CA2027528A1 - Circuit integre - Google Patents
Circuit integreInfo
- Publication number
- CA2027528A1 CA2027528A1 CA2027528A CA2027528A CA2027528A1 CA 2027528 A1 CA2027528 A1 CA 2027528A1 CA 2027528 A CA2027528 A CA 2027528A CA 2027528 A CA2027528 A CA 2027528A CA 2027528 A1 CA2027528 A1 CA 2027528A1
- Authority
- CA
- Canada
- Prior art keywords
- integrated circuit
- fet
- conductivity type
- depletion
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000012535 impurity Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/84—Combinations of enhancement-mode IGFETs and depletion-mode IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
- H10D64/668—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers the layer being a silicide, e.g. TiSi2
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Logic Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2105038A JPH0348460A (ja) | 1989-04-21 | 1990-04-20 | 集積回路 |
| JP105038/1990 | 1990-04-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2027528A1 true CA2027528A1 (fr) | 1991-10-21 |
| CA2027528C CA2027528C (fr) | 2000-09-05 |
Family
ID=14396840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002027528A Expired - Fee Related CA2027528C (fr) | 1990-04-20 | 1990-10-12 | Circuit integre |
Country Status (3)
| Country | Link |
|---|---|
| CA (1) | CA2027528C (fr) |
| FR (1) | FR2661277B1 (fr) |
| GB (1) | GB2243948B (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW444257B (en) | 1999-04-12 | 2001-07-01 | Semiconductor Energy Lab | Semiconductor device and method for fabricating the same |
| JP5487034B2 (ja) * | 2010-07-20 | 2014-05-07 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
| KR102528205B1 (ko) * | 2018-06-26 | 2023-05-03 | 에스케이하이닉스 주식회사 | 매립 채널 어레이 트랜지스터를 포함하는 극저온 반도체 소자 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5145438B1 (fr) * | 1971-06-25 | 1976-12-03 | ||
| JPS4952980A (fr) * | 1972-09-22 | 1974-05-23 | ||
| JPS56165358A (en) * | 1980-05-23 | 1981-12-18 | Nec Corp | Semiconductor device |
| JPS56165359A (en) * | 1980-05-23 | 1981-12-18 | Nec Corp | Semiconductor device |
| JPS5925273A (ja) * | 1982-08-03 | 1984-02-09 | Toshiba Corp | 半導体装置及びその製造方法 |
| US4605947A (en) * | 1983-03-07 | 1986-08-12 | Motorola Inc. | Titanium nitride MOS device gate electrode and method of producing |
| JPS61137317A (ja) * | 1984-12-10 | 1986-06-25 | Agency Of Ind Science & Technol | 半導体装置用電極材料 |
| JPS6254960A (ja) * | 1985-09-04 | 1987-03-10 | Nec Corp | Mis形電界効果トランジスタ |
| JPS62219966A (ja) * | 1986-03-22 | 1987-09-28 | Toshiba Corp | 半導体装置 |
| CA2014296C (fr) * | 1989-04-21 | 2000-08-01 | Nobuo Mikoshiba | Circuit integre |
-
1990
- 1990-10-05 GB GB9021721A patent/GB2243948B/en not_active Expired - Fee Related
- 1990-10-12 CA CA002027528A patent/CA2027528C/fr not_active Expired - Fee Related
- 1990-10-24 FR FR9013196A patent/FR2661277B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FR2661277B1 (fr) | 1993-03-12 |
| CA2027528C (fr) | 2000-09-05 |
| GB9021721D0 (en) | 1990-11-21 |
| GB2243948A (en) | 1991-11-13 |
| GB2243948B (en) | 1994-06-08 |
| FR2661277A1 (fr) | 1991-10-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |