CA1067195A - Ensemble de circuits modulaire et methode connexe - Google Patents
Ensemble de circuits modulaire et methode connexeInfo
- Publication number
- CA1067195A CA1067195A CA317,855A CA317855A CA1067195A CA 1067195 A CA1067195 A CA 1067195A CA 317855 A CA317855 A CA 317855A CA 1067195 A CA1067195 A CA 1067195A
- Authority
- CA
- Canada
- Prior art keywords
- circuit
- arrangement according
- lead
- packaging arrangement
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000004020 conductor Substances 0.000 claims abstract description 137
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 230000005291 magnetic effect Effects 0.000 claims description 52
- 239000004033 plastic Substances 0.000 claims description 47
- 239000013078 crystal Substances 0.000 claims description 20
- 239000003990 capacitor Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000002991 molded plastic Substances 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000005693 optoelectronics Effects 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 2
- 230000000295 complement effect Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 10
- 238000001746 injection moulding Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- KVFIJIWMDBAGDP-UHFFFAOYSA-N ethylpyrazine Chemical compound CCC1=CN=CC=N1 KVFIJIWMDBAGDP-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 101100277637 Mus musculus Dffa gene Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA317,855A CA1067195A (fr) | 1975-05-29 | 1978-12-13 | Ensemble de circuits modulaire et methode connexe |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58162075A | 1975-05-29 | 1975-05-29 | |
| US05/581,604 US3986334A (en) | 1975-05-29 | 1975-05-29 | Electronic watch and its method of fabrication |
| US05/581,605 US4012723A (en) | 1975-05-29 | 1975-05-29 | Magnetic bubble memory packaging arrangement and its method of fabrication |
| US05/581,603 US3986335A (en) | 1975-05-29 | 1975-05-29 | Electronic watch module and its method of fabrication |
| CA251,202A CA1058312A (fr) | 1975-05-29 | 1976-04-27 | Technique d'encapsulation de circuits |
| CA317,855A CA1067195A (fr) | 1975-05-29 | 1978-12-13 | Ensemble de circuits modulaire et methode connexe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1067195A true CA1067195A (fr) | 1979-11-27 |
Family
ID=27543277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA317,855A Expired CA1067195A (fr) | 1975-05-29 | 1978-12-13 | Ensemble de circuits modulaire et methode connexe |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1067195A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120745526A (zh) * | 2025-08-15 | 2025-10-03 | 东莞市通科电子有限公司 | 一种集成电路的模块化封装系统及方法 |
-
1978
- 1978-12-13 CA CA317,855A patent/CA1067195A/fr not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120745526A (zh) * | 2025-08-15 | 2025-10-03 | 东莞市通科电子有限公司 | 一种集成电路的模块化封装系统及方法 |
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