CA1311855C - Methode et appareil pour mettre sous boitier et refroidir les puces de circuits integres - Google Patents

Methode et appareil pour mettre sous boitier et refroidir les puces de circuits integres

Info

Publication number
CA1311855C
CA1311855C CA000592263A CA592263A CA1311855C CA 1311855 C CA1311855 C CA 1311855C CA 000592263 A CA000592263 A CA 000592263A CA 592263 A CA592263 A CA 592263A CA 1311855 C CA1311855 C CA 1311855C
Authority
CA
Canada
Prior art keywords
assembly
heat sink
base
chips
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA000592263A
Other languages
English (en)
Inventor
Leslie R. Fox
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Digital Equipment Corp
Original Assignee
Digital Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Equipment Corp filed Critical Digital Equipment Corp
Application granted granted Critical
Publication of CA1311855C publication Critical patent/CA1311855C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/233—Arrangements for cooling characterised by their places of attachment or cooling paths attached to chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CA000592263A 1988-03-01 1989-02-28 Methode et appareil pour mettre sous boitier et refroidir les puces de circuits integres Expired - Fee Related CA1311855C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16267188A 1988-03-01 1988-03-01
US162,671 1988-03-01

Publications (1)

Publication Number Publication Date
CA1311855C true CA1311855C (fr) 1992-12-22

Family

ID=22586637

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000592263A Expired - Fee Related CA1311855C (fr) 1988-03-01 1989-02-28 Methode et appareil pour mettre sous boitier et refroidir les puces de circuits integres

Country Status (4)

Country Link
EP (1) EP0357747A1 (fr)
JP (1) JPH02501178A (fr)
CA (1) CA1311855C (fr)
WO (1) WO1989008327A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
US5003429A (en) * 1990-07-09 1991-03-26 International Business Machines Corporation Electronic assembly with enhanced heat sinking
DE69112389T2 (de) * 1991-06-06 1996-03-21 Ibm Elektronischer Packungsmodul.
DE4210835C1 (fr) * 1992-04-01 1993-06-17 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
DE4210834C2 (de) * 1992-04-01 1995-10-05 Siemens Nixdorf Inf Syst Einrichtung zum Kühlen von zu Flachbaugruppen zusammengefaßten gehäuselosen filmmontierten integrierten Bausteinen
DE4217597C2 (de) * 1992-05-27 1994-09-08 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte gehäuselose Bausteine
US6035523A (en) * 1995-06-16 2000-03-14 Apple Computer, Inc. Method and apparatus for supporting a component on a substrate
JPH10335579A (ja) * 1997-05-27 1998-12-18 Toshiba Corp 大電力半導体モジュール装置
US9554488B2 (en) * 2014-04-18 2017-01-24 Raytheon Company Method to align surface mount packages for thermal enhancement
CN112083776A (zh) * 2020-09-17 2020-12-15 西安超越申泰信息科技有限公司 一种计算机芯片导热硅脂的安装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3234451A (en) * 1962-01-05 1966-02-08 Int Rectifier Corp High power rectifier structure
US4449580A (en) * 1981-06-30 1984-05-22 International Business Machines Corporation Vertical wall elevated pressure heat dissipation system
EP0103068B1 (fr) * 1982-09-09 1989-01-04 Siemens Aktiengesellschaft Dispositif de refroidissement pour une pluralité de composants intégrés, assemblés comme structure plane
JPS614255A (ja) * 1984-06-19 1986-01-10 Nec Corp 集積回路パツケ−ジ

Also Published As

Publication number Publication date
EP0357747A1 (fr) 1990-03-14
JPH02501178A (ja) 1990-04-19
WO1989008327A1 (fr) 1989-09-08

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Legal Events

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