 | 2008-04-18 | Electroplating method and apparatus |
| PCT/CA2009/000264 WO2009127037A1 (en) | 2008-04-18 | 2009-03-04 | Electroplating method and apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0910587A2 true BRPI0910587A2 (pt) | 2015-09-22 |
Family
ID=41198720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0910587A BRPI0910587A2 (pt) | 2008-04-18 | 2009-03-04 | método e aparelho para eletrogalvanização |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8062496B2 (pt) |
| EP (1) | EP2262928A1 (pt) |
| KR (1) | KR20110008043A (pt) |
| CN (1) | CN102007232B (pt) |
| BR (1) | BRPI0910587A2 (pt) |
| CA (1) | CA2716394A1 (pt) |
| MX (1) | MX2010010658A (pt) |
| WO (1) | WO2009127037A1 (pt) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2958300B1 (fr) * | 2010-03-31 | 2012-05-04 | Snecma | Dispositif pour controler des caracteristiques physiques d'un bain d'electrodeposition metallique. |
| CN103108997B (zh) * | 2010-08-11 | 2017-05-17 | 奥图泰有限公司 | 用于在电精炼和电解冶金中使用的装置 |
| JP5469038B2 (ja) | 2010-11-12 | 2014-04-09 | 株式会社オティックス | 燃料系部品の製造方法および燃料系部品 |
| US8512541B2 (en) * | 2010-11-16 | 2013-08-20 | Trevor Pearson | Electrolytic dissolution of chromium from chromium electrodes |
| CA2853670C (en) | 2011-10-27 | 2017-06-13 | Garmor, Inc. | Composite graphene structures |
| PT106470A (pt) * | 2012-07-27 | 2014-01-27 | Inst Superior Tecnico | Processo de eletrodeposição de revestimentos de níquel-cobalto com estrutura dendrítica |
| KR101506910B1 (ko) * | 2012-09-27 | 2015-03-30 | 티디케이가부시기가이샤 | 이방성 도금 방법 및 박막 코일 |
| CA2903987C (en) | 2013-03-08 | 2018-05-01 | University Of Central Florida Research Foundation, Inc. | Large scale oxidized graphene production for industrial applications |
| EP2964573A4 (en) | 2013-03-08 | 2016-11-02 | Garmor Inc | GRAPHIC ENCLOSURE IN A HOST |
| US9533897B2 (en) * | 2013-03-12 | 2017-01-03 | Radical Waters International Ltd. | Method for electro-chemical activation of water |
| US9828290B2 (en) | 2014-08-18 | 2017-11-28 | Garmor Inc. | Graphite oxide entrainment in cement and asphalt composite |
| JP6484348B2 (ja) | 2015-03-13 | 2019-03-13 | ユニバーシティ オブ セントラル フロリダ リサーチ ファウンデーション,インコーポレイテッド | ホスト中でのグラフェンナノ粒子の均一な分散 |
| WO2016154057A1 (en) | 2015-03-23 | 2016-09-29 | Garmor Inc. | Engineered composite structure using graphene oxide |
| JP6563029B2 (ja) | 2015-04-13 | 2019-08-21 | ガーマー インク.Garmor, Inc. | コンクリート又はアスファルトなどのホスト中の酸化グラファイト強化繊維 |
| US11482348B2 (en) | 2015-06-09 | 2022-10-25 | Asbury Graphite Of North Carolina, Inc. | Graphite oxide and polyacrylonitrile based composite |
| WO2017053204A1 (en) | 2015-09-21 | 2017-03-30 | Garmor Inc. | Low-cost, high-performance composite bipolar plate |
| WO2018081413A1 (en) | 2016-10-26 | 2018-05-03 | Garmor Inc. | Additive coated particles for low high performance materials |
| US10240245B2 (en) | 2017-06-28 | 2019-03-26 | Honeywell International Inc. | Systems, methods, and anodes for enhanced ionic liquid bath plating of turbomachine components and other workpieces |
| KR102045821B1 (ko) * | 2017-09-28 | 2019-11-19 | (주)포인텍 | 전기도금라인의 무선행거에 장착된 기판에 인가되는 전류의 제어방법 |
| US11058444B2 (en) | 2017-12-11 | 2021-07-13 | Covidien Lp | Electrically enhanced retrieval of material from vessel lumens |
| US12004803B2 (en) | 2021-03-15 | 2024-06-11 | Covidien Lp | Thrombectomy treatment system |
| US11974752B2 (en) | 2019-12-12 | 2024-05-07 | Covidien Lp | Electrically enhanced retrieval of material from vessel lumens |
| US12318126B2 (en) | 2021-06-25 | 2025-06-03 | Covidien Lp | Current generator for a medical treatment system |
| CN108716017B (zh) * | 2018-06-19 | 2023-07-28 | 昆山硕凯自动化科技有限公司 | 一种连续点蜡轴 |
| CN108707951B (zh) * | 2018-06-19 | 2023-08-01 | 昆山硕凯自动化科技有限公司 | 一种连续点蜡槽 |
| US20190388107A1 (en) | 2018-06-22 | 2019-12-26 | Covidien Lp | Electrically enhanced retrieval of material from vessel lumens |
| KR102012731B1 (ko) * | 2018-12-06 | 2019-08-21 | 주식회사 에이엔씨코리아 | 6 가 크롬도금액 및 이를 이용한 크랙프리 펄스 전기도금방법 |
| KR102639119B1 (ko) | 2018-12-31 | 2024-02-20 | 엘지디스플레이 주식회사 | 전기 도금 장치 및 이를 이용한 전기 도금 방법 |
| US20220127744A1 (en) * | 2019-02-01 | 2022-04-28 | Lumishield Technologies Incorporated | Methods and Compositions for Improved Adherence of Organic Coatings to Materials |
| US11612430B2 (en) | 2019-03-19 | 2023-03-28 | Covidien Lp | Electrically enhanced retrieval of material from vessel lumens |
| US11523838B2 (en) | 2019-06-12 | 2022-12-13 | Covidien Lp | Retrieval of material from corporeal lumens |
| US11791061B2 (en) | 2019-09-12 | 2023-10-17 | Asbury Graphite North Carolina, Inc. | Conductive high strength extrudable ultra high molecular weight polymer graphene oxide composite |
| US12320025B2 (en) * | 2020-09-11 | 2025-06-03 | University Of Cincinnati | Electrochemical deposition of functionalized high entropy alloys |
| US11963713B2 (en) | 2021-06-02 | 2024-04-23 | Covidien Lp | Medical treatment system |
| CN113668039A (zh) * | 2021-08-17 | 2021-11-19 | Oppo广东移动通信有限公司 | 挂具组件和设备组件 |
| US11944374B2 (en) | 2021-08-30 | 2024-04-02 | Covidien Lp | Electrical signals for retrieval of material from vessel lumens |
| CN114108048B (zh) * | 2021-11-19 | 2023-05-23 | 南京航空航天大学 | 一种提高晶圆级阵列微结构电铸厚度均匀性的方法 |
| US20230323553A1 (en) * | 2022-04-12 | 2023-10-12 | The Regents Of The University Of Colorado, A Body Corporate | Pulsed electrodeposition for reversible metal electrodeposition to control metal film morphology and optical properties |
| CN115679398B (zh) * | 2022-11-17 | 2023-06-16 | 重庆太蓝新能源有限公司 | 参比电极的电镀方法及电池 |
| CN116240611B (zh) * | 2023-02-23 | 2025-07-25 | 京东方科技集团股份有限公司 | 一种电镀板、电镀装置以及电镀方法 |
| DE102023206303A1 (de) * | 2023-07-03 | 2025-01-09 | Semsysco Gmbh | Verteilungssystem für einen elektrischen Strom für unterschiedliche elektrolytische Oberflächenbehandlungen auf mindestens zwei unterschiedlichen Substratoberflächen eines Substrats |
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| US3269932A (en) | 1961-09-01 | 1966-08-30 | Exxon Research Engineering Co | Multi-cell reactor in parallel |
| US3365382A (en) | 1964-09-09 | 1968-01-23 | Adrian T. Godschalx | Electrical distribution system for continuous plating apparatus |
| US4077864A (en) * | 1973-09-10 | 1978-03-07 | General Dynamics | Electroforming anode shields |
| US3909368A (en) * | 1974-07-12 | 1975-09-30 | Louis W Raymond | Electroplating method and apparatus |
| US4155821A (en) * | 1974-11-25 | 1979-05-22 | Falconbridge Nickel Mines Limited | Electrowinning metal from chloride solution |
| US4197169A (en) * | 1978-09-05 | 1980-04-08 | Exxon Research & Engineering Co. | Shunt current elimination and device |
| US4277317A (en) * | 1979-11-26 | 1981-07-07 | Exxon Research & Engineering Co. | Shunt current elimination and device employing tunneled protective current |
| US4377445A (en) * | 1980-11-07 | 1983-03-22 | Exxon Research And Engineering Co. | Shunt current elimination for series connected cells |
| JPS5928597A (ja) * | 1982-08-05 | 1984-02-15 | Ibiden Co Ltd | 炭素電極棒の電気メッキ方法及びそのメッキ装置 |
| US4565607A (en) | 1984-03-09 | 1986-01-21 | Energy Conversion Devices, Inc. | Method of fabricating an electroplated substrate |
| US4686014A (en) | 1984-11-23 | 1987-08-11 | Pellegrino Peter P | Turbulent cell electroplating method and apparatus |
| US4935109A (en) * | 1988-05-23 | 1990-06-19 | General Dynamics Corp., Pomona Div. | Double-cell electroplating apparatus and method |
| US5000827A (en) | 1990-01-02 | 1991-03-19 | Motorola, Inc. | Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect |
| EP0585586B1 (en) * | 1992-07-20 | 1997-01-29 | Fuji Photo Film Co., Ltd. | Method for electrolytic treatment |
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| US5352266A (en) | 1992-11-30 | 1994-10-04 | Queen'university At Kingston | Nanocrystalline metals and process of producing the same |
| US5312532A (en) * | 1993-01-15 | 1994-05-17 | International Business Machines Corporation | Multi-compartment eletroplating system |
| US5421987A (en) | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
| US5756874A (en) | 1995-10-10 | 1998-05-26 | Eosystems, Inc. | Electrochemical cell for processing organic wastes |
| US5776327A (en) | 1996-10-16 | 1998-07-07 | Mitsubishi Semiconuctor Americe, Inc. | Method and apparatus using an anode basket for electroplating a workpiece |
| DE19736351C1 (de) * | 1997-08-21 | 1998-10-01 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken |
| US6027631A (en) | 1997-11-13 | 2000-02-22 | Novellus Systems, Inc. | Electroplating system with shields for varying thickness profile of deposited layer |
| US6491806B1 (en) * | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
| US6776891B2 (en) * | 2001-05-18 | 2004-08-17 | Headway Technologies, Inc. | Method of manufacturing an ultra high saturation moment soft magnetic thin film |
| US20050205425A1 (en) * | 2002-06-25 | 2005-09-22 | Integran Technologies | Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
| DE10311575B4 (de) * | 2003-03-10 | 2007-03-22 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis |
| US6884335B2 (en) * | 2003-05-20 | 2005-04-26 | Novellus Systems, Inc. | Electroplating using DC current interruption and variable rotation rate |
| US20060042932A1 (en) * | 2004-08-25 | 2006-03-02 | Rosenzweig Mark A | Apparatus and method for electroplating a workpiece |
| US7435324B2 (en) * | 2004-09-02 | 2008-10-14 | Micron Technology, Inc. | Noncontact localized electrochemical deposition of metal thin films |
| US7354354B2 (en) | 2004-12-17 | 2008-04-08 | Integran Technologies Inc. | Article comprising a fine-grained metallic material and a polymeric material |
| US7320832B2 (en) | 2004-12-17 | 2008-01-22 | Integran Technologies Inc. | Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate |
| US7387578B2 (en) * | 2004-12-17 | 2008-06-17 | Integran Technologies Inc. | Strong, lightweight article containing a fine-grained metallic layer |
| US7425255B2 (en) * | 2005-06-07 | 2008-09-16 | Massachusetts Institute Of Technology | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition |
| DE102005032738B3 (de) * | 2005-07-08 | 2006-11-23 | Siemens Ag | Verfahren und Vorrichtung zum Bearbeiten wenigstens zweier Werkstücke mittels elektrochemischer Behandlung |
| US9005420B2 (en) * | 2007-12-20 | 2015-04-14 | Integran Technologies Inc. | Variable property electrodepositing of metallic structures |
-
2008
- 2008-04-18 US US12/081,623 patent/US8062496B2/en active Active
-
2009
- 2009-03-04 WO PCT/CA2009/000264 patent/WO2009127037A1/en not_active Ceased
- 2009-03-04 CN CN2009801136044A patent/CN102007232B/zh not_active Expired - Fee Related
- 2009-03-04 CA CA2716394A patent/CA2716394A1/en not_active Abandoned
- 2009-03-04 KR KR1020107023293A patent/KR20110008043A/ko not_active Ceased
- 2009-03-04 EP EP09733070A patent/EP2262928A1/en not_active Withdrawn
- 2009-03-04 MX MX2010010658A patent/MX2010010658A/es active IP Right Grant
- 2009-03-04 BR BRPI0910587A patent/BRPI0910587A2/pt not_active IP Right Cessation
-
2011
- 2011-10-07 US US13/268,175 patent/US20120024696A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US8062496B2 (en) | 2011-11-22 |
| MX2010010658A (es) | 2010-11-09 |
| CA2716394A1 (en) | 2009-10-22 |
| EP2262928A1 (en) | 2010-12-22 |
| US20100006445A1 (en) | 2010-01-14 |
| CN102007232A (zh) | 2011-04-06 |
| KR20110008043A (ko) | 2011-01-25 |
| CN102007232B (zh) | 2013-05-01 |
| US20120024696A1 (en) | 2012-02-02 |
| WO2009127037A1 (en) | 2009-10-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 7A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2367 DE 17-05-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |