CA1269596A - Dispositif de montage de puces et dispositif de montage de supports de puce - Google Patents
Dispositif de montage de puces et dispositif de montage de supports de puceInfo
- Publication number
- CA1269596A CA1269596A CA000539855A CA539855A CA1269596A CA 1269596 A CA1269596 A CA 1269596A CA 000539855 A CA000539855 A CA 000539855A CA 539855 A CA539855 A CA 539855A CA 1269596 A CA1269596 A CA 1269596A
- Authority
- CA
- Canada
- Prior art keywords
- solder
- tape
- support
- preform
- molten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000539855A CA1269596A (fr) | 1983-06-30 | 1987-06-16 | Dispositif de montage de puces et dispositif de montage de supports de puce |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/509,684 US4664309A (en) | 1983-06-30 | 1983-06-30 | Chip mounting device |
| US06/610,077 US4705205A (en) | 1983-06-30 | 1984-05-14 | Chip carrier mounting device |
| US610,077 | 1984-05-14 | ||
| CA000457810A CA1226679A (fr) | 1983-06-30 | 1984-06-29 | Dispositif de fixation de puce et dispositif de fixation de support de puce |
| CA000539855A CA1269596A (fr) | 1983-06-30 | 1987-06-16 | Dispositif de montage de puces et dispositif de montage de supports de puce |
| US509,684 | 1990-04-13 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000457810A Division CA1226679A (fr) | 1983-06-30 | 1984-06-29 | Dispositif de fixation de puce et dispositif de fixation de support de puce |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1269596A true CA1269596A (fr) | 1990-05-29 |
Family
ID=27167453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000539855A Expired - Lifetime CA1269596A (fr) | 1983-06-30 | 1987-06-16 | Dispositif de montage de puces et dispositif de montage de supports de puce |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1269596A (fr) |
-
1987
- 1987-06-16 CA CA000539855A patent/CA1269596A/fr not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4705205A (en) | Chip carrier mounting device | |
| US4664309A (en) | Chip mounting device | |
| CA2147398C (fr) | Points de soudure pour interconnection de circuits | |
| AU661867B2 (en) | Plated compliant lead | |
| US6828661B2 (en) | Lead frame and a resin-sealed semiconductor device exhibiting improved resin balance, and a method for manufacturing the same | |
| US7014094B2 (en) | Method of reforming reformable members of an electronic package and the resultant electronic package | |
| US4920074A (en) | Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof | |
| US5852871A (en) | Method of making raised contacts on electronic components | |
| US5639696A (en) | Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array | |
| US5894984A (en) | Structure of electronic parts and method of soldering electronic parts to substrate | |
| EP0147576A1 (fr) | Procédé pour former des connexions allongées par brassage entre un élément semiconducteur et un substrat porteur | |
| DE1025587T1 (de) | Halbleiter-flipchippackung und herstellungsverfahren dafür | |
| US7304376B2 (en) | Microelectronic assemblies with springs | |
| US6891255B2 (en) | Microelectronic packages having an array of resilient leads | |
| US6462425B1 (en) | Semiconductor device and manufacturing method thereof | |
| JP3081559B2 (ja) | ボールグリッドアレイ型半導体装置およびその製造方法ならびに電子装置 | |
| US4402450A (en) | Adapting contacts for connection thereto | |
| US6018197A (en) | Wired board with improved bonding pads | |
| US4903889A (en) | Connection to a component for use in an electronics assembly | |
| CA1301369C (fr) | Boitier hermetique a reseau de broches matriciel | |
| EP0361283B1 (fr) | Dispositif semi-conducteur du type à encapsulation en résine et son procédé de fabrication | |
| JPS6041780A (ja) | チツプあるいはチツプキヤリヤ−の取付装置 | |
| US6989591B1 (en) | Method for making an integrated circuit of the surface-mount type and resulting circuit | |
| EP0795200B1 (fr) | Montage de composants electroniques sur une carte a circuits imprimees | |
| KR20140126136A (ko) | 반도체 제조 기술을 이용한 퓨즈의 제조 방법 및 이에 따른 퓨즈 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |