CA1283574C - Methode de configuration de la resine photosensible dans la fabrication des cartes de circuits - Google Patents

Methode de configuration de la resine photosensible dans la fabrication des cartes de circuits

Info

Publication number: CA1283574C
Authority: CA; Canada
Prior art keywords: film; layer; substrate; photoprocessable; radiation
Prior art date: 1986-12-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

CA000525982A

Other languages

English (en)

Inventor

Harold Lake

Paul E. Grandmont

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Schneider Electric Systems USA Inc

Original Assignee

Foxboro Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-12-22

Filing date

1986-12-22

Publication date

1991-04-30

1986-12-22 Application filed by Foxboro Co filed Critical Foxboro Co

1986-12-22 Priority to CA000525982A priority Critical patent/CA1283574C/fr

1991-04-30 Application granted granted Critical

1991-04-30 Publication of CA1283574C publication Critical patent/CA1283574C/fr

2008-04-30 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

238000000034 method Methods 0.000 title claims abstract description 53
238000000059 patterning Methods 0.000 title claims abstract description 12
238000011065 in-situ storage Methods 0.000 claims abstract description 20
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 11
238000012545 processing Methods 0.000 claims abstract description 11
229910052709 silver Inorganic materials 0.000 claims abstract description 11
239000004332 silver Substances 0.000 claims abstract description 11
239000000758 substrate Substances 0.000 claims description 73
239000004020 conductor Substances 0.000 claims description 38
230000005855 radiation Effects 0.000 claims description 28
239000002184 metal Substances 0.000 claims description 23
229910052751 metal Inorganic materials 0.000 claims description 23
239000002131 composite material Substances 0.000 claims description 21
238000004519 manufacturing process Methods 0.000 claims description 21
229910000679 solder Inorganic materials 0.000 claims description 16
239000000463 material Substances 0.000 claims description 15
239000000839 emulsion Substances 0.000 claims description 14
238000001228 spectrum Methods 0.000 claims description 14
239000011888 foil Substances 0.000 claims description 10
238000003384 imaging method Methods 0.000 claims description 9
238000007747 plating Methods 0.000 claims description 5
238000009713 electroplating Methods 0.000 claims description 4
238000010030 laminating Methods 0.000 claims description 4
238000005530 etching Methods 0.000 claims description 3
238000005253 cladding Methods 0.000 claims 6
229920002120 photoresistant polymer Polymers 0.000 abstract description 12
238000000576 coating method Methods 0.000 abstract description 4
239000010408 film Substances 0.000 description 73
239000010410 layer Substances 0.000 description 56
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 23
229910052802 copper Inorganic materials 0.000 description 19
239000010949 copper Substances 0.000 description 19
238000011161 development Methods 0.000 description 5
230000008901 benefit Effects 0.000 description 4
239000011889 copper foil Substances 0.000 description 4
238000013461 design Methods 0.000 description 4
238000005516 engineering process Methods 0.000 description 4
239000011229 interlayer Substances 0.000 description 4
239000004593 Epoxy Substances 0.000 description 3
239000011248 coating agent Substances 0.000 description 3
239000011152 fibreglass Substances 0.000 description 3
239000000126 substance Substances 0.000 description 3
238000007792 addition Methods 0.000 description 2
238000004140 cleaning Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000007772 electroless plating Methods 0.000 description 2
230000001965 increasing effect Effects 0.000 description 2
230000010354 integration Effects 0.000 description 2
238000006116 polymerization reaction Methods 0.000 description 2
239000012808 vapor phase Substances 0.000 description 2
241000256844 Apis mellifera Species 0.000 description 1
230000004888 barrier function Effects 0.000 description 1
230000003197 catalytic effect Effects 0.000 description 1
238000012822 chemical development Methods 0.000 description 1
239000002872 contrast media Substances 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
238000000280 densification Methods 0.000 description 1
230000003292 diminished effect Effects 0.000 description 1
238000001035 drying Methods 0.000 description 1
239000000428 dust Substances 0.000 description 1
-1 e.g. Substances 0.000 description 1
230000008030 elimination Effects 0.000 description 1
238000003379 elimination reaction Methods 0.000 description 1
230000002708 enhancing effect Effects 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000005098 hot rolling Methods 0.000 description 1
238000007654 immersion Methods 0.000 description 1
238000007689 inspection Methods 0.000 description 1
239000011810 insulating material Substances 0.000 description 1
239000012212 insulator Substances 0.000 description 1
238000001259 photo etching Methods 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
239000007787 solid Substances 0.000 description 1
238000003860 storage Methods 0.000 description 1
239000010409 thin film Substances 0.000 description 1
230000001960 triggered effect Effects 0.000 description 1
229910052724 xenon Inorganic materials 0.000 description 1
FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1

Landscapes

Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Manufacturing Of Printed Circuit Boards (AREA)

CA000525982A 1986-12-22 1986-12-22 Methode de configuration de la resine photosensible dans la fabrication des cartes de circuits Expired - Lifetime CA1283574C (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
CA000525982A CA1283574C (fr)	1986-12-22	1986-12-22	Methode de configuration de la resine photosensible dans la fabrication des cartes de circuits

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CA000525982A CA1283574C (fr)	1986-12-22	1986-12-22	Methode de configuration de la resine photosensible dans la fabrication des cartes de circuits

Publications (1)

Publication Number	Publication Date
CA1283574C true CA1283574C (fr)	1991-04-30

Family

ID=4134609

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA000525982A Expired - Lifetime CA1283574C (fr)	1986-12-22	1986-12-22	Methode de configuration de la resine photosensible dans la fabrication des cartes de circuits

Country Status (1)

Country	Link
CA (1)	CA1283574C (fr)

1986
- 1986-12-22 CA CA000525982A patent/CA1283574C/fr not_active Expired - Lifetime

Legal Events

Date	Code	Title	Description
2000-05-01	MKLA	Lapsed

Publication	Publication Date	Title
US4666818A (en)	1987-05-19	Method of patterning resist for printed wiring board
US5015553A (en)	1991-05-14	Method of patterning resist
US4775611A (en)	1988-10-04	Additive printed circuit boards with flat surface and indented primary wiring conductors
US4961259A (en)	1990-10-09	Method of forming an interconnection by an excimer laser
US5384230A (en)	1995-01-24	Process for fabricating printed circuit boards
US5464662A (en)	1995-11-07	Fabrication method of printed wiring board
JPH06216479A (ja)	1994-08-05	プリント回路基板とその製造方法
US5254435A (en)	1993-10-19	Method of patterning resist
US3547629A (en)	1970-12-15	Photoflash method of transferring information and fabricating printed circuits
JP3031042B2 (ja)	2000-04-10	表面実装用プリント配線板
JPH0537140A (ja)	1993-02-12	プリント配線板の製造方法
AU612563B2 (en)	1991-07-18	Method of patterning resist for printed wiring board
EP0346355B1 (fr)	1994-05-04	Structure composite photoprocessable
US6579660B1 (en)	2003-06-17	Process for direct digital printing of circuit boards
CN1021874C (zh)	1993-08-18	印刷线路板的图形抗蚀法
JPH11274698A (ja)	1999-10-08	プリント配線板の製造方法
JPH09312463A (ja)	1997-12-02	パターンの形成方法
JP3657168B2 (ja)	2005-06-08	多層プリント配線板の製造方法
US4560639A (en)	1985-12-24	Reusable phototransparency image forming tools for direct contact printing
JPH03288424A (ja)	1991-12-18	回路作製用レジスト層
JPS62114288A (ja)	1987-05-26	印刷配線板の製造方法
JPH04326588A (ja)	1992-11-16	印刷配線板の製造方法
JPH09142052A (ja)	1997-06-03	スクリーン版およびその製造方法とそれを用いたプリント配線板の製造方法
GB2202093A (en)	1988-09-14	Making printed circuit boards
JPH04364089A (ja)	1992-12-16	プリント配線板の製造方法