BRPI1010296A2 - grade condutora para alojamentos eletrônicos e método para a fabricação. - Google Patents

grade condutora para alojamentos eletrônicos e método para a fabricação.

Info

Publication number
BRPI1010296A2
BRPI1010296A2 BRPI1010296A BRPI1010296A BRPI1010296A2 BR PI1010296 A2 BRPI1010296 A2 BR PI1010296A2 BR PI1010296 A BRPI1010296 A BR PI1010296A BR PI1010296 A BRPI1010296 A BR PI1010296A BR PI1010296 A2 BRPI1010296 A2 BR PI1010296A2
Authority
BR
Brazil
Prior art keywords
manufacturing
conductive grid
electronic housing
housing
electronic
Prior art date
Application number
BRPI1010296A
Other languages
English (en)
Inventor
Lorenz Berchtold
Original Assignee
Tyco Electronics Amp Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Amp Gmbh filed Critical Tyco Electronics Amp Gmbh
Publication of BRPI1010296A2 publication Critical patent/BRPI1010296A2/pt
Publication of BRPI1010296B1 publication Critical patent/BRPI1010296B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
BRPI1010296-5A 2009-04-08 2010-03-29 Grade condutora para alojamentos eletrônicos e método para a fabricação da mesma BRPI1010296B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009016842.7 2009-04-08
DE102009016842.7A DE102009016842B4 (de) 2009-04-08 2009-04-08 Leitungsgitter für Elektronikgehäuse und Herstellungsverfahren
PCT/EP2010/054091 WO2010115746A1 (en) 2009-04-08 2010-03-29 Conductor grid for electronic housings and manufacturing method

Publications (2)

Publication Number Publication Date
BRPI1010296A2 true BRPI1010296A2 (pt) 2016-03-22
BRPI1010296B1 BRPI1010296B1 (pt) 2019-07-02

Family

ID=42269421

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1010296-5A BRPI1010296B1 (pt) 2009-04-08 2010-03-29 Grade condutora para alojamentos eletrônicos e método para a fabricação da mesma

Country Status (8)

Country Link
US (1) US8723032B2 (pt)
EP (1) EP2417842B1 (pt)
JP (1) JP2012523685A (pt)
KR (1) KR101695310B1 (pt)
CN (1) CN102379165A (pt)
BR (1) BRPI1010296B1 (pt)
DE (1) DE102009016842B4 (pt)
WO (1) WO2010115746A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9331448B2 (en) 2014-03-25 2016-05-03 Tyco Electronics Corporation Electrical connector having primary and secondary leadframes
DE102014015805B3 (de) * 2014-10-24 2016-02-18 Isabellenhütte Heusler Gmbh & Co. Kg Widerstand, Herstellungsverfahren dafür und Verbundmaterialband zum Herstellen des Widerstands
DE102015101363B4 (de) * 2015-01-30 2019-05-23 Infineon Technologies Ag Erfassung einer Drehposition einer Welle
US10630104B2 (en) * 2017-04-13 2020-04-21 Schneider Electric It Corporation Automatic current balancing for power systems

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501786B1 (pt) * 1969-10-17 1975-01-21
US4176243A (en) * 1976-12-30 1979-11-27 Westinghouse Electric Corp. Bus connector for welded electrical switchboard bus structure
JPS60149154A (ja) * 1984-01-17 1985-08-06 Nec Corp 半導体装置の製造方法
IL74296A0 (en) * 1984-03-20 1985-05-31 Isotronics Inc Corrosion resistant microcircuit package
JPS6246550A (ja) * 1985-08-23 1987-02-28 Sumitomo Electric Ind Ltd 半導体装置用リ−ドフレ−ム
FR2591394B1 (fr) 1985-12-11 1988-08-12 Ducellier & Cie Organe lamellaire de liaison electrique de deux circuits
JPH02152267A (ja) * 1988-12-02 1990-06-12 Hitachi Cable Ltd Ｃｕ合金／Ｆｅ−Ｎｉ合金並接型リードフレーム
JPH04107933A (ja) * 1990-08-28 1992-04-09 Fujitsu Ltd 半導体装置の製造方法
JPH05144989A (ja) * 1991-11-21 1993-06-11 Sony Corp リードフレームの製造方法とそれを用いた半導体素子の接合方法
DE4227030A1 (de) * 1992-08-14 1994-02-17 Basf Lacke & Farben Als Bindemittel geeignete Polymere
US5339518A (en) * 1993-07-06 1994-08-23 Motorola, Inc. Method for making a quad leadframe for a semiconductor device
US5681663A (en) * 1995-06-09 1997-10-28 Ford Motor Company Heatspreader carrier strip
US5811733A (en) * 1997-07-16 1998-09-22 Square D Company Busway elbow device
DE19921928C2 (de) * 1999-05-12 2002-11-14 Bosch Gmbh Robert Elektrisches Gerät
JP4248756B2 (ja) * 2001-03-29 2009-04-02 Ｔｄｋ株式会社 固体電解コンデンサ内蔵基板およびその製造方法
JP2005254282A (ja) * 2004-03-11 2005-09-22 Nippon Steel Corp レーザーによる突合せ溶接金属板の製造方法
KR20060021744A (ko) * 2004-09-04 2006-03-08 삼성테크윈 주식회사 리드프레임 및 그 제조방법

Also Published As

Publication number Publication date
KR101695310B1 (ko) 2017-01-13
JP2012523685A (ja) 2012-10-04
EP2417842B1 (en) 2019-02-27
DE102009016842B4 (de) 2015-01-22
US8723032B2 (en) 2014-05-13
EP2417842A1 (en) 2012-02-15
CN102379165A (zh) 2012-03-14
KR20110137391A (ko) 2011-12-22
WO2010115746A1 (en) 2010-10-14
BRPI1010296B1 (pt) 2019-07-02
US20120018187A1 (en) 2012-01-26
DE102009016842A1 (de) 2010-10-21

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Legal Events

Date Code Title Description
B25D Requested change of name of applicant approved

Owner name: TE CONNECTIVITY GERMANY GMBH (DE)

B06T Formal requirements before examination [chapter 6.20 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 29/03/2010, OBSERVADAS AS CONDICOES LEGAIS. (CO) 20 (VINTE) ANOS CONTADOS A PARTIR DE 29/03/2010, OBSERVADAS AS CONDICOES LEGAIS

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 13A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2716 DE 24-01-2023 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.