BRPI0910587A2 - método e aparelho para eletrogalvanização - Google Patents

método e aparelho para eletrogalvanização

Info

Publication number
BRPI0910587A2
BRPI0910587A2 BRPI0910587A BRPI0910587A BRPI0910587A2 BR PI0910587 A2 BRPI0910587 A2 BR PI0910587A2 BR PI0910587 A BRPI0910587 A BR PI0910587A BR PI0910587 A BRPI0910587 A BR PI0910587A BR PI0910587 A2 BRPI0910587 A2 BR PI0910587A2
Authority
BR
Brazil
Prior art keywords
electroplating
Prior art date
Application number
BRPI0910587A
Other languages
English (en)
Inventor
Klaus Tomantschger
Original Assignee
Integran Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integran Technologies Inc filed Critical Integran Technologies Inc
Publication of BRPI0910587A2 publication Critical patent/BRPI0910587A2/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18Electroplating using modulated, pulsed or reversing current
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007Current directing devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • C25D21/14Controlled addition of electrolyte components
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003Electroplating using gases, e.g. pressure influence
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/615Microstructure of the layers, e.g. mixed structure
    • C25D5/617Crystalline layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/615Microstructure of the layers, e.g. mixed structure
    • C25D5/619Amorphous layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
BRPI0910587A 2008-04-18 2009-03-04 método e aparelho para eletrogalvanização BRPI0910587A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/081,623 US8062496B2 (en) 2008-04-18 2008-04-18 Electroplating method and apparatus
PCT/CA2009/000264 WO2009127037A1 (en) 2008-04-18 2009-03-04 Electroplating method and apparatus

Publications (1)

Publication Number Publication Date
BRPI0910587A2 true BRPI0910587A2 (pt) 2015-09-22

Family

ID=41198720

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0910587A BRPI0910587A2 (pt) 2008-04-18 2009-03-04 método e aparelho para eletrogalvanização

Country Status (8)

Country Link
US (2) US8062496B2 (pt)
EP (1) EP2262928A1 (pt)
KR (1) KR20110008043A (pt)
CN (1) CN102007232B (pt)
BR (1) BRPI0910587A2 (pt)
CA (1) CA2716394A1 (pt)
MX (1) MX2010010658A (pt)
WO (1) WO2009127037A1 (pt)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2958300B1 (fr) * 2010-03-31 2012-05-04 Snecma Dispositif pour controler des caracteristiques physiques d'un bain d'electrodeposition metallique.
CN103108997B (zh) * 2010-08-11 2017-05-17 奥图泰有限公司 用于在电精炼和电解冶金中使用的装置
JP5469038B2 (ja) 2010-11-12 2014-04-09 株式会社オティックス 燃料系部品の製造方法および燃料系部品
US8512541B2 (en) * 2010-11-16 2013-08-20 Trevor Pearson Electrolytic dissolution of chromium from chromium electrodes
CA2853670C (en) 2011-10-27 2017-06-13 Garmor, Inc. Composite graphene structures
PT106470A (pt) * 2012-07-27 2014-01-27 Inst Superior Tecnico Processo de eletrodeposição de revestimentos de níquel-cobalto com estrutura dendrítica
KR101506910B1 (ko) * 2012-09-27 2015-03-30 티디케이가부시기가이샤 이방성 도금 방법 및 박막 코일
CA2903987C (en) 2013-03-08 2018-05-01 University Of Central Florida Research Foundation, Inc. Large scale oxidized graphene production for industrial applications
EP2964573A4 (en) 2013-03-08 2016-11-02 Garmor Inc GRAPHIC ENCLOSURE IN A HOST
US9533897B2 (en) * 2013-03-12 2017-01-03 Radical Waters International Ltd. Method for electro-chemical activation of water
US9828290B2 (en) 2014-08-18 2017-11-28 Garmor Inc. Graphite oxide entrainment in cement and asphalt composite
JP6484348B2 (ja) 2015-03-13 2019-03-13 ユニバーシティ オブ セントラル フロリダ リサーチ ファウンデーション,インコーポレイテッド ホスト中でのグラフェンナノ粒子の均一な分散
WO2016154057A1 (en) 2015-03-23 2016-09-29 Garmor Inc. Engineered composite structure using graphene oxide
JP6563029B2 (ja) 2015-04-13 2019-08-21 ガーマー インク.Garmor, Inc. コンクリート又はアスファルトなどのホスト中の酸化グラファイト強化繊維
US11482348B2 (en) 2015-06-09 2022-10-25 Asbury Graphite Of North Carolina, Inc. Graphite oxide and polyacrylonitrile based composite
WO2017053204A1 (en) 2015-09-21 2017-03-30 Garmor Inc. Low-cost, high-performance composite bipolar plate
WO2018081413A1 (en) 2016-10-26 2018-05-03 Garmor Inc. Additive coated particles for low high performance materials
US10240245B2 (en) 2017-06-28 2019-03-26 Honeywell International Inc. Systems, methods, and anodes for enhanced ionic liquid bath plating of turbomachine components and other workpieces
KR102045821B1 (ko) * 2017-09-28 2019-11-19 (주)포인텍 전기도금라인의 무선행거에 장착된 기판에 인가되는 전류의 제어방법
US11058444B2 (en) 2017-12-11 2021-07-13 Covidien Lp Electrically enhanced retrieval of material from vessel lumens
US12004803B2 (en) 2021-03-15 2024-06-11 Covidien Lp Thrombectomy treatment system
US11974752B2 (en) 2019-12-12 2024-05-07 Covidien Lp Electrically enhanced retrieval of material from vessel lumens
US12318126B2 (en) 2021-06-25 2025-06-03 Covidien Lp Current generator for a medical treatment system
CN108716017B (zh) * 2018-06-19 2023-07-28 昆山硕凯自动化科技有限公司 一种连续点蜡轴
CN108707951B (zh) * 2018-06-19 2023-08-01 昆山硕凯自动化科技有限公司 一种连续点蜡槽
US20190388107A1 (en) 2018-06-22 2019-12-26 Covidien Lp Electrically enhanced retrieval of material from vessel lumens
KR102012731B1 (ko) * 2018-12-06 2019-08-21 주식회사 에이엔씨코리아 6 가 크롬도금액 및 이를 이용한 크랙프리 펄스 전기도금방법
KR102639119B1 (ko) 2018-12-31 2024-02-20 엘지디스플레이 주식회사 전기 도금 장치 및 이를 이용한 전기 도금 방법
US20220127744A1 (en) * 2019-02-01 2022-04-28 Lumishield Technologies Incorporated Methods and Compositions for Improved Adherence of Organic Coatings to Materials
US11612430B2 (en) 2019-03-19 2023-03-28 Covidien Lp Electrically enhanced retrieval of material from vessel lumens
US11523838B2 (en) 2019-06-12 2022-12-13 Covidien Lp Retrieval of material from corporeal lumens
US11791061B2 (en) 2019-09-12 2023-10-17 Asbury Graphite North Carolina, Inc. Conductive high strength extrudable ultra high molecular weight polymer graphene oxide composite
US12320025B2 (en) * 2020-09-11 2025-06-03 University Of Cincinnati Electrochemical deposition of functionalized high entropy alloys
US11963713B2 (en) 2021-06-02 2024-04-23 Covidien Lp Medical treatment system
CN113668039A (zh) * 2021-08-17 2021-11-19 Oppo广东移动通信有限公司 挂具组件和设备组件
US11944374B2 (en) 2021-08-30 2024-04-02 Covidien Lp Electrical signals for retrieval of material from vessel lumens
CN114108048B (zh) * 2021-11-19 2023-05-23 南京航空航天大学 一种提高晶圆级阵列微结构电铸厚度均匀性的方法
US20230323553A1 (en) * 2022-04-12 2023-10-12 The Regents Of The University Of Colorado, A Body Corporate Pulsed electrodeposition for reversible metal electrodeposition to control metal film morphology and optical properties
CN115679398B (zh) * 2022-11-17 2023-06-16 重庆太蓝新能源有限公司 参比电极的电镀方法及电池
CN116240611B (zh) * 2023-02-23 2025-07-25 京东方科技集团股份有限公司 一种电镀板、电镀装置以及电镀方法
DE102023206303A1 (de) * 2023-07-03 2025-01-09 Semsysco Gmbh Verteilungssystem für einen elektrischen Strom für unterschiedliche elektrolytische Oberflächenbehandlungen auf mindestens zwei unterschiedlichen Substratoberflächen eines Substrats

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3269932A (en) 1961-09-01 1966-08-30 Exxon Research Engineering Co Multi-cell reactor in parallel
US3365382A (en) 1964-09-09 1968-01-23 Adrian T. Godschalx Electrical distribution system for continuous plating apparatus
US4077864A (en) * 1973-09-10 1978-03-07 General Dynamics Electroforming anode shields
US3909368A (en) * 1974-07-12 1975-09-30 Louis W Raymond Electroplating method and apparatus
US4155821A (en) * 1974-11-25 1979-05-22 Falconbridge Nickel Mines Limited Electrowinning metal from chloride solution
US4197169A (en) * 1978-09-05 1980-04-08 Exxon Research & Engineering Co. Shunt current elimination and device
US4277317A (en) * 1979-11-26 1981-07-07 Exxon Research & Engineering Co. Shunt current elimination and device employing tunneled protective current
US4377445A (en) * 1980-11-07 1983-03-22 Exxon Research And Engineering Co. Shunt current elimination for series connected cells
JPS5928597A (ja) * 1982-08-05 1984-02-15 Ibiden Co Ltd 炭素電極棒の電気メッキ方法及びそのメッキ装置
US4565607A (en) 1984-03-09 1986-01-21 Energy Conversion Devices, Inc. Method of fabricating an electroplated substrate
US4686014A (en) 1984-11-23 1987-08-11 Pellegrino Peter P Turbulent cell electroplating method and apparatus
US4935109A (en) * 1988-05-23 1990-06-19 General Dynamics Corp., Pomona Div. Double-cell electroplating apparatus and method
US5000827A (en) 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
EP0585586B1 (en) * 1992-07-20 1997-01-29 Fuji Photo Film Co., Ltd. Method for electrolytic treatment
US5433797A (en) 1992-11-30 1995-07-18 Queen's University Nanocrystalline metals
US5352266A (en) 1992-11-30 1994-10-04 Queen'university At Kingston Nanocrystalline metals and process of producing the same
US5312532A (en) * 1993-01-15 1994-05-17 International Business Machines Corporation Multi-compartment eletroplating system
US5421987A (en) 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
US5756874A (en) 1995-10-10 1998-05-26 Eosystems, Inc. Electrochemical cell for processing organic wastes
US5776327A (en) 1996-10-16 1998-07-07 Mitsubishi Semiconuctor Americe, Inc. Method and apparatus using an anode basket for electroplating a workpiece
DE19736351C1 (de) * 1997-08-21 1998-10-01 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken
US6027631A (en) 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6491806B1 (en) * 2000-04-27 2002-12-10 Intel Corporation Electroplating bath composition
US6776891B2 (en) * 2001-05-18 2004-08-17 Headway Technologies, Inc. Method of manufacturing an ultra high saturation moment soft magnetic thin film
US20050205425A1 (en) * 2002-06-25 2005-09-22 Integran Technologies Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
DE10311575B4 (de) * 2003-03-10 2007-03-22 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis
US6884335B2 (en) * 2003-05-20 2005-04-26 Novellus Systems, Inc. Electroplating using DC current interruption and variable rotation rate
US20060042932A1 (en) * 2004-08-25 2006-03-02 Rosenzweig Mark A Apparatus and method for electroplating a workpiece
US7435324B2 (en) * 2004-09-02 2008-10-14 Micron Technology, Inc. Noncontact localized electrochemical deposition of metal thin films
US7354354B2 (en) 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
US7320832B2 (en) 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
US7387578B2 (en) * 2004-12-17 2008-06-17 Integran Technologies Inc. Strong, lightweight article containing a fine-grained metallic layer
US7425255B2 (en) * 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
DE102005032738B3 (de) * 2005-07-08 2006-11-23 Siemens Ag Verfahren und Vorrichtung zum Bearbeiten wenigstens zweier Werkstücke mittels elektrochemischer Behandlung
US9005420B2 (en) * 2007-12-20 2015-04-14 Integran Technologies Inc. Variable property electrodepositing of metallic structures

Also Published As

Publication number Publication date
US8062496B2 (en) 2011-11-22
MX2010010658A (es) 2010-11-09
CA2716394A1 (en) 2009-10-22
EP2262928A1 (en) 2010-12-22
US20100006445A1 (en) 2010-01-14
CN102007232A (zh) 2011-04-06
KR20110008043A (ko) 2011-01-25
CN102007232B (zh) 2013-05-01
US20120024696A1 (en) 2012-02-02
WO2009127037A1 (en) 2009-10-22

Similar Documents

Publication Publication Date Title
BRPI0910587A2 (pt) método e aparelho para eletrogalvanização
BRPI0912934A2 (pt) aparelho e método
BRPI0910713A2 (pt) método e aparelhos
BRPI0907812A2 (pt) Aparelho e método para produzir uréia
PT2229800E (pt) Método e aparelho para libertar recursos
BRPI0915254A2 (pt) método e aparelho para agendamento de sincronização
BRPI0808115A2 (pt) Método e aparelho para coexistência
PT2250275T (pt) Aparelho e método para tratar resíduos
BRPI0914120A2 (pt) método e aparelho para determinação estrutural
BRPI0921953A2 (pt) método e aparelho para sincronização de tempo
BRPI0821355A2 (pt) Método e aparelho para implementar chamadas de mergência
BRPI0817292A2 (pt) Método e aparelho para completação de poços.
BRPI0922115A2 (pt) método e aparelho para revestir peças de trabalho
BRPI0809132A8 (pt) método e aparelhos para pré-peneiramento
BRPI1013624A2 (pt) aparelho de exibição e método para fabricação do aparelho de exibição
BRPI1008617A2 (pt) método e aparelho para lipoaspiração
BRPI1007372A2 (pt) aparelho e método para misturação rápida de meios
BR112012015031A2 (pt) aparelho e método
BRPI1012813A2 (pt) aparelho e método para modelar projetos de poço e desempenho de poço
BRPI0819351A2 (pt) Método e aparelho para utilização de hidrogênio
BRPI0822701A2 (pt) Método e aparelho usando portadoras de guarda para canais extra
BRPI0907190A2 (pt) Aparelho e método para fabricar recipiente de metal
BR112012008229A2 (pt) método, e aparelho
BRPI0823290A2 (pt) Método e aparelho para configuração de dispositivos.
BRPI0918588A2 (pt) método e aparelho para detecção de defeitos

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2367 DE 17-05-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.