CA2004131C - A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism - Google Patents

A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism Download PDF

Info

Publication number: CA2004131C
Authority: CA; Canada
Prior art keywords: epoxy; aziridine; polyester; adhesive material; component
Prior art date: 1989-11-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

CA 2004131

Other languages

English (en)

French (fr)

Other versions

CA2004131A1 (en

Inventor

Thomas F. Gardeski

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

CPFilms Inc

Original Assignee

CPFilms Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-11-29

Filing date

1989-11-29

Publication date

2001-04-17

1989-11-29 Application filed by CPFilms Inc filed Critical CPFilms Inc

1989-11-29 Priority to CA 2004131 priority Critical patent/CA2004131C/en

1989-12-04 Priority to JP31513189A priority patent/JP2828290B2/ja

1991-05-29 Publication of CA2004131A1 publication Critical patent/CA2004131A1/en

2001-04-17 Application granted granted Critical

2001-04-17 Publication of CA2004131C publication Critical patent/CA2004131C/en

2009-11-29 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

239000004593 Epoxy Substances 0.000 title claims abstract description 60
239000000853 adhesive Substances 0.000 title claims abstract description 38
230000001070 adhesive effect Effects 0.000 title claims abstract description 38
229920000728 polyester Polymers 0.000 claims abstract description 43
239000000463 material Substances 0.000 claims abstract description 39
NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 claims abstract description 37
229920001721 polyimide Polymers 0.000 claims abstract description 6
238000000034 method Methods 0.000 claims description 18
229920003986 novolac Polymers 0.000 claims description 17
239000000203 mixture Substances 0.000 claims description 16
239000000758 substrate Substances 0.000 claims description 16
239000002131 composite material Substances 0.000 claims description 10
239000011888 foil Substances 0.000 claims description 10
VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 10
239000004035 construction material Substances 0.000 claims description 7
229920005989 resin Polymers 0.000 claims description 7
239000011347 resin Substances 0.000 claims description 7
239000007983 Tris buffer Substances 0.000 claims description 5
239000011248 coating agent Substances 0.000 claims description 5
238000000576 coating method Methods 0.000 claims description 5
XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims description 4
239000002253 acid Substances 0.000 claims description 4
150000001732 carboxylic acid derivatives Chemical group 0.000 claims description 4
125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
239000000047 product Substances 0.000 claims 13
LJBWJFWNFUKAGS-UHFFFAOYSA-N 2-[bis(2-hydroxyphenyl)methyl]phenol Chemical compound OC1=CC=CC=C1C(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LJBWJFWNFUKAGS-UHFFFAOYSA-N 0.000 claims 4
239000007795 chemical reaction product Substances 0.000 claims 4
125000001931 aliphatic group Chemical group 0.000 claims 3
125000003118 aryl group Chemical group 0.000 claims 3
150000001875 compounds Chemical class 0.000 claims 3
150000002009 diols Chemical class 0.000 claims 3
238000002844 melting Methods 0.000 claims 3
230000008018 melting Effects 0.000 claims 3
150000005846 sugar alcohols Polymers 0.000 claims 3
238000010438 heat treatment Methods 0.000 claims 2
238000004519 manufacturing process Methods 0.000 claims 1
239000002184 metal Substances 0.000 claims 1
238000012545 processing Methods 0.000 abstract description 5
239000006227 byproduct Substances 0.000 abstract description 3
230000007613 environmental effect Effects 0.000 abstract description 3
238000010030 laminating Methods 0.000 abstract description 2
239000002904 solvent Substances 0.000 abstract description 2
239000011810 insulating material Substances 0.000 abstract 1
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
239000007787 solid Substances 0.000 description 6
YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 5
229920000647 polyepoxide Polymers 0.000 description 4
238000010276 construction Methods 0.000 description 3
230000018109 developmental process Effects 0.000 description 3
125000003700 epoxy group Chemical group 0.000 description 3
229910000679 solder Inorganic materials 0.000 description 3
239000000126 substance Substances 0.000 description 3
YCIHPQHVWDULOY-FMZCEJRJSA-N (4s,4as,5as,6s,12ar)-4-(dimethylamino)-1,6,10,11,12a-pentahydroxy-6-methyl-3,12-dioxo-4,4a,5,5a-tetrahydrotetracene-2-carboxamide;hydrochloride Chemical compound Cl.C1=CC=C2[C@](O)(C)[C@H]3C[C@H]4[C@H](N(C)C)C(=O)C(C(N)=O)=C(O)[C@@]4(O)C(=O)C3=C(O)C2=C1O YCIHPQHVWDULOY-FMZCEJRJSA-N 0.000 description 2
229910014033 C-OH Inorganic materials 0.000 description 2
229910014570 C—OH Inorganic materials 0.000 description 2
239000004642 Polyimide Substances 0.000 description 2
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
239000012456 homogeneous solution Substances 0.000 description 2
KFZMGEQAYNKOFK-UHFFFAOYSA-N isopropyl alcohol Natural products CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
239000013500 performance material Substances 0.000 description 2
229920013683 Celanese Polymers 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
KAPCRJOPWXUMSQ-UHFFFAOYSA-N [2,2-bis[3-(aziridin-1-yl)propanoyloxymethyl]-3-hydroxypropyl] 3-(aziridin-1-yl)propanoate Chemical compound C1CN1CCC(=O)OCC(COC(=O)CCN1CC1)(CO)COC(=O)CCN1CC1 KAPCRJOPWXUMSQ-UHFFFAOYSA-N 0.000 description 1
238000007792 addition Methods 0.000 description 1
230000032683 aging Effects 0.000 description 1
238000010924 continuous production Methods 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
210000000569 greater omentum Anatomy 0.000 description 1
229960004592 isopropanol Drugs 0.000 description 1
229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
229920001225 polyester resin Polymers 0.000 description 1
239000004645 polyester resin Substances 0.000 description 1
238000007763 reverse roll coating Methods 0.000 description 1
239000011877 solvent mixture Substances 0.000 description 1
UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1

Landscapes

Adhesives Or Adhesive Processes (AREA)
Polyesters Or Polycarbonates (AREA)
Epoxy Resins (AREA)
Laminated Bodies (AREA)

CA 2004131 1989-11-29 1989-11-29 A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism Expired - Fee Related CA2004131C (en)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
CA 2004131 CA2004131C (en)	1989-11-29	1989-11-29	A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism
JP31513189A JP2828290B2 (ja)	1989-11-29	1989-12-04	エポキシをベースとし熱活性化硬化メカニズムを有する高性能のカバーレイ及びボンドプライ接着剤

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CA 2004131 CA2004131C (en)	1989-11-29	1989-11-29	A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism

Publications (2)

Publication Number	Publication Date
CA2004131A1 CA2004131A1 (en)	1991-05-29
CA2004131C true CA2004131C (en)	2001-04-17

Family

ID=4143658

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA 2004131 Expired - Fee Related CA2004131C (en)	1989-11-29	1989-11-29	A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism

Country Status (2)

Country	Link
JP (1)	JP2828290B2 (ja)
CA (1)	CA2004131C (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP3632964B1 (en)	2018-10-03	2022-09-28	3M Innovative Properties Company	Curable precursor of a structural adhesive composition
EP3719090A1 (en) *	2019-04-02	2020-10-07	3M Innovative Properties Company	Elastic one-part structural adhesive tape

1989
- 1989-11-29 CA CA 2004131 patent/CA2004131C/en not_active Expired - Fee Related
- 1989-12-04 JP JP31513189A patent/JP2828290B2/ja not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CA2004131A1 (en)	1991-05-29
JP2828290B2 (ja)	1998-11-25
JPH03182583A (ja)	1991-08-08

Legal Events

Date	Code	Title	Description
1996-11-27	EEER	Examination request
2002-11-29	MKLA	Lapsed

Publication	Publication Date	Title
US6054509A (en)	2000-04-25	Adhesive of epoxy resin, nitrile rubbers and curing agent
KR20020003818A (ko)	2002-01-15	가요성 인쇄 배선용 기판
EP0676435A1 (en)	1995-10-11	Epoxy adhesives and copper foils and copper clad laminates using same
US5194307A (en)	1993-03-16	High performance epoxy based coverlay and bond fly adhesive with heat activated cure mechanism
EP0989788A2 (en)	2000-03-29	Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board
US20010018122A1 (en)	2001-08-30	Adhesive composition
US5095077A (en)	1992-03-10	High performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism using polyester-aziridine reaction products
CA2004131C (en)	2001-04-17	A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism
EP0436745B1 (en)	1994-06-15	A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism
WO1997031078A1 (en)	1997-08-28	Polyamide based laminating, coverlay, and bond ply adhesive with heat activated cure component
JPS6262880A (ja)	1987-03-19	フレキシブル印刷配線板用接着剤組成物
JP2722402B2 (ja)	1998-03-04	フレキシブル印刷回路基板用の接着剤組成物
JP2002080812A (ja)	2002-03-22	接着剤組成物、フレキシブル印刷配線用基板及びカバーレイフィルム
JPS61183374A (ja)	1986-08-16	フレキシブル印刷配線板用接着剤組成物
JPS63297483A (ja)	1988-12-05	フレキシブル印刷回路基板用接着剤組成物
JPH0552872B2 (ja)	1993-08-06
JPS61138680A (ja)	1986-06-26	フレキシブル印刷回路用基板
JPS61183373A (ja)	1986-08-16	フレキシブル印刷配線板用接着剤組成物
JPS61195115A (ja)	1986-08-29	フレキシブル印刷配線板用接着剤組成物
JPS588773A (ja)	1983-01-18	接着用組成物
EP0436746B1 (en)	1996-06-12	Process of manufacture for high performance epoxy based laminating adhesives
JPS6146026B2 (ja)	1986-10-11
JPH01173687A (ja)	1989-07-10	フレキシブルプリント回路用基板
JPS6381139A (ja)	1988-04-12	接着用プリプレグ
CA2004130A1 (en)	1991-05-29	High performance epoxy based laminating adhesive