BRPI0911980A2 - pulverização catódica rotativa de magnetron com alta rigidez - Google Patents
pulverização catódica rotativa de magnetron com alta rigidezInfo
- Publication number
- BRPI0911980A2 BRPI0911980A2 BRPI0911980A BRPI0911980A BRPI0911980A2 BR PI0911980 A2 BRPI0911980 A2 BR PI0911980A2 BR PI0911980 A BRPI0911980 A BR PI0911980A BR PI0911980 A BRPI0911980 A BR PI0911980A BR PI0911980 A2 BRPI0911980 A2 BR PI0911980A2
- Authority
- BR
- Brazil
- Prior art keywords
- magnetron sputtering
- high rigidity
- rotary magnetron
- rigidity rotary
- sputtering
- Prior art date
Links
- 238000001755 magnetron sputter deposition Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08156347 | 2008-05-16 | ||
| PCT/EP2009/055486 WO2009138348A1 (en) | 2008-05-16 | 2009-05-06 | A rotatable sputtering magnetron with high stiffness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0911980A2 true BRPI0911980A2 (pt) | 2015-10-13 |
Family
ID=39798277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0911980A BRPI0911980A2 (pt) | 2008-05-16 | 2009-05-06 | pulverização catódica rotativa de magnetron com alta rigidez |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8500976B2 (pt) |
| EP (1) | EP2301060B1 (pt) |
| JP (1) | JP5524185B2 (pt) |
| KR (1) | KR20110014593A (pt) |
| CN (1) | CN102027565B (pt) |
| BR (1) | BRPI0911980A2 (pt) |
| WO (1) | WO2009138348A1 (pt) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100120926A1 (en) * | 2008-09-19 | 2010-05-13 | Greatpoint Energy, Inc. | Processes for Gasification of a Carbonaceous Feedstock |
| US9512516B1 (en) | 2009-09-24 | 2016-12-06 | Beijing Apollo Ding Rong Solar Technology Co., Ltd. | Cooling water jet pack for high power rotary cathodes |
| DE102010063685B4 (de) * | 2010-02-21 | 2012-07-12 | Von Ardenne Anlagentechnik Gmbh | Magnetronanordnung mit einem Hohltarget |
| DE102010040759B4 (de) | 2010-09-14 | 2015-10-08 | Von Ardenne Gmbh | Kühlanordnung für Targets von Sputterquellen |
| JP5687045B2 (ja) * | 2010-12-20 | 2015-03-18 | キヤノンアネルバ株式会社 | スパッタリング装置およびスパッタリング方法 |
| DE102011075543B4 (de) | 2011-05-10 | 2015-10-08 | Von Ardenne Gmbh | Anordnung zur Kühlung eines längserstreckten Magnetron |
| KR101988391B1 (ko) | 2011-06-27 | 2019-06-12 | 솔레라스 리미티드 | 스퍼터링 타겟 |
| CN102348320A (zh) * | 2011-10-01 | 2012-02-08 | 中国科学院近代物理研究所 | 非圆断面薄壁真空管道及非圆断面薄壁真空室 |
| EP2626887A1 (en) | 2012-02-13 | 2013-08-14 | Soleras Advanced Coatings bvba | Online adjustable magnet bar |
| DE102012204425A1 (de) | 2012-03-20 | 2013-09-26 | Von Ardenne Anlagentechnik Gmbh | Sputterverfahren und Sputtervorrichtung |
| WO2014031156A1 (en) * | 2012-08-24 | 2014-02-27 | Cardinal Cg Company | Apparatus for cylindrical magnetron sputtering |
| DE102012109424A1 (de) | 2012-10-04 | 2014-04-10 | Von Ardenne Anlagentechnik Gmbh | Sputtermagnetron und Verfahren zur dynamischen Magnetfeldbeeinflussung |
| DE102013100974B4 (de) * | 2013-01-31 | 2015-03-12 | Von Ardenne Gmbh | Sputtermagnetron mit Magnetfeldbeeinflussung |
| US9418823B2 (en) * | 2013-03-01 | 2016-08-16 | Sputtering Components, Inc. | Sputtering apparatus |
| US9312108B2 (en) | 2013-03-01 | 2016-04-12 | Sputtering Components, Inc. | Sputtering apparatus |
| BE1021020B1 (nl) * | 2013-04-12 | 2014-12-19 | Soleras Advanced Coatings Bvba | Hybride magneet draagstructuur |
| DE202013012043U1 (de) | 2013-07-31 | 2015-02-23 | Von Ardenne Gmbh | Magnetträgeranordnung |
| CN103924200B (zh) * | 2013-12-30 | 2017-07-04 | 上海天马有机发光显示技术有限公司 | 一种薄膜沉积装置 |
| CN106795621B (zh) * | 2014-04-28 | 2020-05-22 | 零件喷涂公司 | 磁控管组件和旋转靶阴极组件 |
| US10371244B2 (en) | 2015-04-09 | 2019-08-06 | United Technologies Corporation | Additive manufactured gear for a geared architecture gas turbine engine |
| US10727034B2 (en) * | 2017-08-16 | 2020-07-28 | Sputtering Components, Inc. | Magnetic force release for sputtering sources with magnetic target materials |
| US11322338B2 (en) * | 2017-08-31 | 2022-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Sputter target magnet |
| JP6876594B2 (ja) * | 2017-11-13 | 2021-05-26 | キヤノントッキ株式会社 | スパッタ装置 |
| DE102021129521B3 (de) * | 2021-11-12 | 2023-03-30 | VON ARDENNE Asset GmbH & Co. KG | Magnetsystem, Sputtervorrichtung und Verfahren |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4422916A (en) * | 1981-02-12 | 1983-12-27 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
| US4904362A (en) * | 1987-07-24 | 1990-02-27 | Miba Gleitlager Aktiengesellschaft | Bar-shaped magnetron or sputter cathode arrangement |
| JPH0688229A (ja) * | 1991-01-29 | 1994-03-29 | Boc Group Inc:The | 二重円筒マグネトロンに於けるスパッタリングターゲットの磁場ゾーン回転の電気制御 |
| US5262032A (en) | 1991-05-28 | 1993-11-16 | Leybold Aktiengesellschaft | Sputtering apparatus with rotating target and target cooling |
| US5571393A (en) * | 1994-08-24 | 1996-11-05 | Viratec Thin Films, Inc. | Magnet housing for a sputtering cathode |
| GB0118803D0 (en) * | 2001-08-02 | 2001-09-26 | Bekaert Sa Nv | Adjustable magnet configuration and method for magnetron sputtering |
| DE10213049A1 (de) | 2002-03-22 | 2003-10-02 | Dieter Wurczinger | Drehbare Rohrkatode |
| US20040129561A1 (en) * | 2003-01-07 | 2004-07-08 | Von Ardenne Anlagentechnik Gmbh | Cylindrical magnetron magnetic array mid span support |
| JP2009513818A (ja) * | 2003-07-04 | 2009-04-02 | ベーカート・アドヴァンスト・コーティングス | 回転管状スパッタターゲット組立体 |
| US7993496B2 (en) * | 2004-07-01 | 2011-08-09 | Cardinal Cg Company | Cylindrical target with oscillating magnet for magnetron sputtering |
| US7560011B2 (en) | 2005-10-24 | 2009-07-14 | Guardian Industries Corp. | Sputtering target and method/apparatus for cooling the target |
| US20070089982A1 (en) | 2005-10-24 | 2007-04-26 | Hendryk Richert | Sputtering target and method/apparatus for cooling the target |
| US7504011B2 (en) | 2005-10-24 | 2009-03-17 | Guardian Industries Corp. | Sputtering target and method/apparatus for cooling the target |
| US7879210B2 (en) * | 2006-02-03 | 2011-02-01 | Applied Materials, Inc. | Partially suspended rolling magnetron |
-
2009
- 2009-05-06 BR BRPI0911980A patent/BRPI0911980A2/pt not_active IP Right Cessation
- 2009-05-06 JP JP2011508872A patent/JP5524185B2/ja not_active Expired - Fee Related
- 2009-05-06 EP EP09745681.8A patent/EP2301060B1/en active Active
- 2009-05-06 KR KR1020107025535A patent/KR20110014593A/ko not_active Ceased
- 2009-05-06 CN CN200980117737.9A patent/CN102027565B/zh active Active
- 2009-05-06 WO PCT/EP2009/055486 patent/WO2009138348A1/en not_active Ceased
- 2009-05-06 US US12/992,020 patent/US8500976B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP2301060A1 (en) | 2011-03-30 |
| JP5524185B2 (ja) | 2014-06-18 |
| EP2301060B1 (en) | 2014-07-09 |
| KR20110014593A (ko) | 2011-02-11 |
| CN102027565B (zh) | 2013-03-06 |
| CN102027565A (zh) | 2011-04-20 |
| US8500976B2 (en) | 2013-08-06 |
| WO2009138348A1 (en) | 2009-11-19 |
| JP2011521101A (ja) | 2011-07-21 |
| US20110062022A1 (en) | 2011-03-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2344 DE 08-12-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |
|
| B25E | Requested change of name of applicant rejected |
Owner name: BEKAERT ADVANCED COATINGS (BE) |