CA2008284A1 - Substrat de ceramique avec barrage de soudure sur le modele de connexion - Google Patents

Substrat de ceramique avec barrage de soudure sur le modele de connexion

Info

Publication number
CA2008284A1
CA2008284A1 CA2008284A CA2008284A CA2008284A1 CA 2008284 A1 CA2008284 A1 CA 2008284A1 CA 2008284 A CA2008284 A CA 2008284A CA 2008284 A CA2008284 A CA 2008284A CA 2008284 A1 CA2008284 A1 CA 2008284A1
Authority
CA
Canada
Prior art keywords
solder
dam
connecting pattern
ceramic substrate
layer ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2008284A
Other languages
English (en)
Other versions
CA2008284C (fr
Inventor
Kazuaki Satou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2008284A1 publication Critical patent/CA2008284A1/fr
Application granted granted Critical
Publication of CA2008284C publication Critical patent/CA2008284C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CA002008284A 1989-01-24 1990-01-22 Substrat de ceramique avec barrage de soudure sur le modele de connexion Expired - Fee Related CA2008284C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP01-013211 1989-01-24
JP1013211A JPH0632367B2 (ja) 1989-01-24 1989-01-24 セラミック基板のｉ／ｏパッドの形成方法

Publications (2)

Publication Number Publication Date
CA2008284A1 true CA2008284A1 (fr) 1990-07-24
CA2008284C CA2008284C (fr) 1994-02-22

Family

ID=11826821

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002008284A Expired - Fee Related CA2008284C (fr) 1989-01-24 1990-01-22 Substrat de ceramique avec barrage de soudure sur le modele de connexion

Country Status (5)

Country Link
US (1) US5061552A (fr)
EP (1) EP0380289B1 (fr)
JP (1) JPH0632367B2 (fr)
CA (1) CA2008284C (fr)
DE (1) DE69031394D1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436412A (en) * 1992-10-30 1995-07-25 International Business Machines Corporation Interconnect structure having improved metallization
TW253856B (en) * 1994-12-13 1995-08-11 At & T Corp Method of solder bonding, and article produced by the method
US6300678B1 (en) 1997-10-03 2001-10-09 Fujitsu Limited I/O pin having solder dam for connecting substrates
US6037044A (en) * 1998-01-08 2000-03-14 International Business Machines Corporation Direct deposit thin film single/multi chip module
US6902098B2 (en) * 2001-04-23 2005-06-07 Shipley Company, L.L.C. Solder pads and method of making a solder pad
US20050056458A1 (en) * 2003-07-02 2005-03-17 Tsuyoshi Sugiura Mounting pad, package, device, and method of fabricating the device
FI123205B (fi) * 2008-05-12 2012-12-31 Imbera Electronics Oy Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi
JP5944690B2 (ja) * 2012-02-23 2016-07-05 京セラ株式会社 配線基板の製造方法
JP6101151B2 (ja) * 2013-05-22 2017-03-22 日東電工株式会社 回路付きサスペンション基板およびその製造方法
CN108702862B (zh) * 2016-02-19 2021-03-09 爱法组装材料公司 具有选择性集成焊料的rf屏蔽件
WO2020116240A1 (fr) * 2018-12-06 2020-06-11 株式会社村田製作所 Module et son procédé de fabrication

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3268653A (en) * 1964-04-29 1966-08-23 Ibm Printed circuit board with solder resistant coating in the through-hole connectors
US3568312A (en) * 1968-10-04 1971-03-09 Hewlett Packard Co Method of making printed circuit boards
US3576722A (en) * 1969-03-26 1971-04-27 Bendix Corp Method for metalizing ceramics
US3742597A (en) * 1971-03-17 1973-07-03 Hadco Printed Circuits Inc Method for making a coated printed circuit board
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法
US4546413A (en) * 1984-06-29 1985-10-08 International Business Machines Corporation Engineering change facility on both major surfaces of chip module
US4672739A (en) * 1985-04-11 1987-06-16 International Business Machines Corporation Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate

Also Published As

Publication number Publication date
EP0380289A3 (fr) 1991-07-17
EP0380289B1 (fr) 1997-09-10
JPH0632367B2 (ja) 1994-04-27
EP0380289A2 (fr) 1990-08-01
CA2008284C (fr) 1994-02-22
JPH02194691A (ja) 1990-08-01
US5061552A (en) 1991-10-29
DE69031394D1 (de) 1997-10-16

Similar Documents

Publication Publication Date Title
KR100326347B1 (ko) Ni-b도금층을가진c4기판접점패드
CA2115553A1 (fr) Sorties deformables revetues
CA2046202A1 (fr) Methode de fabrication de circuits integres
DE3262203D1 (en) Component assembly including a rigid substrate
JPH0440878B2 (fr)
MY117368A (en) A resistor and its manufacturing method
CA2008284A1 (fr) Substrat de ceramique avec barrage de soudure sur le modele de connexion
EP0394588A3 (fr) Borne à souder
CA2173739A1 (fr) Metallisation de mini-allumeurs par serigraphie avec des metaux actifs
CA2214130A1 (fr) Ensembles de substrats et de composants electroniques
EP0084464A3 (fr) Connecteur pour sous-assemblages électroniques
TW343426B (en) Process for producing a circuit board at least having a metal layer, circuit board thereof and its use
US4967042A (en) System for enhancing current carrying capacity of printed wiring board
US5132864A (en) Printed circuit board
JPH01135663U (fr)
EP0797266A3 (fr) Filtre diélectrique et procédé de fabrication
JPS6417491A (en) Formation of conductor of ceramic wiring board
MY113963A (en) Method of soldering lead terminal to substrate
JP2743524B2 (ja) 混成集積回路装置
JPH03269961A (ja) 低背型コネクタ
JPS57190341A (en) Circuit borad composition
JPH0395677U (fr)
SU1185664A1 (ru) Конструкци соединени керамической подложки с корпусом прибора
JPS56101752A (en) Semiconductor device
EP0269063A3 (fr) Substrat multi-couche en céramique mullite et procédé pour sa fabrication

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed
MKLA Lapsed

Effective date: 20030122