BRPI0921905A2 - composição de moldagem termoplástica, uso de composições de moldagem termoplásticas, e, fibras, películas ou corpo moldado de qualquer tipo - Google Patents

composição de moldagem termoplástica, uso de composições de moldagem termoplásticas, e, fibras, películas ou corpo moldado de qualquer tipo

Info

Publication number
BRPI0921905A2
BRPI0921905A2 BRPI0921905A BRPI0921905A BRPI0921905A2 BR PI0921905 A2 BRPI0921905 A2 BR PI0921905A2 BR PI0921905 A BRPI0921905 A BR PI0921905A BR PI0921905 A BRPI0921905 A BR PI0921905A BR PI0921905 A2 BRPI0921905 A2 BR PI0921905A2
Authority
BR
Brazil
Prior art keywords
thermoplastic molding
films
molded fibers
molding composition
molding compositions
Prior art date
Application number
BRPI0921905A
Other languages
English (en)
Inventor
Martin Klatt
Philippe Desbois
Sachin Jain
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of BRPI0921905A2 publication Critical patent/BRPI0921905A2/pt
Publication of BRPI0921905B1 publication Critical patent/BRPI0921905B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0921905-6A 2008-11-11 2009-10-29 Composição de moldagem termoplástica, uso de composições de moldagem termoplásticas, e, fibras, películas ou corpo moldado de qualquer tipo BRPI0921905B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08168798 2008-11-11
EP08168798.0 2008-11-11
PCT/EP2009/064250 WO2010054933A1 (de) 2008-11-11 2009-10-29 Stabilisierte polyamide

Publications (2)

Publication Number Publication Date
BRPI0921905A2 true BRPI0921905A2 (pt) 2015-12-29
BRPI0921905B1 BRPI0921905B1 (pt) 2019-05-07

Family

ID=41507895

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0921905-6A BRPI0921905B1 (pt) 2008-11-11 2009-10-29 Composição de moldagem termoplástica, uso de composições de moldagem termoplásticas, e, fibras, películas ou corpo moldado de qualquer tipo

Country Status (9)

Country Link
US (1) US20110290209A1 (pt)
EP (1) EP2356174B1 (pt)
JP (1) JP2012508314A (pt)
KR (1) KR101652550B1 (pt)
CN (2) CN102209750A (pt)
BR (1) BRPI0921905B1 (pt)
ES (1) ES2392674T3 (pt)
MY (1) MY156724A (pt)
WO (1) WO2010054933A1 (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102639602B (zh) 2009-12-08 2014-12-10 巴斯夫欧洲公司 制备聚酰胺的方法
JP5795075B2 (ja) 2010-11-23 2015-10-14 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 表面上のナノ粒子を有するポリアミド
US9296896B2 (en) 2010-11-23 2016-03-29 Basf Se Polyamides with nanoparticles on the surface
JP6124910B2 (ja) * 2011-11-25 2017-05-10 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ ブロー成形可能なポリアミド成形材料
SG11201404068QA (en) * 2012-01-17 2014-10-30 Mitsui Chemicals Inc Semiconductor sealing composition, semiconductor device and method for producing same, and polymer and method for producing same
EP2716716B1 (de) * 2012-10-02 2018-04-18 Ems-Patent Ag Polyamid-Formmassen und deren Verwendung bei der Herstellung von Formkörpern
WO2015022404A1 (de) * 2013-08-15 2015-02-19 Basf Se Faserverstärkte thermoplastische formmasse mit verbesserter bindenahtfestigkeit
KR101677884B1 (ko) 2013-10-18 2016-11-18 도레이 카부시키가이샤 폴리아미드 수지 조성물, 제조 방법, 성형품
CN105670281A (zh) * 2016-04-01 2016-06-15 星威国际家居有限公司 高流动易脱模的尼龙6复合材料及其制备方法
EP3312224B1 (en) * 2016-10-21 2018-12-26 Ems-Patent Ag Polyamide moulding composition and multi-layered structure made herefrom
WO2021011340A1 (en) * 2019-07-12 2021-01-21 Sun Chemical Corporation Coatings and primers for metallized films
US20230129664A1 (en) * 2020-03-25 2023-04-27 Basf Se Heat-aging resistant polyamide molding compositions
CN114316582B (zh) * 2021-12-20 2023-10-03 金发科技股份有限公司 一种抗静电复合材料及其制备方法和应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10292109A (ja) * 1997-04-18 1998-11-04 Asahi Chem Ind Co Ltd 溶着用ガラス繊維強化ポリアミド樹脂組成物
JP4008156B2 (ja) * 1998-06-08 2007-11-14 三菱エンジニアリングプラスチックス株式会社 ポリアミド樹脂製一体成形品
EP1388564A1 (en) * 2002-08-08 2004-02-11 DSM IP Assets B.V. Polyamide composition, process of preparation and use for making moulded articles
DE102004045775B4 (de) * 2004-09-21 2009-01-08 Ems-Chemie Ag Verwendung von stabilisierten, thermoplastischen Polyamid-Formmassen als Beschichtung von Lichtwellenleitern
DE102005005847A1 (de) * 2005-02-08 2006-08-10 Basf Ag Wärmealterungsbeständige Polyamide
EP2001951B1 (de) * 2006-03-29 2010-01-27 Basf Se Wärmeleitfähige polyamide
CN101506286B (zh) * 2006-08-23 2011-09-21 巴斯夫欧洲公司 具有改进的热老化和水解稳定性的聚酰胺模塑材料
BRPI0922909B1 (pt) * 2008-12-16 2019-06-25 Basf Se Material de moldagem termoplástico, uso de materiais de moldagem termoplásticos, e, fibras, folhas ou corpo moldado de qualquer tipo

Also Published As

Publication number Publication date
KR20110084449A (ko) 2011-07-22
US20110290209A1 (en) 2011-12-01
JP2012508314A (ja) 2012-04-05
EP2356174B1 (de) 2012-09-19
KR101652550B1 (ko) 2016-08-30
WO2010054933A1 (de) 2010-05-20
MY156724A (en) 2016-03-15
BRPI0921905B1 (pt) 2019-05-07
CN105153688A (zh) 2015-12-16
ES2392674T3 (es) 2012-12-12
CN102209750A (zh) 2011-10-05
EP2356174A1 (de) 2011-08-17

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 29/10/2009, OBSERVADAS AS CONDICOES LEGAIS. (CO) 20 (VINTE) ANOS CONTADOS A PARTIR DE 29/10/2009, OBSERVADAS AS CONDICOES LEGAIS