CA2012670A1 - Film multicouche et stratifie utilises dans la fabrication des cartes de circuits imprimes - Google Patents

Film multicouche et stratifie utilises dans la fabrication des cartes de circuits imprimes

Info

Publication number
CA2012670A1
CA2012670A1 CA2012670A CA2012670A CA2012670A1 CA 2012670 A1 CA2012670 A1 CA 2012670A1 CA 2012670 A CA2012670 A CA 2012670A CA 2012670 A CA2012670 A CA 2012670A CA 2012670 A1 CA2012670 A1 CA 2012670A1
Authority
CA
Canada
Prior art keywords
pounds
width
printed circuit
multilayer film
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2012670A
Other languages
English (en)
Other versions
CA2012670C (fr
Inventor
Stephen M. Imfeld
Randall S. Shipley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of CA2012670A1 publication Critical patent/CA2012670A1/fr
Application granted granted Critical
Publication of CA2012670C publication Critical patent/CA2012670C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide
    • Y10T428/3175—Next to addition polymer from unsaturated monomer[s]
    • Y10T428/31757—Polymer of monoethylenically unsaturated hydrocarbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y10T428/31797—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31913—Monoolefin polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesive Tapes (AREA)

Abstract

Pellicule multicouche dont l'une des couches de surface est une couche de support contenant une résine thermoplastique, apte à supporter des températures allant jusqu'à 200 degrés C sans ramollir; l'autre couche de surface est un couche adhésive à base d'une résine thermoplastique, dont le point de fusion se situe dans une plage de 100-200 degrés C. On peut, facultativement, utiliser une couche de liaison entre la couche de support et la couche adhésive. La pellicule multicouche est utile comme feuille protectrice de transport pour les substrats métalliques destinés à la production de plaquettes de circuits imprimés. La feuille protectrice assure temporairement une protection de surface pelable pour le substrat métallique, empêchant ainsi la contamination et l'altération physique du substrat aussi bien avant que pendant la formation de ces plaquettes de circuits imprimés. L'adhérence de la feuille protectrice au substrat métallique, mesurée à l'aide d'un essai de pelage à 180 degrés, est inférieure à 0,4 lb/po de largeur, et supérieure à 0,005 lb/po de largeur (0,18 à 0,002 kg/2,54 cm de largeur), et préférablement inférieure à 0,1 lb/po de largeur et supérieure à 0,01 lb/po de largeur (0,05 à 0,005 kg/2,54 cm de largeur).
CA002012670A 1989-03-22 1990-03-21 Film multicouche et stratifie utilises dans la fabrication des cartes de circuits imprimes Expired - Fee Related CA2012670C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/326,931 US5057372A (en) 1989-03-22 1989-03-22 Multilayer film and laminate for use in producing printed circuit boards
US326,931 1989-03-22

Publications (2)

Publication Number Publication Date
CA2012670A1 true CA2012670A1 (fr) 1990-09-22
CA2012670C CA2012670C (fr) 1999-04-27

Family

ID=23274380

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002012670A Expired - Fee Related CA2012670C (fr) 1989-03-22 1990-03-21 Film multicouche et stratifie utilises dans la fabrication des cartes de circuits imprimes

Country Status (10)

Country Link
US (1) US5057372A (fr)
EP (1) EP0464144B1 (fr)
JP (1) JP3142554B2 (fr)
KR (1) KR0168034B1 (fr)
AT (1) ATE156420T1 (fr)
CA (1) CA2012670C (fr)
DE (1) DE69031216T2 (fr)
DK (1) DK0464144T3 (fr)
ES (1) ES2104603T3 (fr)
WO (1) WO1990011182A1 (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5178924A (en) * 1991-06-17 1993-01-12 Minnesota Mining And Manufacturing Company Release liner
US5413838A (en) * 1991-06-18 1995-05-09 Sumitomo Bakelite Company Limited Both-side roughened copper foil with protection film
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
US5858550A (en) * 1997-02-06 1999-01-12 Alliedsignal Inc. High temperature release films
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6183880B1 (en) * 1998-08-07 2001-02-06 Mitsui Mining & Smelting Co., Ltd. Composite foil of aluminum and copper
US6770380B2 (en) 1998-08-11 2004-08-03 Nikko Materials Usa, Inc. Resin/copper/metal laminate and method of producing same
WO2000018555A1 (fr) 1998-10-01 2000-04-06 Airtech International, Inc. Procede de moulage ou de durcissement d'une matiere de resine a des temperatures elevees au moyen d'un film de separation multicouche
US6372364B1 (en) 1999-08-18 2002-04-16 Microcoating Technologies, Inc. Nanostructure coatings
JP4300687B2 (ja) * 1999-10-28 2009-07-22 味の素株式会社 接着フィルムを用いた多層プリント配線板の製造法
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
US6921451B2 (en) * 2002-06-28 2005-07-26 Metallized Products, Inc. Method of and apparatus for protecting thin copper foil and other shiny substrates during handling and rigorous processing, as pcb manufacture and the like, by electric-charge adherence thereto of thin release-layered plastic films and the like, and improved products produced thereby
US6638607B1 (en) * 2002-10-30 2003-10-28 International Business Machines Corporation Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
WO2004060033A1 (fr) * 2002-12-24 2004-07-15 Sentrex Company Produit multicouche pour fabriquer des cartes de circuits imprimes
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
AU2004281270B2 (en) * 2003-10-17 2010-05-06 E.I. Dupont De Nemours And Company Adhesion of foil to thermoplastic polymers
JP4436803B2 (ja) 2003-12-26 2010-03-24 積水化学工業株式会社 離型フィルム
US8129009B2 (en) * 2004-04-13 2012-03-06 E. I. Du Pont De Nemours And Company Composition comprising ethylene copolymer
US20060222796A1 (en) * 2005-04-04 2006-10-05 Morris Barry A Structure comprising metallized film and ethylene copolymer
EP2191701B1 (fr) 2007-09-28 2013-03-20 Tri-Star Laminates, Inc. Feuille d'entrée, son procédé de fabrication et procédés de perçage de trous dans des cartes à circuit imprimé
CN101457128A (zh) * 2007-12-14 2009-06-17 3M创新有限公司 复合高温胶带及其制造方法
DE102009054435A1 (de) 2009-11-25 2011-05-26 Kechter, Andreas, Dipl.-Ing. Heizbarer Gassensor und Verfahren zu dessen Herstellung
KR101234974B1 (ko) * 2011-03-07 2013-02-20 (주)인터플렉스 연성인쇄회로기판 커버레이 적층용 이형필름
WO2013142552A1 (fr) 2012-03-21 2013-09-26 Bayer Materialscience Ag Procédés de fabrication de rouleau à rouleau pour la production de dispositifs à polymère électroactif autoréparant
TW201403899A (zh) 2012-04-12 2014-01-16 Bayer Materialscience Ag 具有改良性能之ｅａｐ傳感器
TW201429864A (zh) 2012-08-16 2014-08-01 拜耳智慧財產有限公司 輥軋及順應性介電彈性致動器
TW201436311A (zh) * 2012-10-16 2014-09-16 拜耳智慧財產有限公司 金屬化介電膜之方法
US9889628B2 (en) 2013-11-18 2018-02-13 Hyundai Motor Company Low specific gravity and high stiffness sandwich type steel sheet and method for manufacturing the same
KR102055523B1 (ko) * 2019-05-23 2019-12-12 임용범 플라스틱 소재 열성형공정용 보호테이프, 이 보호테이프의 제조방법 및, 이 보호테이프을 이용한 플라스틱 소재의 열성형방법

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544662A (en) * 1966-11-02 1970-12-01 Celanese Corp High-melting polymer compositions comprising a 3-methyl-1-butene polymer and another polyolefin
JPS5517507B2 (fr) * 1972-06-29 1980-05-12
US3892900A (en) * 1972-11-02 1975-07-01 Daicel Ltd Masking films
JPS5278069A (en) * 1975-12-24 1977-07-01 Fuji Kinzoku Kakou Kk Printed circuit board
US4182457A (en) * 1976-08-10 1980-01-08 Toyo Seikan Kaisha Limited Multilayer container
CH613152A5 (en) * 1976-08-13 1979-09-14 Uop Inc Process for producing a metallised laminate
US4241129A (en) * 1978-12-15 1980-12-23 The Dow Chemical Company Delamination resistant multilayer metal/polymer composites
NL189499C (nl) * 1978-12-18 1993-05-03 Asahi Chemical Ind Werkwijze voor het vervaardigen van een vel of film, alsmede verpakking.
JPS56111637A (en) * 1979-08-22 1981-09-03 Hitachi Chem Co Ltd Production of adhesive-coated laminated sheet
US4386991A (en) * 1980-02-18 1983-06-07 Mitsui Petrochemical Industries, Ltd. Method of bonding 4-methyl-1-pentene polymers
US4455181A (en) * 1980-09-22 1984-06-19 General Electric Company Method of transfer lamination of copper thin sheets and films
JPS5758396A (en) * 1980-09-25 1982-04-08 Kanegafuchi Chemical Ind Method of producing metal foil lined laminated board
JPS5770653A (en) * 1980-10-22 1982-05-01 Mitsubishi Gas Chemical Co Manufacture of laminated board
JPS5770654A (en) * 1980-10-22 1982-05-01 Mitsubishi Gas Chemical Co Manufacture of laminated board
DE3116078A1 (de) * 1981-04-22 1983-01-20 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen "praegefolie"
JPS58128846A (ja) * 1982-01-26 1983-08-01 東芝ケミカル株式会社 ポリイミド系樹脂片面銅張積層板の製造方法
JPS6028442A (ja) * 1983-07-26 1985-02-13 Mitsui Petrochem Ind Ltd ポリ４−メチル−１−ペンテンフイルム
US4617207A (en) * 1983-08-15 1986-10-14 Mitsui Toatsu Chemicals, Incorporated Thermoplastic resin sheet
IL73386A0 (en) * 1984-01-09 1985-01-31 Stauffer Chemical Co Transfer laminate and method of forming an electrical circuit pattern therewith
US4690845A (en) * 1984-02-22 1987-09-01 Gila River Products, Inc. Method and apparatus for laminating flexible printed circuits
US4857400A (en) * 1984-02-22 1989-08-15 Gila River Products, Inc. Stratiform press pads and methods for use thereof in laminating flexible printed circuits
US4604324A (en) * 1984-09-28 1986-08-05 Mobil Oil Corporation Multi-layer polypropylene film structure and method of forming the same
US4753847A (en) * 1984-10-01 1988-06-28 Martin J. Wilheim Mold release sheet laminate
US4883718A (en) * 1985-02-12 1989-11-28 Mitsui Toatsu Chemicals, Inc. Flexible copper-clad circuit substrate
US4861648A (en) * 1988-03-14 1989-08-29 Gila River Products, Inc. Materials for laminating flexible printed circuits
CA1296833C (fr) * 1988-04-05 1992-03-03 Erica Marie-Jose Besso Feuille de demoulage en polymethylpentene
JPH0325996A (ja) * 1989-06-23 1991-02-04 Nitto Boseki Co Ltd 射出成形プリント配線板用転写シート及びその製造方法

Also Published As

Publication number Publication date
ES2104603T3 (es) 1997-10-16
ATE156420T1 (de) 1997-08-15
EP0464144B1 (fr) 1997-08-06
KR0168034B1 (ko) 1999-01-15
EP0464144A4 (en) 1992-04-01
JPH04506584A (ja) 1992-11-12
CA2012670C (fr) 1999-04-27
US5057372A (en) 1991-10-15
DE69031216D1 (de) 1997-09-11
EP0464144A1 (fr) 1992-01-08
DK0464144T3 (da) 1998-03-16
WO1990011182A1 (fr) 1990-10-04
JP3142554B2 (ja) 2001-03-07
DE69031216T2 (de) 1998-02-05
KR920700106A (ko) 1992-02-19

Similar Documents

Publication Publication Date Title
ATE156420T1 (de) Mehrschichtiger film und laminat zur verwendung bei der herstellung von gedru- ckten schaltungsplatten
CA2044614A1 (fr) Adhesif autocollant enlevable
MX168109B (es) Pelicula de multiples capas con mejor adhesion de capa
LV10219B (en) Multilayer material with diffraction structural layer and method of protection of certificate
ATE88590T1 (de) Ultraduenne chemisch widerstandsfaehige markierung und verfahren zur herstellung einer solchen.
CA2128347A1 (fr) Etiquette autocollante et ruban adhesif biodegradables
DK292889A (da) Fremgangsmaade til fremstilling af et polymer/metal/polymer-laminat, lamineret metalfolie og beholder eller en komponent til samme fremstillet af saadan metalfolie
EP0242655A3 (en) Colour-proofing sheet and production process
DE3560584D1 (en) Adhesive tape
EP0789051A3 (fr) Film de polyester adhérent laminé
NZ214022A (en) Laminate structure comprising crystalline propylene resin substrate and crystalline propylene polymer heat sealable layer; crystalline propylene polymer composition
CA2192323A1 (fr) Methode de fabrication d'un stock de ruban destine a produire des pattes de fixation pour articles absorbants jetables
TWI265189B (en) Adhesive tape for temporary-attachment of green sheets for ceramic electronic devices and method for producing ceramic electronic devices
JPS55152775A (en) Pressure-sensitive double-side adhesive tape
DE3751496D1 (de) Verfahren und vorrichtung zur herstellung von gedruckten leiterplatten.
JPS6482931A (en) Resin-coated metallic sheet and manufacture thereof
JPS5761595A (en) Transfer sheet
JPS5610579A (en) Adhesive material having back-release property
JPS5424951A (en) Double-coated adhesive tape, sheet, or film
JPS5761592A (en) Transfer sheet
JPS56121732A (en) Manufacture of ornamental body
JPS5457580A (en) Solvent adsorbing laminated film
FR2300841A1 (fr) Supports provisoires et leur procede de fabrication
JPS5311931A (en) Method of laminating surface material in the production of corrugated board for interior
JPS57205470A (en) Manufacture of adhesive film

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed
MKLA Lapsed

Effective date: 20010321