PL2130948T3 - Kąpiel zawierająca pirofosforany do bezcyjankowego osadzania stopów miedź-cyna - Google Patents

Kąpiel zawierająca pirofosforany do bezcyjankowego osadzania stopów miedź-cyna

Info

Publication number
PL2130948T3
PL2130948T3 PL08010058T PL08010058T PL2130948T3 PL 2130948 T3 PL2130948 T3 PL 2130948T3 PL 08010058 T PL08010058 T PL 08010058T PL 08010058 T PL08010058 T PL 08010058T PL 2130948 T3 PL2130948 T3 PL 2130948T3
Authority
PL
Poland
Prior art keywords
copper
pyrophosphate
cyanide
containing bath
tin alloys
Prior art date
Application number
PL08010058T
Other languages
English (en)
Inventor
Philip Hartmann
Klaus-Dieter Schulz
Lars Kohlmann
Heiko Brunner
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39831596&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2130948(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL2130948T3 publication Critical patent/PL2130948T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PL08010058T 2008-06-02 2008-06-02 Kąpiel zawierająca pirofosforany do bezcyjankowego osadzania stopów miedź-cyna PL2130948T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08010058A EP2130948B1 (de) 2008-06-02 2008-06-02 Pyrophosphathaltiges Bad zur cyanidfreien Abscheidung von Kupfer-Zinn-Legierungen

Publications (1)

Publication Number Publication Date
PL2130948T3 true PL2130948T3 (pl) 2011-05-31

Family

ID=39831596

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08010058T PL2130948T3 (pl) 2008-06-02 2008-06-02 Kąpiel zawierająca pirofosforany do bezcyjankowego osadzania stopów miedź-cyna

Country Status (14)

Country Link
US (2) US20100326838A1 (pl)
EP (1) EP2130948B1 (pl)
JP (1) JP5735415B2 (pl)
KR (1) KR101609171B1 (pl)
CN (1) CN102046852B (pl)
AT (1) ATE492665T1 (pl)
BR (1) BRPI0912309B1 (pl)
CA (1) CA2724211C (pl)
DE (1) DE502008002080D1 (pl)
ES (1) ES2354395T3 (pl)
PL (1) PL2130948T3 (pl)
SI (1) SI2130948T1 (pl)
TW (1) TWI441958B (pl)
WO (1) WO2009146865A1 (pl)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5569718B2 (ja) * 2009-08-21 2014-08-13 キザイ株式会社 シアンフリー光沢銅−スズ合金めっき浴
US8262895B2 (en) * 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
US8268157B2 (en) * 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
CN102242381A (zh) * 2011-06-29 2011-11-16 杭州阿玛尔科技有限公司 以亚甲基二膦酸为主配位剂的碱性无氰镀铜电镀液
CN102220610B (zh) * 2011-07-29 2012-12-05 福州大学 一种无氰型铜锡合金电镀液
JP5505392B2 (ja) 2011-10-04 2014-05-28 株式会社デンソー 複合材料、及びこれを用いた電気接点電極、電気接点皮膜、導電性フィラー、電気接点構造、並びに複合材料の製造方法
CN104152955A (zh) * 2014-07-17 2014-11-19 广东致卓精密金属科技有限公司 碱性溶液电镀光亮白铜锡电镀液及工艺
JP6491989B2 (ja) * 2014-10-10 2019-03-27 日本ニュークローム株式会社 表面の虹色着色処理方法
JP6621169B2 (ja) * 2015-04-28 2019-12-18 オーエム産業株式会社 めっき品の製造方法
CN105200469A (zh) * 2015-10-30 2015-12-30 无锡市嘉邦电力管道厂 一种锡-铜合金电镀液及其电镀方法
CN106350838A (zh) * 2016-09-29 2017-01-25 广州市汇吉科技企业孵化器有限公司 一种长寿命光亮剂及其制备方法
CN108642533B (zh) * 2018-05-15 2020-03-27 河南电池研究院有限公司 一种Sn-Cu电镀液、锂离子电池用锡基合金电极及其制备方法和锂离子电池

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2493092A (en) * 1946-01-11 1950-01-03 United Chromium Inc Method of electrodepositing copper and baths therefor
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US4842756A (en) * 1987-03-23 1989-06-27 Texaco Inc. Multifunctional viscosity index improver
JP3674887B2 (ja) 1996-09-30 2005-07-27 日本ニュークローム株式会社 銅−スズ合金メッキ用ピロリン酸浴
US6210556B1 (en) * 1998-02-12 2001-04-03 Learonal, Inc. Electrolyte and tin-silver electroplating process
JP3455712B2 (ja) 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
TWI228156B (en) * 2001-05-09 2005-02-21 Ebara Udylite Kk Copper-plating bath, method for electroplating substrate by using the same, and additives for the bath
JP4249438B2 (ja) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
US7147767B2 (en) * 2002-12-16 2006-12-12 3M Innovative Properties Company Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
JP2006156068A (ja) 2004-11-29 2006-06-15 Sanyo Chem Ind Ltd 導電性微粒子
EP1741804B1 (en) * 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds

Also Published As

Publication number Publication date
WO2009146865A1 (en) 2009-12-10
KR20110022558A (ko) 2011-03-07
JP2011522116A (ja) 2011-07-28
CN102046852B (zh) 2013-06-12
DE502008002080D1 (de) 2011-02-03
CN102046852A (zh) 2011-05-04
ES2354395T3 (es) 2011-03-14
EP2130948B1 (de) 2010-12-22
EP2130948A1 (de) 2009-12-09
US20140124376A1 (en) 2014-05-08
CA2724211A1 (en) 2009-12-10
SI2130948T1 (sl) 2011-04-29
US9399824B2 (en) 2016-07-26
US20100326838A1 (en) 2010-12-30
BRPI0912309A2 (pt) 2015-10-13
ATE492665T1 (de) 2011-01-15
KR101609171B1 (ko) 2016-04-05
TW201011130A (en) 2010-03-16
TWI441958B (zh) 2014-06-21
JP5735415B2 (ja) 2015-06-17
CA2724211C (en) 2016-10-25
BRPI0912309B1 (pt) 2019-12-10

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