CA1041644A - Methode de fabrication d'une matiere photosensible - Google Patents

Methode de fabrication d'une matiere photosensible

Info

Publication number: CA1041644A
Authority: CA; Canada
Prior art keywords: substrate material; particles; solution; metal; copper
Prior art date: 1973-11-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA214,614A

Other languages

English (en)

Other versions

CA214614S (en

Inventor

Gerardus J.M. Lippits

Henricus A. Debruijn

Johannes Van Ruler

Petrus J. Janssen

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Koninklijke Philips NV

Original Assignee

Philips Gloeilampenfabrieken NV

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-11-29

Filing date

1974-11-26

Publication date

1978-10-31

1974-11-26 Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV

1978-06-15 Priority to CA305,493A priority Critical patent/CA1070024A/fr

1978-10-31 Application granted granted Critical

1978-10-31 Publication of CA1041644A publication Critical patent/CA1041644A/fr

Status Expired legal-status Critical Current

Links

239000000463 material Substances 0.000 title claims abstract description 43
238000004519 manufacturing process Methods 0.000 title claims abstract description 8
239000002245 particle Substances 0.000 claims abstract description 19
239000000758 substrate Substances 0.000 claims abstract description 18
239000006185 dispersion Substances 0.000 claims abstract description 13
238000007747 plating Methods 0.000 claims abstract description 7
239000003795 chemical substances by application Substances 0.000 claims abstract description 6
229910044991 metal oxide Inorganic materials 0.000 claims abstract description 5
150000004706 metal oxides Chemical class 0.000 claims abstract description 5
229910052751 metal Inorganic materials 0.000 claims description 17
239000002184 metal Substances 0.000 claims description 17
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
239000010949 copper Substances 0.000 claims description 12
229910052802 copper Inorganic materials 0.000 claims description 12
150000003839 salts Chemical class 0.000 claims description 7
230000001419 dependent effect Effects 0.000 claims description 4
238000007669 thermal treatment Methods 0.000 claims description 4
239000007795 chemical reaction product Substances 0.000 claims description 3
238000000354 decomposition reaction Methods 0.000 claims description 3
150000002739 metals Chemical class 0.000 claims description 2
GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 38
239000000243 solution Substances 0.000 description 18
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 11
239000011248 coating agent Substances 0.000 description 9
238000000576 coating method Methods 0.000 description 9
238000000034 method Methods 0.000 description 9
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
229910052763 palladium Inorganic materials 0.000 description 6
150000001875 compounds Chemical class 0.000 description 5
239000011521 glass Substances 0.000 description 5
239000003365 glass fiber Substances 0.000 description 5
-1 palladium ions Chemical class 0.000 description 4
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
239000004593 Epoxy Substances 0.000 description 3
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
238000001035 drying Methods 0.000 description 3
235000011187 glycerol Nutrition 0.000 description 3
150000002500 ions Chemical class 0.000 description 3
239000007788 liquid Substances 0.000 description 3
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
229910052753 mercury Inorganic materials 0.000 description 3
239000000203 mixture Substances 0.000 description 3
230000002787 reinforcement Effects 0.000 description 3
229920005989 resin Polymers 0.000 description 3
239000011347 resin Substances 0.000 description 3
239000000126 substance Substances 0.000 description 3
RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
229910010293 ceramic material Inorganic materials 0.000 description 2
238000005553 drilling Methods 0.000 description 2
239000000945 filler Substances 0.000 description 2
230000002209 hydrophobic effect Effects 0.000 description 2
229910000510 noble metal Inorganic materials 0.000 description 2
229920002120 photoresistant polymer Polymers 0.000 description 2
238000007788 roughening Methods 0.000 description 2
239000007858 starting material Substances 0.000 description 2
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
241000237074 Centris Species 0.000 description 1
241000905957 Channa melasoma Species 0.000 description 1
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
229910021120 PdC12 Inorganic materials 0.000 description 1
229910002666 PdCl2 Inorganic materials 0.000 description 1
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
206010034972 Photosensitivity reaction Diseases 0.000 description 1
239000004698 Polyethylene Substances 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
239000012670 alkaline solution Substances 0.000 description 1
238000000149 argon plasma sintering Methods 0.000 description 1
239000011230 binding agent Substances 0.000 description 1
125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 description 1
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
230000008021 deposition Effects 0.000 description 1
229960001484 edetic acid Drugs 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
239000000835 fiber Substances 0.000 description 1
239000012467 final product Substances 0.000 description 1
229960002449 glycine Drugs 0.000 description 1
235000013905 glycine and its sodium salt Nutrition 0.000 description 1
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
230000001788 irregular Effects 0.000 description 1
239000010410 layer Substances 0.000 description 1
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
229910017604 nitric acid Inorganic materials 0.000 description 1
230000006911 nucleation Effects 0.000 description 1
238000010899 nucleation Methods 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
239000011574 phosphorus Substances 0.000 description 1
229910052698 phosphorus Inorganic materials 0.000 description 1
230000036211 photosensitivity Effects 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920000573 polyethylene Polymers 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
239000000047 product Substances 0.000 description 1
BALXUFOVQVENIU-KXNXZCPBSA-N pseudoephedrine hydrochloride Chemical compound [H+].[Cl-].CN[C@@H](C)[C@@H](O)C1=CC=CC=C1 BALXUFOVQVENIU-KXNXZCPBSA-N 0.000 description 1
239000002356 single layer Substances 0.000 description 1
239000011734 sodium Substances 0.000 description 1
159000000000 sodium salts Chemical class 0.000 description 1
RPACBEVZENYWOL-XFULWGLBSA-M sodium;(2r)-2-[6-(4-chlorophenoxy)hexyl]oxirane-2-carboxylate Chemical compound [Na+].C=1C=C(Cl)C=CC=1OCCCCCC[C@]1(C(=O)[O-])CO1 RPACBEVZENYWOL-XFULWGLBSA-M 0.000 description 1
239000007787 solid Substances 0.000 description 1
241000894007 species Species 0.000 description 1
239000000725 suspension Substances 0.000 description 1
239000004408 titanium dioxide Substances 0.000 description 1
230000004304 visual acuity Effects 0.000 description 1
229910052727 yttrium Inorganic materials 0.000 description 1
VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
- H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C1/00—Photosensitive materials
- G03C1/705—Compositions containing chalcogenides, metals or alloys thereof, as photosensitive substances, e.g. photodope systems
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
General Physics & Mathematics (AREA)
Manufacturing Of Printed Wiring (AREA)
Chemically Coating (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
Surface Treatment Of Glass (AREA)
Photoreceptors In Electrophotography (AREA)

CA214,614A 1973-11-29 1974-11-26 Methode de fabrication d'une matiere photosensible Expired CA1041644A (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
CA305,493A CA1070024A (fr)	1973-11-29	1978-06-15	Methode de fabrication de plaquettes de circuits imprimes

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
NL7316313A NL7316313A (nl)	1973-11-29	1973-11-29	Werkwijze voor de vervaardiging van lichtgevoelig materiaal.

Publications (1)

Publication Number	Publication Date
CA1041644A true CA1041644A (fr)	1978-10-31

Family

ID=19820099

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA214,614A Expired CA1041644A (fr)	1973-11-29	1974-11-26	Methode de fabrication d'une matiere photosensible

Country Status (11)

Country	Link
JP (2)	JPS567219B2 (fr)
AT (1)	AT363540B (fr)
BE (1)	BE822669A (fr)
CA (1)	CA1041644A (fr)
DE (1)	DE2454536A1 (fr)
FR (1)	FR2253229B1 (fr)
GB (1)	GB1487227A (fr)
HK (1)	HK41678A (fr)
IT (1)	IT1026507B (fr)
NL (1)	NL7316313A (fr)
SE (1)	SE404558B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4376815A (en) *	1979-10-22	1983-03-15	Oddi Michael J	Method of applying photoresist by screening in the formation of printed circuits
JPS5723416A (en) *	1980-07-17	1982-02-06	Suwa Seikosha Kk	Method of forming pattern of insulating substrate
JPS5831760B2 (ja) *	1981-01-09	1983-07-08	株式会社東芝	プリント配線板の製造方法
JPS5878493A (ja) *	1981-11-05	1983-05-12	塩尻工業株式会社	プリント配線板
KR100883726B1 (ko) *	2001-08-31	2009-02-12	간토 가세이 고교 가부시키가이샤	부도체 제품의 도금방법
CN110975865B (zh) *	2019-12-20	2022-09-02	绍兴蓝竹新材料科技有限公司	高导光率高吸附性能净化空气用光催化复合剂的制备方法
CN112479597A (zh) *	2020-12-07	2021-03-12	陕西拓日新能源科技有限公司	一种光伏玻璃的双面镀膜工艺

1973
- 1973-11-29 NL NL7316313A patent/NL7316313A/xx not_active Application Discontinuation
1974
- 1974-11-16 DE DE19742454536 patent/DE2454536A1/de not_active Ceased
- 1974-11-26 IT IT29823/74A patent/IT1026507B/it active
- 1974-11-26 JP JP13525974A patent/JPS567219B2/ja not_active Expired
- 1974-11-26 SE SE7414805A patent/SE404558B/xx not_active IP Right Cessation
- 1974-11-26 AT AT0945974A patent/AT363540B/de not_active IP Right Cessation
- 1974-11-26 CA CA214,614A patent/CA1041644A/fr not_active Expired
- 1974-11-26 GB GB51132/74A patent/GB1487227A/en not_active Expired
- 1974-11-27 BE BE150920A patent/BE822669A/fr not_active IP Right Cessation
- 1974-11-28 FR FR7438987A patent/FR2253229B1/fr not_active Expired
1978
- 1978-07-20 HK HK416/78A patent/HK41678A/xx unknown
1979
- 1979-12-08 JP JP15875079A patent/JPS55130197A/ja active Granted

Also Published As

Publication number	Publication date
JPS567219B2 (fr)	1981-02-17
NL7316313A (nl)	1975-06-02
SE404558B (sv)	1978-10-09
GB1487227A (en)	1977-09-28
DE2454536A1 (de)	1975-06-05
AT363540B (de)	1981-08-10
BE822669A (fr)	1975-05-27
IT1026507B (it)	1978-10-20
SE7414805L (fr)	1975-05-30
FR2253229A1 (fr)	1975-06-27
JPS5085876A (fr)	1975-07-10
JPS5748879B2 (fr)	1982-10-19
HK41678A (en)	1978-07-28
JPS55130197A (en)	1980-10-08
FR2253229B1 (fr)	1979-05-25
ATA945974A (de)	1981-01-15

Publication	Publication Date	Title
JP3117386B2 (ja)	2000-12-11	基板を選択的に金属被覆する方法
EP0288491B1 (fr)	1992-11-11	Procede de metallisation selectif, procede additif pour la fabrication de plaques a cicruit imprime, et composition utilisee
JPS6081893A (ja)	1985-05-09	不導体基板表面上に選択的に銅を無電解メツキする方法
JPH01219168A (ja)	1989-09-01	非導電性基板の無電解メツキのための前処理方法
CA1041644A (fr)	1978-10-31	Methode de fabrication d'une matiere photosensible
JP3220350B2 (ja)	2001-10-22	プリント配線板の製造方法
US3674485A (en)	1972-07-04	Method of manufacturing electrically conducting metal layers
US4085285A (en)	1978-04-18	Method of manufacturing printed circuit boards
JPS60231388A (ja)	1985-11-16	基板の活性化方法
JPH021911B2 (fr)	1990-01-16
EP0098472B1 (fr)	1987-05-27	Procédé pour diminuer les défauts des revêtements métalliques
JPS63293994A (ja)	1988-11-30	残留触媒粒子を除去する方法
KR100235930B1 (ko)	1999-12-15	인쇄 배선 보드와 그 형성 방법
CA1293605C (fr)	1991-12-31	Procede pour le traitement de materiau composite de polymere renforce
US20030143411A1 (en)	2003-07-31	Surface conductive resin, process for forming the same and wiring board
US3928663A (en)	1975-12-23	Modified hectorite for electroless plating
US6635410B2 (en)	2003-10-21	Metallizing method for dielectrics
EP0139233B1 (fr)	1987-05-27	Procédé pour le conditionnement de la surface d'un substrat diélectrique pour le placage sans courant
CA1070024A (fr)	1980-01-15	Methode de fabrication de plaquettes de circuits imprimes
JP2003129247A (ja)	2003-05-08	樹脂表面への導電性被膜及び導電性回路パターンの形成方法
JPS6358890A (ja)	1988-03-14	印刷配線板の製造方法
JPS6323390A (ja)	1988-01-30	プリント配線板の製造法
JPS62297472A (ja)	1987-12-24	絶縁材表面を無電解めつきするための増感方法
JPH0434625B2 (fr)	1992-06-08
JPS63130779A (ja)	1988-06-02	プラスチツクの無電解めつき方法