BRPI0921185A2 - composição curável, artigo para revestimento ou ligado, uso de um composto, e, composto - Google Patents

composição curável, artigo para revestimento ou ligado, uso de um composto, e, composto

Info

Publication number
BRPI0921185A2
BRPI0921185A2 BRPI0921185A BRPI0921185A BRPI0921185A2 BR PI0921185 A2 BRPI0921185 A2 BR PI0921185A2 BR PI0921185 A BRPI0921185 A BR PI0921185A BR PI0921185 A BRPI0921185 A BR PI0921185A BR PI0921185 A2 BRPI0921185 A2 BR PI0921185A2
Authority
BR
Brazil
Prior art keywords
coating
compound
curable composition
bonding article
bonding
Prior art date
Application number
BRPI0921185A
Other languages
English (en)
Inventor
Bugnon Folger Luciene
Nesvadba Peter
Knischka Ralf
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of BRPI0921185A2 publication Critical patent/BRPI0921185A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D213/00—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members
    • C07D213/02—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members
    • C07D213/04—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D213/60—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D213/72—Nitrogen atoms
    • C07D213/74—Amino or imino radicals substituted by hydrocarbon or substituted hydrocarbon radicals
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D215/00—Heterocyclic compounds containing quinoline or hydrogenated quinoline ring systems
    • C07D215/02—Heterocyclic compounds containing quinoline or hydrogenated quinoline ring systems having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen atoms or carbon atoms directly attached to the ring nitrogen atom
    • C07D215/16—Heterocyclic compounds containing quinoline or hydrogenated quinoline ring systems having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen atoms or carbon atoms directly attached to the ring nitrogen atom with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D215/38—Nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Quinoline Compounds (AREA)
  • Pyridine Compounds (AREA)
  • Epoxy Resins (AREA)
  • Plural Heterocyclic Compounds (AREA)
BRPI0921185A 2008-11-24 2009-11-18 composição curável, artigo para revestimento ou ligado, uso de um composto, e, composto BRPI0921185A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08169738 2008-11-24
PCT/EP2009/065394 WO2010057922A1 (en) 2008-11-24 2009-11-18 Curable composition comprising a thermolatent base

Publications (1)

Publication Number Publication Date
BRPI0921185A2 true BRPI0921185A2 (pt) 2018-05-29

Family

ID=40810873

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0921185A BRPI0921185A2 (pt) 2008-11-24 2009-11-18 composição curável, artigo para revestimento ou ligado, uso de um composto, e, composto

Country Status (9)

Country Link
US (1) US8969577B2 (pt)
EP (1) EP2367794B1 (pt)
JP (1) JP5250116B2 (pt)
KR (1) KR101239571B1 (pt)
CN (1) CN102224140B (pt)
BR (1) BRPI0921185A2 (pt)
ES (1) ES2400633T3 (pt)
PL (1) PL2367794T3 (pt)
WO (1) WO2010057922A1 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2975101B1 (fr) * 2011-05-10 2013-04-26 Arkema France Resines et composites hybrides thermodurs / supramoleculaires pouvant etre faconnes a chaud et recycles
CN105209536B (zh) * 2013-05-14 2018-01-09 3M创新有限公司 包含含吡嗪化合物的环氧树脂
KR101987305B1 (ko) * 2013-11-19 2019-06-10 삼성전기주식회사 인쇄회로기판용 절연 수지 조성물 및 이를 이용한 제품
JP2016079173A (ja) * 2014-10-15 2016-05-16 日本合成化学工業株式会社 新規ピリジン系化合物、それを用いたアニオン硬化性化合物用硬化剤、硬化性組成物及び硬化物
KR102537349B1 (ko) 2015-02-02 2023-05-26 바스프 에스이 잠재성 산 및 그의 용도
US10160865B2 (en) 2017-05-05 2018-12-25 TIGER DRYLAC U.S.A. Inc. Low gloss hybrid powder coating
US10428224B2 (en) 2017-05-24 2019-10-01 TIGER DRYLAC U.S.A. Inc. Low gloss powder coating
US10773243B2 (en) 2017-09-07 2020-09-15 Ppg Industries Ohio, Inc. Thermolatent catalyst and its use in curable compositions
CN111801306A (zh) * 2017-12-27 2020-10-20 巴斯夫欧洲公司 含亚甲基丙二酸酯单体和聚合物的组合物、其制备及其在地板应用中的用途

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BE580121A (fr) 1958-11-04 1959-10-16 Irwin Dérivés pyridylaminés d'alcanes inférieurs et procédés.
US3220846A (en) 1960-06-27 1965-11-30 Eastman Kodak Co Use of salts of readily decarboxylated acids in thermography, photography, photothermography and thermophotography
US3165527A (en) 1960-11-03 1965-01-12 Neisler Lab Inc Pyridyl amino lower alkane derivatives and process
US3192216A (en) 1961-10-30 1965-06-29 Neisler Lab Inc Phenylhydroxyalkylpyrimidine compounds
US3553292A (en) * 1968-12-10 1971-01-05 Grace W R & Co Product and a method of improving the shelf life of uncured polyesters
US3709904A (en) * 1969-06-18 1973-01-09 Dow Chemical Co Aminoethylation reaction and products thereof
US3819626A (en) 1972-09-11 1974-06-25 Chevron Res Substituted triazines
US3938985A (en) 1972-09-11 1976-02-17 Chevron Research Company Substituted triazines
US3784508A (en) * 1972-09-15 1974-01-08 Dow Chemical Co Rapid cure polyepoxide oxazine or oxazoline systems
JPS50155625A (pt) 1974-06-03 1975-12-16
US4088496A (en) 1976-12-22 1978-05-09 Eastman Kodak Company Heat developable photographic materials and process
US4218513A (en) * 1977-06-28 1980-08-19 Union Carbide Corporation Polymer composite articles containing amino substituted mercapto organo silicon coupling agents
US4147712A (en) * 1977-06-28 1979-04-03 Union Carbide Corporation Amino substituted mercapto organosilicon compounds
US4156677A (en) * 1977-06-28 1979-05-29 Union Carbide Corporation Polymer composite articles containing amino substituted mercapto organo silicon coupling agents
US4189543A (en) * 1978-08-21 1980-02-19 The Dow Chemical Company Catalyst for making polyurethanes
EP0027913A3 (de) * 1979-10-26 1981-10-21 Ciba-Geigy Ag Druckempfindliches oder wärmeempfindliches Aufzeichnungsmaterial
JPS59157637A (ja) 1983-02-25 1984-09-07 Fuji Photo Film Co Ltd 熱現像カラ−感光材料
JPS59168440A (ja) 1983-03-16 1984-09-22 Fuji Photo Film Co Ltd 熱現像カラ−感光材料
JPS6153636A (ja) 1984-08-24 1986-03-17 Fuji Photo Film Co Ltd 熱現像感光材料
JPS62161819A (ja) 1986-01-09 1987-07-17 Dainippon Ink & Chem Inc エポキシ樹脂組成物
JPH0788421B2 (ja) * 1987-10-26 1995-09-27 武田薬品工業株式会社 架橋樹脂の製造方法
JPS63288180A (ja) * 1988-05-07 1988-11-25 株式会社三共 弾球遊技機の制御装置
JP3014473B2 (ja) 1991-03-04 2000-02-28 アグロカネショウ株式会社 フェニルカーバメート誘導体、その製造法及び該誘導体を有効成分とする農園芸用殺菌剤
JPH0578502A (ja) * 1991-09-18 1993-03-30 Fujitsu Ltd エポキシ系ポリマー薄膜の形成方法
US5296486A (en) 1991-09-24 1994-03-22 Boehringer Ingelheim Pharmaceuticals, Inc. Leukotriene biosynthesis inhibitors
JPH07138237A (ja) 1993-11-19 1995-05-30 Ube Ind Ltd ４−アミノピリミジン誘導体、その製法及び農園芸用の有害生物防除剤
DE69715869T2 (de) * 1996-07-26 2003-05-28 Vantico Ag, Basel Auf epoxyharzen basierende imidazole enthaltende härtbare mischungen
US6525067B1 (en) 1999-11-23 2003-02-25 Pfizer Inc Substituted heterocyclic derivatives
AU2001247541A1 (en) 2000-03-31 2001-10-15 Loctite Corporation Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent
DE10028402A1 (de) 2000-06-13 2001-12-20 Merck Patent Gmbh Pyridin-2-yl-aminoalkycarbonylglycyl-beta-alanin und Derivate
JP2003021883A (ja) * 2001-07-09 2003-01-24 Konica Corp 膜強度を改良した熱現像感光材料
US6699651B1 (en) 2002-11-20 2004-03-02 Eastman Kodak Company Base precursors for use in a photothermographic element
JP2004346016A (ja) * 2003-05-22 2004-12-09 Otsuka Chemical Co Ltd トリフルオロメチルキノキサリン化合物、その製造方法、及び有害生物防除剤
GB0324551D0 (en) 2003-10-21 2003-11-26 Karobio Ab Novel compounds
DK1725540T5 (da) 2004-03-05 2012-10-22 Hoffmann La Roche Diaminopyrimidiner som p2x3- og p2x2/3-antagonister
US7915410B2 (en) 2005-09-09 2011-03-29 Bristol-Myers Squibb Company Acyclic IKur inhibitors

Also Published As

Publication number Publication date
JP5250116B2 (ja) 2013-07-31
ES2400633T3 (es) 2013-04-11
EP2367794A1 (en) 2011-09-28
CN102224140B (zh) 2014-04-16
JP2012509949A (ja) 2012-04-26
EP2367794B1 (en) 2013-01-09
WO2010057922A4 (en) 2010-08-19
PL2367794T3 (pl) 2013-06-28
KR20110097892A (ko) 2011-08-31
KR101239571B1 (ko) 2013-03-06
US8969577B2 (en) 2015-03-03
US20110245375A1 (en) 2011-10-06
WO2010057922A1 (en) 2010-05-27
CN102224140A (zh) 2011-10-19

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2494 DE 23-10-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.