CA1153128A - Circuits electriques - Google Patents

Circuits electriques

Info

Publication number
CA1153128A
CA1153128A CA000375824A CA375824A CA1153128A CA 1153128 A CA1153128 A CA 1153128A CA 000375824 A CA000375824 A CA 000375824A CA 375824 A CA375824 A CA 375824A CA 1153128 A CA1153128 A CA 1153128A
Authority
CA
Canada
Prior art keywords
aluminium
layer
circuit assembly
thin
highly conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000375824A
Other languages
English (en)
Inventor
Jonathan L. Evans
John M. Morrison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Application granted granted Critical
Publication of CA1153128A publication Critical patent/CA1153128A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CA000375824A 1980-04-22 1981-04-21 Circuits electriques Expired CA1153128A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8013163 1980-04-22
GB80.13163 1980-04-22

Publications (1)

Publication Number Publication Date
CA1153128A true CA1153128A (fr) 1983-08-30

Family

ID=10512920

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000375824A Expired CA1153128A (fr) 1980-04-22 1981-04-21 Circuits electriques

Country Status (4)

Country Link
CA (1) CA1153128A (fr)
DE (1) DE3115856A1 (fr)
FR (1) FR2481006A1 (fr)
NL (1) NL8101979A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3704200A1 (de) * 1987-02-11 1988-08-25 Bbc Brown Boveri & Cie Verfahren zur herstellung einer verbindung zwischen einem bonddraht und einer kontaktflaeche bei hybriden dickschicht-schaltkreisen
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
KR930011143A (ko) * 1991-11-14 1993-06-23 김광호 반도체장치 및 그 제조방법
DE102023204303A1 (de) 2023-05-10 2024-11-14 Mahle International Gmbh Sinterpaste, Verfahren zum elektrisch leitenden, stoffschlüssigen Verbinden eines oxidschichtbedeckten Aluminiumleiters mit einem elektronischen Bauteil sowie elektronisches Produkt

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4035526A (en) * 1975-08-20 1977-07-12 General Motors Corporation Evaporated solderable multilayer contact for silicon semiconductor
DE2631810C3 (de) * 1976-07-15 1979-03-15 Deutsche Itt Industries Gmbh, 7800 Freiburg Planares Halbleiterbauelement
DD135339A3 (de) * 1977-03-07 1979-05-02 Juergen Henneberger Bondfaehiges schichtsystem in duennfilmtechnik fuer hybridschaltkreise

Also Published As

Publication number Publication date
DE3115856A1 (de) 1982-01-21
FR2481006A1 (fr) 1981-10-23
NL8101979A (nl) 1981-11-16

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Legal Events

Date Code Title Description
MKEX Expiry