CA1135903A - Electroless copper deposition process having faster plating rates - Google Patents

Electroless copper deposition process having faster plating rates

Info

Publication number: CA1135903A
Authority: CA; Canada
Prior art keywords: copper; solution; electroless; agent; deposition
Prior art date: 1978-09-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA000331706A

Other languages

English (en)

French (fr)

Inventor

John F. Mccormack

Francis J. Nuzzi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kollmorgen Technologies Corp

Original Assignee

Kollmorgen Technologies Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-09-13

Filing date

1979-07-12

Publication date

1982-11-23

1979-07-12 Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp

1982-11-23 Application granted granted Critical

1982-11-23 Publication of CA1135903A publication Critical patent/CA1135903A/en

Status Expired legal-status Critical Current

Links

239000010949 copper Substances 0.000 title claims abstract description 144
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 143
229910052802 copper Inorganic materials 0.000 title claims abstract description 143
238000007747 plating Methods 0.000 title claims abstract description 99
238000005137 deposition process Methods 0.000 title description 2
238000000034 method Methods 0.000 claims abstract description 55
239000003795 chemical substances by application Substances 0.000 claims abstract description 54
230000008021 deposition Effects 0.000 claims abstract description 47
-1 aromatic nitrogen compounds Chemical class 0.000 claims abstract description 23
230000002999 depolarising effect Effects 0.000 claims abstract description 15
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 13
239000008139 complexing agent Substances 0.000 claims abstract description 13
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 10
229910001431 copper ion Inorganic materials 0.000 claims abstract description 10
229910017464 nitrogen compound Inorganic materials 0.000 claims abstract description 10
239000003638 chemical reducing agent Substances 0.000 claims abstract description 8
229910052757 nitrogen Inorganic materials 0.000 claims abstract description 7
150000004982 aromatic amines Chemical class 0.000 claims abstract description 5
125000006615 aromatic heterocyclic group Chemical group 0.000 claims abstract description 4
150000003464 sulfur compounds Chemical class 0.000 claims abstract description 4
230000007423 decrease Effects 0.000 claims abstract 2
238000000151 deposition Methods 0.000 claims description 54
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 43
229910052751 metal Inorganic materials 0.000 claims description 27
239000002184 metal Substances 0.000 claims description 27
YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims description 26
OPTASPLRGRRNAP-UHFFFAOYSA-N cytosine Chemical compound NC=1C=CNC(=O)N=1 OPTASPLRGRRNAP-UHFFFAOYSA-N 0.000 claims description 26
239000000203 mixture Substances 0.000 claims description 25
238000006243 chemical reaction Methods 0.000 claims description 20
JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 18
230000036961 partial effect Effects 0.000 claims description 15
230000028161 membrane depolarization Effects 0.000 claims description 14
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 13
229940104302 cytosine Drugs 0.000 claims description 13
RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 13
150000003839 salts Chemical class 0.000 claims description 13
UBQKCCHYAOITMY-UHFFFAOYSA-N pyridin-2-ol Chemical compound OC1=CC=CC=N1 UBQKCCHYAOITMY-UHFFFAOYSA-N 0.000 claims description 12
230000001464 adherent effect Effects 0.000 claims description 11
238000000454 electroless metal deposition Methods 0.000 claims description 9
UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 9
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
230000001427 coherent effect Effects 0.000 claims description 7
150000001879 copper Chemical class 0.000 claims description 7
239000010409 thin film Substances 0.000 claims description 5
ODVBBZFQPGORMJ-UHFFFAOYSA-N 4-nitrobenzylamine Chemical compound NCC1=CC=C([N+]([O-])=O)C=C1 ODVBBZFQPGORMJ-UHFFFAOYSA-N 0.000 claims description 4
KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 claims description 4
229910052759 nickel Inorganic materials 0.000 claims description 4
GCNTZFIIOFTKIY-UHFFFAOYSA-N 4-hydroxypyridine Chemical compound OC1=CC=NC=C1 GCNTZFIIOFTKIY-UHFFFAOYSA-N 0.000 claims description 3
IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 3
GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 3
229920001400 block copolymer Polymers 0.000 claims description 3
PJJJBBJSCAKJQF-UHFFFAOYSA-N guanidinium chloride Chemical compound [Cl-].NC(N)=[NH2+] PJJJBBJSCAKJQF-UHFFFAOYSA-N 0.000 claims description 3
150000002500 ions Chemical class 0.000 claims description 3
WHMDPDGBKYUEMW-UHFFFAOYSA-N pyridine-2-thiol Chemical compound SC1=CC=CC=N1 WHMDPDGBKYUEMW-UHFFFAOYSA-N 0.000 claims description 3
230000001105 regulatory effect Effects 0.000 claims description 3
PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 claims description 2
UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical class B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 2
229910000085 borane Inorganic materials 0.000 claims description 2
229910017052 cobalt Inorganic materials 0.000 claims description 2
239000010941 cobalt Substances 0.000 claims description 2
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
229960000789 guanidine hydrochloride Drugs 0.000 claims description 2
150000002429 hydrazines Chemical class 0.000 claims description 2
150000002443 hydroxylamines Chemical class 0.000 claims description 2
239000002243 precursor Substances 0.000 claims description 2
XFTQRUTUGRCSGO-UHFFFAOYSA-N pyrazin-2-amine Chemical compound NC1=CN=CC=N1 XFTQRUTUGRCSGO-UHFFFAOYSA-N 0.000 claims description 2
150000008044 alkali metal hydroxides Chemical group 0.000 claims 1
229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 claims 1
239000003574 free electron Substances 0.000 claims 1
229910021645 metal ion Inorganic materials 0.000 claims 1
125000004433 nitrogen atom Chemical group N* 0.000 claims 1
230000000737 periodic effect Effects 0.000 claims 1
ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims 1
150000001875 compounds Chemical class 0.000 abstract description 14
239000000243 solution Substances 0.000 description 74
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 21
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
235000019256 formaldehyde Nutrition 0.000 description 14
229940054266 2-mercaptobenzothiazole Drugs 0.000 description 13
230000000694 effects Effects 0.000 description 10
230000010287 polarization Effects 0.000 description 9
239000000654 additive Substances 0.000 description 8
238000002474 experimental method Methods 0.000 description 8
238000004519 manufacturing process Methods 0.000 description 8
NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 7
230000000996 additive effect Effects 0.000 description 7
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 6
ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 6
238000009713 electroplating Methods 0.000 description 6
239000011888 foil Substances 0.000 description 6
229910021626 Tin(II) chloride Inorganic materials 0.000 description 5
238000010349 cathodic reaction Methods 0.000 description 5
239000010408 film Substances 0.000 description 5
238000009472 formulation Methods 0.000 description 5
239000003446 ligand Substances 0.000 description 5
239000004033 plastic Substances 0.000 description 5
229920003023 plastic Polymers 0.000 description 5
XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 4
KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 4
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
229910052770 Uranium Inorganic materials 0.000 description 4
230000001133 acceleration Effects 0.000 description 4
230000015572 biosynthetic process Effects 0.000 description 4
229960004198 guanidine Drugs 0.000 description 4
150000002739 metals Chemical class 0.000 description 4
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 4
229920001983 poloxamer Polymers 0.000 description 4
230000001235 sensitizing effect Effects 0.000 description 4
239000010935 stainless steel Substances 0.000 description 4
229910001220 stainless steel Inorganic materials 0.000 description 4
TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 3
MACMAADVRVVHBD-VMPITWQZSA-N (e)-1-(2,4-dihydroxyphenyl)-3-(2-hydroxyphenyl)prop-2-en-1-one Chemical compound OC1=CC(O)=CC=C1C(=O)\C=C\C1=CC=CC=C1O MACMAADVRVVHBD-VMPITWQZSA-N 0.000 description 3
FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 3
239000004593 Epoxy Substances 0.000 description 3
PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 3
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
239000002253 acid Substances 0.000 description 3
239000007864 aqueous solution Substances 0.000 description 3
239000012298 atmosphere Substances 0.000 description 3
229910000365 copper sulfate Inorganic materials 0.000 description 3
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 3
229940012017 ethylenediamine Drugs 0.000 description 3
239000011521 glass Substances 0.000 description 3
239000004615 ingredient Substances 0.000 description 3
239000000463 material Substances 0.000 description 3
LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 3
230000002035 prolonged effect Effects 0.000 description 3
235000011006 sodium potassium tartrate Nutrition 0.000 description 3
239000001119 stannous chloride Substances 0.000 description 3
235000011150 stannous chloride Nutrition 0.000 description 3
229940095064 tartrate Drugs 0.000 description 3
239000000080 wetting agent Substances 0.000 description 3
OXFSTTJBVAAALW-UHFFFAOYSA-N 1,3-dihydroimidazole-2-thione Chemical class SC1=NC=CN1 OXFSTTJBVAAALW-UHFFFAOYSA-N 0.000 description 2
BAXOFTOLAUCFNW-UHFFFAOYSA-N 1H-indazole Chemical class C1=CC=C2C=NNC2=C1 BAXOFTOLAUCFNW-UHFFFAOYSA-N 0.000 description 2
LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 2
UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 2
GFFGJBXGBJISGV-UHFFFAOYSA-N Adenine Chemical compound NC1=NC=NC2=C1N=CN2 GFFGJBXGBJISGV-UHFFFAOYSA-N 0.000 description 2
241000518994 Conta Species 0.000 description 2
RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
UOACKFBJUYNSLK-XRKIENNPSA-N Estradiol Cypionate Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H](C4=CC=C(O)C=C4CC3)CC[C@@]21C)C(=O)CCC1CCCC1 UOACKFBJUYNSLK-XRKIENNPSA-N 0.000 description 2
KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 2
239000004677 Nylon Substances 0.000 description 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 2
WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 2
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 2
229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
239000003513 alkali Substances 0.000 description 2
229910052786 argon Inorganic materials 0.000 description 2
125000003118 aryl group Chemical group 0.000 description 2
QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
239000012964 benzotriazole Substances 0.000 description 2
230000000536 complexating effect Effects 0.000 description 2
230000007774 longterm Effects 0.000 description 2
230000000873 masking effect Effects 0.000 description 2
238000005259 measurement Methods 0.000 description 2
238000001465 metallisation Methods 0.000 description 2
229960005419 nitrogen Drugs 0.000 description 2
229920001778 nylon Polymers 0.000 description 2
239000000123 paper Substances 0.000 description 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
235000013824 polyphenols Nutrition 0.000 description 2
239000010970 precious metal Substances 0.000 description 2
238000002203 pretreatment Methods 0.000 description 2
HBCQSNAFLVXVAY-UHFFFAOYSA-N pyrimidine-2-thiol Chemical class SC1=NC=CC=N1 HBCQSNAFLVXVAY-UHFFFAOYSA-N 0.000 description 2
230000036647 reaction Effects 0.000 description 2
230000002829 reductive effect Effects 0.000 description 2
CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
150000003557 thiazoles Chemical class 0.000 description 2
150000003852 triazoles Chemical class 0.000 description 2
APJYDQYYACXCRM-UHFFFAOYSA-N tryptamine Chemical compound C1=CC=C2C(CCN)=CNC2=C1 APJYDQYYACXCRM-UHFFFAOYSA-N 0.000 description 2
SMIXZZMSWYOQPW-UHFFFAOYSA-N (4-nitrophenyl)methylazanium;chloride Chemical compound [Cl-].[NH3+]CC1=CC=C([N+]([O-])=O)C=C1 SMIXZZMSWYOQPW-UHFFFAOYSA-N 0.000 description 1
JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
CEGDSRUGKSIHHO-UHFFFAOYSA-N 1,2-diaminoethane-1,1,2,2-tetrol Chemical compound NC(O)(O)C(N)(O)O CEGDSRUGKSIHHO-UHFFFAOYSA-N 0.000 description 1
BIGYLAKFCGVRAN-UHFFFAOYSA-N 1,3,4-thiadiazolidine-2,5-dithione Chemical compound S=C1NNC(=S)S1 BIGYLAKFCGVRAN-UHFFFAOYSA-N 0.000 description 1
BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
OGYGFUAIIOPWQD-UHFFFAOYSA-N 1,3-thiazolidine Chemical compound C1CSCN1 OGYGFUAIIOPWQD-UHFFFAOYSA-N 0.000 description 1
DRTQHJPVMGBUCF-UCVXFZOQSA-N 1-[(2s,3s,4s,5s)-3,4-dihydroxy-5-(hydroxymethyl)oxolan-2-yl]pyrimidine-2,4-dione Chemical compound O[C@H]1[C@H](O)[C@H](CO)O[C@@H]1N1C(=O)NC(=O)C=C1 DRTQHJPVMGBUCF-UCVXFZOQSA-N 0.000 description 1
HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Substances C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 description 1
KXZSVYHFYHTNBI-UHFFFAOYSA-N 1h-quinoline-2-thione Chemical class C1=CC=CC2=NC(S)=CC=C21 KXZSVYHFYHTNBI-UHFFFAOYSA-N 0.000 description 1
LLCOQBODWBFTDD-UHFFFAOYSA-N 1h-triazol-1-ium-4-thiolate Chemical class SC1=CNN=N1 LLCOQBODWBFTDD-UHFFFAOYSA-N 0.000 description 1
RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
FFNVQNRYTPFDDP-UHFFFAOYSA-N 2-cyanopyridine Chemical compound N#CC1=CC=CC=N1 FFNVQNRYTPFDDP-UHFFFAOYSA-N 0.000 description 1
BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical class CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
YNFBMDWHEHETJW-UHFFFAOYSA-N 2-pyridin-2-yl-1h-benzimidazole Chemical compound N1=CC=CC=C1C1=NC2=CC=CC=C2N1 YNFBMDWHEHETJW-UHFFFAOYSA-N 0.000 description 1
RSEBUVRVKCANEP-UHFFFAOYSA-N 2-pyrroline Chemical compound C1CC=CN1 RSEBUVRVKCANEP-UHFFFAOYSA-N 0.000 description 1
WPTCSQBWLUUYDV-UHFFFAOYSA-N 2-quinolin-2-ylquinoline Chemical compound C1=CC=CC2=NC(C3=NC4=CC=CC=C4C=C3)=CC=C21 WPTCSQBWLUUYDV-UHFFFAOYSA-N 0.000 description 1
KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
HDBQZGJWHMCXIL-UHFFFAOYSA-N 3,7-dihydropurine-2-thione Chemical class SC1=NC=C2NC=NC2=N1 HDBQZGJWHMCXIL-UHFFFAOYSA-N 0.000 description 1
OCVLSHAVSIYKLI-UHFFFAOYSA-N 3h-1,3-thiazole-2-thione Chemical class SC1=NC=CS1 OCVLSHAVSIYKLI-UHFFFAOYSA-N 0.000 description 1
UAPNUNDZDVNTDQ-UHFFFAOYSA-N 4,5-diphenyl-1,2,3-triazole Chemical compound C1=CC=CC=C1C1=NNN=C1C1=CC=CC=C1 UAPNUNDZDVNTDQ-UHFFFAOYSA-N 0.000 description 1
FQCDJLRGAZOBLD-UHFFFAOYSA-N 4-sulfanylidene-1h-quinazolin-2-one Chemical class C1=CC=C2C(=S)NC(=O)NC2=C1 FQCDJLRGAZOBLD-UHFFFAOYSA-N 0.000 description 1
NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 1
QEABJJFAUKWVNJ-UHFFFAOYSA-N 5-(disulfanyl)-1h-pyrazole Chemical class SSC1=CC=NN1 QEABJJFAUKWVNJ-UHFFFAOYSA-N 0.000 description 1
XVMSFILGAMDHEY-UHFFFAOYSA-N 6-(4-aminophenyl)sulfonylpyridin-3-amine Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=N1 XVMSFILGAMDHEY-UHFFFAOYSA-N 0.000 description 1
VABISHCLVYMGAU-UHFFFAOYSA-N 7,9-dihydropurine-8-thione Chemical compound N1=CN=C2NC(S)=NC2=C1 VABISHCLVYMGAU-UHFFFAOYSA-N 0.000 description 1
239000005725 8-Hydroxyquinoline Substances 0.000 description 1
BSFODEXXVBBYOC-UHFFFAOYSA-N 8-[4-(dimethylamino)butan-2-ylamino]quinolin-6-ol Chemical compound C1=CN=C2C(NC(CCN(C)C)C)=CC(O)=CC2=C1 BSFODEXXVBBYOC-UHFFFAOYSA-N 0.000 description 1
QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
229930024421 Adenine Natural products 0.000 description 1
XUKUURHRXDUEBC-KAYWLYCHSA-N Atorvastatin Chemical compound C=1C=CC=CC=1C1=C(C=2C=CC(F)=CC=2)N(CC[C@@H](O)C[C@@H](O)CC(O)=O)C(C(C)C)=C1C(=O)NC1=CC=CC=C1 XUKUURHRXDUEBC-KAYWLYCHSA-N 0.000 description 1
229920002799 BoPET Polymers 0.000 description 1
CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
239000005750 Copper hydroxide Substances 0.000 description 1
QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
239000005751 Copper oxide Substances 0.000 description 1
229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 1
RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 1
ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 1
QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 description 1
239000005041 Mylar™ Substances 0.000 description 1
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
229910019142 PO4 Inorganic materials 0.000 description 1
229930040373 Paraformaldehyde Natural products 0.000 description 1
RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
239000002202 Polyethylene glycol Substances 0.000 description 1
CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 description 1
206010070834 Sensitisation Diseases 0.000 description 1
229910008066 SnC12 Inorganic materials 0.000 description 1
DPOPAJRDYZGTIR-UHFFFAOYSA-N Tetrazine Chemical compound C1=CN=NN=N1 DPOPAJRDYZGTIR-UHFFFAOYSA-N 0.000 description 1
SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 description 1
BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical class ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
229940022663 acetate Drugs 0.000 description 1
229920006397 acrylic thermoplastic Polymers 0.000 description 1
XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
239000012190 activator Substances 0.000 description 1
229960000643 adenine Drugs 0.000 description 1
230000002411 adverse Effects 0.000 description 1
229920000180 alkyd Polymers 0.000 description 1
229910000147 aluminium phosphate Inorganic materials 0.000 description 1
150000001448 anilines Chemical class 0.000 description 1
229940111121 antirheumatic drug quinolines Drugs 0.000 description 1
239000002585 base Substances 0.000 description 1
238000009835 boiling Methods 0.000 description 1
AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
239000000920 calcium hydroxide Substances 0.000 description 1
229910001861 calcium hydroxide Inorganic materials 0.000 description 1
235000013877 carbamide Nutrition 0.000 description 1
HJMZMZRCABDKKV-UHFFFAOYSA-N carbonocyanidic acid Chemical compound OC(=O)C#N HJMZMZRCABDKKV-UHFFFAOYSA-N 0.000 description 1
239000003054 catalyst Substances 0.000 description 1
230000003197 catalytic effect Effects 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
239000013522 chelant Substances 0.000 description 1
BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
229910052804 chromium Inorganic materials 0.000 description 1
239000011651 chromium Substances 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
239000012459 cleaning agent Substances 0.000 description 1
239000000701 coagulant Substances 0.000 description 1
239000004020 conductor Substances 0.000 description 1
239000011889 copper foil Substances 0.000 description 1
229910001956 copper hydroxide Inorganic materials 0.000 description 1
229910000431 copper oxide Inorganic materials 0.000 description 1
ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
238000010790 dilution Methods 0.000 description 1
239000012895 dilution Substances 0.000 description 1
ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical class Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
238000001035 drying Methods 0.000 description 1
NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 description 1
238000005323 electroforming Methods 0.000 description 1
230000008030 elimination Effects 0.000 description 1
238000003379 elimination reaction Methods 0.000 description 1
125000003700 epoxy group Chemical group 0.000 description 1
230000006870 function Effects 0.000 description 1
239000000174 gluconic acid Substances 0.000 description 1
235000012208 gluconic acid Nutrition 0.000 description 1
239000004519 grease Substances 0.000 description 1
150000002357 guanidines Chemical class 0.000 description 1
150000004820 halides Chemical class 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
238000007654 immersion Methods 0.000 description 1
150000002475 indoles Chemical class 0.000 description 1
JXDYKVIHCLTXOP-UHFFFAOYSA-N isatin Chemical compound C1=CC=C2C(=O)C(=O)NC2=C1 JXDYKVIHCLTXOP-UHFFFAOYSA-N 0.000 description 1
239000005340 laminated glass Substances 0.000 description 1
LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
230000000670 limiting effect Effects 0.000 description 1
230000002101 lytic effect Effects 0.000 description 1
VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
239000000347 magnesium hydroxide Substances 0.000 description 1
229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
229910001510 metal chloride Inorganic materials 0.000 description 1
229910000000 metal hydroxide Inorganic materials 0.000 description 1
150000004692 metal hydroxides Chemical class 0.000 description 1
229910017604 nitric acid Inorganic materials 0.000 description 1
QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
239000000615 nonconductor Substances 0.000 description 1
238000010899 nucleation Methods 0.000 description 1
150000007524 organic acids Chemical class 0.000 description 1
229960003540 oxyquinoline Drugs 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
150000002940 palladium Chemical class 0.000 description 1
229920002866 paraformaldehyde Polymers 0.000 description 1
150000005041 phenanthrolines Chemical class 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
150000004986 phenylenediamines Chemical class 0.000 description 1
239000010452 phosphate Substances 0.000 description 1
229920002120 photoresistant polymer Polymers 0.000 description 1
229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
229920002492 poly(sulfone) Polymers 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
230000003334 potential effect Effects 0.000 description 1
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
238000004080 punching Methods 0.000 description 1
150000003212 purines Chemical class 0.000 description 1
150000003216 pyrazines Chemical class 0.000 description 1
150000003222 pyridines Chemical class 0.000 description 1
VTGOHKSTWXHQJK-UHFFFAOYSA-N pyrimidin-2-ol Chemical compound OC1=NC=CC=N1 VTGOHKSTWXHQJK-UHFFFAOYSA-N 0.000 description 1
ZVJHJDDKYZXRJI-UHFFFAOYSA-N pyrroline Natural products C1CC=NC1 ZVJHJDDKYZXRJI-UHFFFAOYSA-N 0.000 description 1
MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
150000003248 quinolines Chemical class 0.000 description 1
230000008313 sensitization Effects 0.000 description 1
239000002002 slurry Substances 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
239000011734 sodium Substances 0.000 description 1
VLDHWMAJBNWALQ-UHFFFAOYSA-M sodium;1,3-benzothiazol-3-ide-2-thione Chemical compound [Na+].C1=CC=C2SC([S-])=NC2=C1 VLDHWMAJBNWALQ-UHFFFAOYSA-M 0.000 description 1
239000002904 solvent Substances 0.000 description 1
241000894007 species Species 0.000 description 1
238000005507 spraying Methods 0.000 description 1
239000003381 stabilizer Substances 0.000 description 1
230000000087 stabilizing effect Effects 0.000 description 1
230000003068 static effect Effects 0.000 description 1
150000003440 styrenes Chemical class 0.000 description 1
239000000758 substrate Substances 0.000 description 1
150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
150000003892 tartrate salts Chemical class 0.000 description 1
ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
KSYNLCYTMRMCGG-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate;dihydrate Chemical compound O.O.[Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O KSYNLCYTMRMCGG-UHFFFAOYSA-J 0.000 description 1
150000003536 tetrazoles Chemical class 0.000 description 1
CBDKQYKMCICBOF-UHFFFAOYSA-N thiazoline Chemical compound C1CN=CS1 CBDKQYKMCICBOF-UHFFFAOYSA-N 0.000 description 1
HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
229910001174 tin-lead alloy Inorganic materials 0.000 description 1
229960004799 tryptophan Drugs 0.000 description 1
150000003672 ureas Chemical class 0.000 description 1
238000009736 wetting Methods 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)
Electroplating And Plating Baths Therefor (AREA)

CA000331706A 1978-09-13 1979-07-12 Electroless copper deposition process having faster plating rates Expired CA1135903A (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US94191278A	1978-09-13	1978-09-13
US941,912		1978-09-13

Publications (1)

Publication Number	Publication Date
CA1135903A true CA1135903A (en)	1982-11-23

Family

ID=25477278

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA000331706A Expired CA1135903A (en)	1978-09-13	1979-07-12	Electroless copper deposition process having faster plating rates

Country Status (17)

Country	Link
JP (2)	JPS5927379B2 (da)
AT (1)	AT366105B (da)
AU (1)	AU532144B2 (da)
BR (1)	BR7905066A (da)
CA (1)	CA1135903A (da)
CH (1)	CH646200A5 (da)
DE (1)	DE2937297C2 (da)
DK (1)	DK148920C (da)
ES (1)	ES484158A1 (da)
FR (1)	FR2436192A1 (da)
GB (1)	GB2032462B (da)
IL (1)	IL58202A (da)
IT (1)	IT1162420B (da)
MX (1)	MX152657A (da)
NL (1)	NL189523C (da)
SE (1)	SE7907531L (da)
ZA (1)	ZA793786B (da)

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NL8005024A (nl) *	1980-09-05	1982-04-01	Philips Nv	Werkwijze voor de vervaardiging van koperlegeringslagen en -patronen op substraten en de aldus vervaardigde produkten.
DE3585017D1 (de) *	1984-09-27	1992-02-06	Toshiba Kawasaki Kk	Stromlose kupferplattierloesung.
ES2039403T3 (es) *	1986-10-31	1993-10-01	Amp-Akzo Corporation (A Delaware Corp.)	Metodo para depositar sin electricidad cobre de alta calidad.
JPH0723539B2 (ja) *	1986-11-06	1995-03-15	日本電装株式会社	化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
US4814009A (en) *	1986-11-14	1989-03-21	Nippondenso Co., Ltd.	Electroless copper plating solution
JP2615682B2 (ja) *	1986-11-14	1997-06-04	株式会社デンソー	化学銅めっき液
AU3304389A (en) *	1988-04-29	1989-11-02	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2595319B2 (ja) *	1988-07-20	1997-04-02	日本電装株式会社	化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
JPH036383A (ja) *	1989-06-02	1991-01-11	Nippondenso Co Ltd	化学銅めっき液
JPH0448100A (ja) *	1990-06-15	1992-02-18	Nkk Corp	洗浄設備
US7905994B2 (en)	2007-10-03	2011-03-15	Moses Lake Industries, Inc.	Substrate holder and electroplating system
US8262894B2 (en)	2009-04-30	2012-09-11	Moses Lake Industries, Inc.	High speed copper plating bath
JP5255015B2 (ja) *	2010-04-28	2013-08-07	名古屋メッキ工業株式会社	高分子繊維の無電解銅めっき方法
JP5780920B2 (ja) *	2011-10-31	2015-09-16	新光電気工業株式会社	無電解銅めっき浴
US10590541B2 (en) *	2018-06-15	2020-03-17	Rohm And Haas Electronic Materials Llc	Electroless copper plating compositions and methods for electroless plating copper on substrates
US20190382901A1 (en) *	2018-06-15	2019-12-19	Rohm And Haas Electronic Materials Llc	Electroless copper plating compositions and methods for electroless plating copper on substrates
TWI906354B (zh) *	2020-08-27	2025-12-01	德商德國艾托特克公司	活化用於金屬化之非導電或含碳纖維基材之表面的方法
CN113881984B (zh) *	2021-10-21	2022-09-16	深圳市励高表面处理材料有限公司	一种脉冲电镀整平剂及制备方法和应用该整平液的电镀液
CN117385348A (zh) *	2023-09-11	2024-01-12	广东利尔化学有限公司	一种沉铜液以及稳定剂

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Publication number	Priority date	Publication date	Assignee	Title
US3222195A (en) *	1962-02-23	1965-12-07	Pearlstein Fred	Stabilized electroless copper solution
US3361580A (en) *	1963-06-18	1968-01-02	Day Company	Electroless copper plating
US3377174A (en) *	1963-10-24	1968-04-09	Torigai Eiichi	Method and bath for chemically plating copper
CH491206A (de) *	1966-02-01	1970-05-31	Photocircuits Corp	Badlösung zum stromlosen Abscheiden von Metallschichten
US3720525A (en) *	1971-08-16	1973-03-13	Rca Corp	Electroless copper plating solutions with accelerated plating rates
US3708329A (en) *	1971-09-10	1973-01-02	Bell Telephone Labor Inc	Electroless copper plating
US3915718A (en) *	1972-10-04	1975-10-28	Schering Ag	Chemical silver bath
US3793038A (en) *	1973-01-02	1974-02-19	Crown City Plating Co	Process for electroless plating
JPS5173933A (ja) *	1974-12-25	1976-06-26	Mitsubishi Rayon Co	Mudenkaidometsukyoku
JPS5746448B2 (da) *	1975-03-14	1982-10-04
JPS5217335A (en) *	1975-08-01	1977-02-09	Hitachi Ltd	Chemical copper plating solution
JPS5288227A (en) *	1976-01-19	1977-07-23	Hitachi Ltd	Chemical copper plating solution
IT1059950B (it) *	1976-04-30	1982-06-21	Alfachimici Spa	Composizione per la ramatura anelettrica autocatalitica
JPS56156749A (en) *	1980-05-08	1981-12-03	Toshiba Corp	Chemical copper plating solution

1979
- 1979-07-12 CA CA000331706A patent/CA1135903A/en not_active Expired
- 1979-07-24 ZA ZA00793786A patent/ZA793786B/xx unknown
- 1979-08-01 MX MX178747A patent/MX152657A/es unknown
- 1979-08-03 AU AU49567/79A patent/AU532144B2/en not_active Ceased
- 1979-08-07 BR BR7905066A patent/BR7905066A/pt not_active IP Right Cessation
- 1979-09-05 GB GB7930740A patent/GB2032462B/en not_active Expired
- 1979-09-07 IL IL58202A patent/IL58202A/xx unknown
- 1979-09-11 IT IT50227/79A patent/IT1162420B/it active
- 1979-09-11 SE SE7907531A patent/SE7907531L/ unknown
- 1979-09-12 CH CH826779A patent/CH646200A5/de not_active IP Right Cessation
- 1979-09-12 DK DK381979A patent/DK148920C/da not_active IP Right Cessation
- 1979-09-12 AT AT0600879A patent/AT366105B/de not_active IP Right Cessation
- 1979-09-12 DE DE2937297A patent/DE2937297C2/de not_active Expired
- 1979-09-13 FR FR7922867A patent/FR2436192A1/fr active Granted
- 1979-09-13 NL NLAANVRAGE7906856,A patent/NL189523C/xx not_active IP Right Cessation
- 1979-09-13 ES ES484158A patent/ES484158A1/es not_active Expired
- 1979-09-13 JP JP54118651A patent/JPS5927379B2/ja not_active Expired
1983
- 1983-06-21 JP JP58112590A patent/JPS5915981B2/ja not_active Expired

Also Published As

Publication number	Publication date
AT366105B (de)	1982-03-10
DK148920B (da)	1985-11-18
NL7906856A (nl)	1980-03-17
CH646200A5 (de)	1984-11-15
JPS5565355A (en)	1980-05-16
JPS5927379B2 (ja)	1984-07-05
NL189523C (nl)	1993-05-03
IL58202A0 (en)	1979-12-30
MX152657A (es)	1985-10-07
AU532144B2 (en)	1983-09-22
ZA793786B (en)	1980-07-30
GB2032462A (en)	1980-05-08
DE2937297C2 (de)	1982-04-08
IL58202A (en)	1982-08-31
IT7950227A0 (it)	1979-09-11
ES484158A1 (es)	1980-09-01
GB2032462B (en)	1983-05-18
DK148920C (da)	1986-05-05
SE7907531L (sv)	1980-03-14
FR2436192A1 (fr)	1980-04-11
DE2937297A1 (de)	1980-03-20
JPS5925965A (ja)	1984-02-10
AU4956779A (en)	1980-03-20
FR2436192B1 (da)	1983-08-26
DK381979A (da)	1980-03-14
JPS5915981B2 (ja)	1984-04-12
ATA600879A (de)	1981-07-15
IT1162420B (it)	1987-04-01
BR7905066A (pt)	1980-04-29

Legal Events

Date	Code	Title	Description
1999-11-23	MKEX	Expiry

Publication	Publication Date	Title
US4301196A (en)	1981-11-17	Electroless copper deposition process having faster plating rates
GB2032462A (en)	1980-05-08	Electroless Copper Deposition at Faster Rates
EP0797690B1 (en)	1999-08-11	Printed circuit board manufacture
EP3351657B1 (en)	2019-12-11	Electroless copper plating compositions
KR101078136B1 (ko)	2011-10-28	침지 도금용 산성 수용액, 및 알루미늄 및 알루미늄 합금상에서의 도금 방법
US5250105A (en)	1993-10-05	Selective process for printing circuit board manufacturing
US4265943A (en)	1981-05-05	Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
US3917885A (en)	1975-11-04	Electroless gold plating process
US4279948A (en)	1981-07-21	Electroless copper deposition solution using a hypophosphite reducing agent
CA2502672A1 (en)	2004-11-25	Aqueous alkaline zincate solutions and methods
EP0133800B1 (en)	1987-11-04	Electroless copper plating solution
US4325990A (en)	1982-04-20	Electroless copper deposition solutions with hypophosphite reducing agent
EP0221265B1 (en)	1990-01-24	Process for determining the plating activity of an electroless plating bath
EP0331907B1 (en)	1992-08-26	Electroless copper plating bath
KR101314035B1 (ko)	2013-10-02	자기 촉매적 무전해 공정들의 안정성 및 수행
US4459184A (en)	1984-07-10	Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential
US4239538A (en)	1980-12-16	Catalytic primer
JP3152008B2 (ja)	2001-04-03	無電解金めっき液
Piatti et al.	1989	Study of the influence of additives on electroless copper deposition by gravimetric and microdensitometric techniques
AU547410B2 (en)	1985-10-17	Method for continuous metal deposition from a non- autocatalytic electroless plating bath using electric potential
EP0096034B1 (en)	1986-09-10	Electroless copper deposition solutions
CA1163056A (en)	1984-03-06	Electroless copper deposition solutions
JPH06322548A (ja)	1994-11-22	化学銅めっき液、化学銅めっき方法および配線基板の製造方法
EP0228664A1 (en)	1987-07-15	Copper deposition from electroless plating bath
HK1002869B (en)	2000-04-28	Printed circuit board manufacture