BRPI0924756A2 - módulo semicondutor de neregia tendo paredes laterais isolantes dispostas em camadas - Google Patents

módulo semicondutor de neregia tendo paredes laterais isolantes dispostas em camadas

Info

Publication number
BRPI0924756A2
BRPI0924756A2 BRPI0924756A BRPI0924756A BRPI0924756A2 BR PI0924756 A2 BRPI0924756 A2 BR PI0924756A2 BR PI0924756 A BRPI0924756 A BR PI0924756A BR PI0924756 A BRPI0924756 A BR PI0924756A BR PI0924756 A2 BRPI0924756 A2 BR PI0924756A2
Authority
BR
Brazil
Prior art keywords
neregia
semiconductor module
layered insulating
insulating sidewalls
sidewalls
Prior art date
Application number
BRPI0924756A
Other languages
English (en)
Inventor
Andreas Zenkner
Christoph Blösch
Dirk Malipaard
Markus Billmann
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BRPI0924756A2 publication Critical patent/BRPI0924756A2/pt
Publication of BRPI0924756B1 publication Critical patent/BRPI0924756B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14339—Housings specially adapted for power drive units or power converters specially adapted for high voltage operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
BRPI0924756-4A 2009-03-13 2009-03-13 módulo semicondutor de energia tendo paredes laterais isolantes dispostas em camadas BRPI0924756B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2009/002056 WO2010102654A1 (de) 2009-03-13 2009-03-13 Leistungshalbleitermodul mit schichtweise aufgebauten isolierenden seitenwänden

Publications (2)

Publication Number Publication Date
BRPI0924756A2 true BRPI0924756A2 (pt) 2016-01-26
BRPI0924756B1 BRPI0924756B1 (pt) 2018-10-23

Family

ID=41256009

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0924756-4A BRPI0924756B1 (pt) 2009-03-13 2009-03-13 módulo semicondutor de energia tendo paredes laterais isolantes dispostas em camadas

Country Status (9)

Country Link
US (1) US9210826B2 (pt)
EP (1) EP2407015B8 (pt)
KR (1) KR101502655B1 (pt)
CN (1) CN102349363B (pt)
BR (1) BRPI0924756B1 (pt)
DK (1) DK2407015T3 (pt)
ES (1) ES2398698T3 (pt)
RU (1) RU2492548C2 (pt)
WO (1) WO2010102654A1 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9064737B2 (en) * 2007-11-13 2015-06-23 Siemens Aktiengesellschaft Power semiconductor module
WO2013044966A1 (de) * 2011-09-29 2013-04-04 Siemens Aktiengesellschaft Stapelfähiger leistungshalbleiterschalter mit löt-bondtechnik
RU2546963C1 (ru) * 2013-10-21 2015-04-10 Юрий Иванович Сакуненко Устройство для отвода тепла от тепловыделяющих компонентов
US20160227660A1 (en) * 2015-02-03 2016-08-04 Alstom Technology Ltd Assembly of modules, module support and module
PL3366093T3 (pl) * 2015-12-22 2021-04-19 Siemens Aktiengesellschaft Moduł elektryczny z komponentem elektrycznym
KR101926716B1 (ko) * 2017-04-27 2018-12-07 엘에스산전 주식회사 파워반도체모듈
US11452227B2 (en) * 2017-06-02 2022-09-20 Bombardier Transportation Gmbh Power phase module of a converter, converter, and vehicle
KR102030712B1 (ko) 2018-02-23 2019-10-10 엘에스산전 주식회사 파워반도체모듈
US10985537B2 (en) 2018-09-14 2021-04-20 Ge Aviation Systems Llc Power overlay architecture
RU2699759C1 (ru) * 2018-10-10 2019-09-10 Владимир Анатольевич Петров Блок электрической аппаратуры

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1202088A1 (ru) 1984-04-03 1985-12-30 Nagorny Mikhail A Взрывонепроницаема оболочка (ее варианты)
DE19726534A1 (de) 1997-06-23 1998-12-24 Asea Brown Boveri Leistungshalbleitermodul mit geschlossenen Submodulen
DE19839422A1 (de) 1998-08-29 2000-03-02 Asea Brown Boveri Explosionsschutz für Halbleitermodule
EP1263045A1 (en) * 2001-06-01 2002-12-04 ABB Schweiz AG High power semiconductor module
DE60129146T2 (de) 2001-12-24 2007-12-13 Abb Research Ltd. Modulgehäuse und Leistungshalbleitermodul
JP3830919B2 (ja) * 2003-06-12 2006-10-11 株式会社東芝 大型半導体モジュール
EP1794808B1 (en) * 2004-09-10 2017-08-09 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins
US7327024B2 (en) * 2004-11-24 2008-02-05 General Electric Company Power module, and phase leg assembly
JP4519637B2 (ja) * 2004-12-28 2010-08-04 株式会社東芝 半導体装置
US8183674B2 (en) 2006-09-14 2012-05-22 Siemens Aktiengesellschaft Power semiconductor module comprising an explosion protection system
US9064737B2 (en) * 2007-11-13 2015-06-23 Siemens Aktiengesellschaft Power semiconductor module

Also Published As

Publication number Publication date
CN102349363B (zh) 2014-10-22
BRPI0924756B1 (pt) 2018-10-23
WO2010102654A1 (de) 2010-09-16
EP2407015B8 (de) 2013-02-13
US9210826B2 (en) 2015-12-08
RU2011141435A (ru) 2013-04-20
KR101502655B1 (ko) 2015-03-13
EP2407015A1 (de) 2012-01-18
US20120001317A1 (en) 2012-01-05
CN102349363A (zh) 2012-02-08
DK2407015T3 (da) 2013-02-11
EP2407015B1 (de) 2012-12-26
ES2398698T3 (es) 2013-03-21
RU2492548C2 (ru) 2013-09-10
KR20110129890A (ko) 2011-12-02

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Legal Events

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B25A Requested transfer of rights approved

Owner name: FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWAN

B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 13/03/2009, OBSERVADAS AS CONDICOES LEGAIS.

B25L Entry of change of name and/or headquarter and transfer of application, patent and certificate of addition of invention: publication cancelled

Owner name: FRAUNHOFER - GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V (DE)

Free format text: ANULADA A PUBLICACAO CODIGO 25.1 NA RPI NO 2436 DE 12/09/2017 POR TER SIDO INDEVIDA.

Owner name: FRAUNHOFER - GESELLSCHAFT ZUR FOERDERUNG DER ANGEW

Free format text: ANULADA A PUBLICACAO CODIGO 25.1 NA RPI NO 2436 DE 12/09/2017 POR TER SIDO INDEVIDA.

B25A Requested transfer of rights approved

Owner name: FRAUNHOFER - GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V (DE)

Owner name: FRAUNHOFER - GESELLSCHAFT ZUR FOERDERUNG DER ANGEW

B25K Entry of change of name and/or headquarter and transfer of application, patent and certificate of addition of invention: republication

Owner name: FRAUNHOFER - GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V (DE) ; SIEMENS AKTIENGESELLSCHAFT (DE)

Free format text: RETIFICADO O DESPACHO 25.1 PUBLICADO NA RPI 2509 DE 05/02/2019 SOB O ITEM (71).

B25A Requested transfer of rights approved

Owner name: FRAUNHOFER - GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V (DE) ; SIEMENS ENERGY GLOBAL GMBH AND CO. KG (DE)